PRECONDITION Search Results

Contextual Info: Ami 0415 1024 x 1 IMOX ECL Bipolar RAM Fast access time 8 ns typ. — improves system cycle Outputs preconditioned during write cycle eliminating write recovery glitch Emitter follower outputs — easy wire-ORing Power dissipation decreases with increasing tempera­

27LS00

Abstract: 27LS01 27LS00 RAM Am27LS
Contextual Info: Am27LS00/01 Series 256-Bit Low-Power Schottky Bipolar RAM > 3 DISTINCTIVE CHARACTERISTICS • • High Internal ECL circuitry for optimum speed/power perfor­ mance over voltage and temperature • Output preconditioned during write to eliminate the write

SN54FB2033

Abstract: SN74FB2033A
Contextual Info: SN54FB2033, SN74FB2033A 8-BIT TTL/BTL REGISTERED TRANSCEIVERS S C BS174G - N O VEM BER 1991 - REVISED N O VEM BER 1996 Compatible With IEEE 1194.1-1991 BTL Standard B-Port Biasing Network Preconditions the Connector and PC Trace to the BTL High-Level Voltage

EHP-A09K-S5TC-S3000CADAE1K-1T8-AM

Abstract: J-STD-020D
Contextual Info: Technical Data Sheet Advanced Power Top View LEDs EHP-A09K-S5TC-S3000CADAE1K-1T8-AM Lead Pb Free Product - RoHS Compliant Applications Feattures P-LCC-6 package. Small package with high efficiency. Colorless clear resin. Wide viewing angle 120o. Precondition: Bases on JEDEC J-STD

EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM

Abstract: TCX 0413
Contextual Info: Technical Data Sheet Advanced Power Top View LEDs EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM Lead Pb Free Product - RoHS Compliant Applications Feattures P-LCC-6 package. Small package with high efficiency. Colorless clear resin. Wide viewing angle 120o. Precondition: Bases on JEDEC J-STD

citizen diode

Contextual Info: Heat dissipation design is a precondition in order to maximize the performance of the LED. In this document, the data that is deemed necessary in the detailed heat dissipation structure of the products and the heat dissipation design of the lighting apparatus is provided as a reference for the appropriate thermal design.

P-18585

Abstract: DS1233
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-96 9644 A5 CARSEM DM635839AAA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

16875

Abstract: ds1232 P-16852 16876
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1232 Jan-96 9547 C1 ANAM, K. DN537172ABA 3.0µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-16818 READPOINT (Sample Size/No. of Fails)

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Apr-97 9712 M3 ANAM, K. DN507374ABY 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

an 17820

Abstract: DS2107A
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jul-96 9623 A6 ANAM, K. DN604282AAB1 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

P-20460

Abstract: 20461 DS2181A
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~

LTM4602

Abstract: LTM4600 LTM4601 15X15 0623 IPC-9701 IPC 9701 power one date code
Contextual Info: RELIABILITY DATA LTM4600 / LTM4601 / LTM4602 1/15/2007 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS 1 EQV to +100°C LGA 15X15 551 0452 0645 2,820,404 551 2,820,404 • J-STD-020 LEVEL 4 PRECONDITIONING4 (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)

DS2165

Abstract: APR97
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-97 9651 B1 HYUNDAI DL622720AAA 1.2µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~

Contextual Info: Marktech 0603 SMT LEDs Features Compatible with Automatic Placement Equipment Compatible with Infrared and Vapor Phase Reflow Solder Process IC Compatible Industry Standard 0603 Footprint JEDEC Preconditions Stress Tested Water Clear Lens Series Line−Up

DS12885

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Nov-95 9538 A2 ANAM, K. DN531869AAD1 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

21103

Abstract: transistor HR DS1267 p21105 HR 250 P21103 P-21105
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Nov-97 9737 A1 ANAM, PI. DK727730AAA 1.2µ OX/NI 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): 0 Hr

DS1267

Abstract: P-17298
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Apr-96 9612 A1 HYUNDAI DL603183AAL 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-17251 READPOINT (Sample Size/No. of Fails)

vehicle rain sensor

Abstract: PEC 726 UF1004FCT rain sensor "rain sensor" C167CR ISO-9141 iso 9141 driver rain sensor automotive ISO 9141 K line interface diesel control
Contextual Info: Automotive electronics The C167CR adds gateway functions to the automotive computer Another leap forward in the comfort, safety and serviceability of motor vehicles can be achieved only by combining individual controllers to create multifunctional units. The precondition for doing so is a

1754-3

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 May-96 9617 A2 HYUNDAI DL607533AAI 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: Implementing FIR Filters January 1996, ver. 1 Introduction in FLEX Devices Application Note 73 The finite impulse response FIR filter is used in many digital signal processing (DSP) systems to perform signal preconditioning, antialiasing, band selection, decimation/interpolation, low-pass filtering, and

74 HTC 08

Abstract: 74 HTC 00 P-20606
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-97 9737 A6 CARSEM DM718527ABB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

40 RH 304

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Oct-95 9544 A1 HYUNDAI DL508411AAK 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : 85°C/85% RH, 168 hours HTC Vapor Phase, 3 Passes

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS80C320 May-96 9613 B3 ANAM, K. DN602132AAB2 0.8µ OX/NI 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

18704

Abstract: P-18701
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):