PQFP CHIP SIZE Search Results

QFP minimum pitch size

Abstract: 5713
Contextual Info: Pomona Models 5711, 5713 & 5715 Pomona JEDEC Test Clips .025” Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the fine pitch plastic QFP chip leads. • Interfaces with high density JEDEC PQFP chip leads.

ks0164

Abstract: KS0174 KS0174-1M wavetable synthesizer 74LS245 buffer lcd LG TV KS0174-2M MA11 MPU401 MPU-401
Contextual Info: KS0164 MULTIMEDIA AUDIO OVERVIEW 100 PQFP The KS0164 wavetable synthesizer chip represents the state-of-the-art in multimedia audio technology. The KS0164 combines a high-quality 32-voice wavetable synthesizer, a powerful 16-bit CPU and an MPU-401 compatibility into a single chip. The audio performance

82c597

Abstract: 83C206 Cyrix 486 dx2 CX486 386DX CY82C597 intel 486 dx4 t324 amd 386 PC MOTHERBOARD diagram cyrix DX2
Contextual Info: PRELIMINARY CY82C597 386/486 Green Chip Set D Features Page mode DRAM controller supports mixture of 256KB/512KB/1MB/2MB/ 4MB/16MB devices D D MicrosoftR APM support 11 event detectors and 5 userĆdefined timers D D 160ĆPin single chip PQFP Supports PC/AT compatible systems

mt3351

Abstract: Cyrix 486 dx2 MT332 cyrix 486 Port70H 18L15 intel 486 dx4 386 MOTHERBOARD 82c597 cx486
Contextual Info: PRELIMINARY CYPRESS Features • 160-Pin single chip PQFP • Supports PC/AT compatible systems at 25/33/40/50 MHz • Supports AMD, Cyrix level 1 write­ back CPU • Write-Back/Write-Through cache with 32KB/64KB/128KB/256KB/512KB/ 1MB cache size • Non-cachable memory range support

0x053A

Abstract: 670mS KSZ8842-PMQL KSZ8842-PMQLI 2-port bridge fiber UTP RBS 3116
Contextual Info: KSZ8842-PMQL/PMBL 2-Port Ethernet Switch with PCI Interface Rev.1.5 General Description The KSZ8842-series of 2-port switches includes PCI and non-PCI CPU interfaces. This datasheet describes the KSZ8842-PMQL/PMBL PCI CPU interface chips. KSZ8842-PMQL is PQFP package chip, KSZ8842-PMBL

Contextual Info: KSZ8842-PMQL/PMBL 2-Port Ethernet Switch with PCI Interface Rev.1.5 General Description The KSZ8842-series of 2-port switches includes PCI and non-PCI CPU interfaces. This datasheet describes the KSZ8842-PMQL/PMBL PCI CPU interface chips. KSZ8842-PMQL is PQFP package chip, KSZ8842-PMBL

AD7339

Abstract: AD7339BS C3049 db products
Contextual Info: a 5 V Integrated High Speed ADC/Quad DAC System AD7339 FEATURES 8-Bit A/D Converter Two 8-Bit D/A Converters Two 8-Bit Serial D/A Converters Single +5 V Supply Operation On-Chip Reference Power-Down Mode 52-Lead PQFP Package FUNCTIONAL BLOCK DIAGRAM DVDD1

Contextual Info: ANALOG D E V IC E S 5 V Integrated High Speed ADC/Quad DAC System AD7339 FEATURES 8-Bit A /D Converter T w o 8-Bit D /A Converters T w o 8-Bit Serial D /A Converters Single +5 V Supply Operation On-Chip Reference Power-Down M ode 52-Lead PQFP Package FUNCTIONAL BLOCK DIAGRAM

7339

Contextual Info: ANALOG ► DEVICES 5 V Integrated High Speed ADC/Quad DAC System FUNCTIO NAL B L O C K DIAGRAM FEATURES 8-Bit A /D Converter Tw o 8-Bit D /A Converters Tw o 8-Bit Serial D /A Converters Single +5 V Supply Operation On-Chip Reference Pow er-Down Mode 52-Lead PQFP Package

plx 9054

Abstract: plxtechnology tp 9054 333CJ PLX PCI9054 eeprom d4x MPC8S PC19054 pci 9054 RELAY lad1
Contextual Info: PCI 9054 PCI I/O Accelerator November 1998 Version 1.0 l20 Compatible, CompactPCI Hot Swap Friendly PCI Bus Master Interface Chip _ for Adapters and Embedded Systems FEA TU R E S • 3.3V, 5V tolerant PCI and Local signaling supports Universal PCI Adapter designs, 3.3V core, lowpower CMOS in 176-pin PQFP and 225-pin PBGA

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

SOIC-36

Abstract: SOIC-36 300 resistor pack RISC and CISC
Contextual Info: AN-08: QSOP Packages for 32-Bit Buses Q QSOP Packages Provide High Density In 32-Bit Bus Design Application Note AN-08 QSOP Quarter Size SOIC Outline Package packages for high-speed logic such as the FCT family provide 2.5 to 3 times the packing density of the SOIC packages they replace. QSOPs in bus designs provide the

EPC16UI88

Abstract: PQFP-100 Package footprint Altera EPC
Contextual Info: Enhanced Configuration EPC Devices Datasheet CF52002-3.0 Datasheet This datasheet describes enhanced configuration (EPC) devices. Supported Devices Table 1 lists the supported Altera  EPC devices. Table 1. Altera EPC Devices Memory Size (bits) On-Chip

20P3

Abstract: MS-001 MS-011 MS-016 MS-018
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

m3230

Abstract: PQFP 176 Actel pdf on sram M3-2100 M32100 vq 44 quad flatpack 600 747 Actel part number M1020 M1225
Contextual Info: Actel Mask Programmed Gate Arrays Features • Available in commercial or industrial temperature ranges • Mask Programmed versions of Actel Field Programmable Gate Arrays FPGAs • PLCC, PQFP, VQFP, and TQFP packages available • Significant cost reduction for medium- to high-volume

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

c4460

Abstract: trans C3150 BC518 TI486DX4-100 LC51-50 C5380 TM2SP64GPU TMS320C2X TMS320C204 seagate
Contextual Info: EXTENDING YOUR REACHTM NORTH AMERICAN EDITION INTEGRATION AN UPDATE ON TEXAS INSTRUMENTS SEMICONDUCTORS VOL. 13 ▼ NO. 2 ▼ MARCH 1996 ThunderSWITCH meets bandwidth demands Spurred by rapid growth in the use of networked applications such as the Internet, groupware, client/server and

9560a

Abstract: epm tqfp-144 484 pin BGA diagram 144-Pin PLCC/TQFP Package Pin-Out Diagram EPM3128A 256 pin diagram 10k50 Power PQFP 64 Altera 7032 FLEX 6000 144-Pin PLCC/TQFP Package Pin-Out D
Contextual Info: ¨ Component Selector Guide June 1999 S System-on-a-ProgrammableChip Solutions In today’s changing marketplace, time-to-market is the key to success. Altera’s product offerings help companies get to market first by addressing a wide range of needs from simple glue logic requirements to the challenges

TTL Logic Family list

Abstract: PQFP 176
Contextual Info: Actel Mask Programmed Gate Arrays F e a tu re s • Available in comm ercial or industrial tem perature ranges • • PLCC, PQFP, VQFP, and TQFP packages available • • Significant cost reduction for medium- to high-volume applications Meets all internal worst-case FPGA perform ance

Contextual Info: VITESSE VSP945/VSP946 High Performance Pentium Processor Cache Controfhr with 148 Ó-Compa tibie System interface FEATURES • Optimizes 66 M Hz Pentium™ Processor Performance • Zero W ait States: 2-1-1-1 Read/W rite Back • Cache Sizes Supported: 128K, 256K, 512K,

TQFP 100 PACKAGE footprint

Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
Contextual Info: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch