PLCC-28 SMD Search Results

4560 SMD 8 PIN

Abstract: 52 PLCC socket pin configuration 84 PLCC socket PLCC socket pin configuration 84 PLCC pin configuration 30f24 plcc 32 socket 28 PLCC socket pin configuration PLCC-32LP PLCC pin configuration
Contextual Info: A Sockets for IC-PLCC 1,27 2,54 0,45 x 0,25 1,27 0,8 A2 D2 C art. no. D E PLCC PLCC PLCC PLCC PLCC PLCC PLCC no. of contacts 20 28 32 44 52 68 84 20 28 32 44 52 68 84 A1 D1 A1 B1 VPE 38 32 28 24 22 18 15 A2 D2 A2 B2 3 8,3 2,54 C A1 5.08 7.62 7.62 12.70 15.24

ECG transistor replacement guide book free

Abstract: 6v to 12v converter mini project ISA pressure transmitter data sheet SCR c106 PIN CONFIGURATION ZENER Diode b212 vhdl code 8 bit LFSR Project Report of fire alarm using IC 555 doc 12V convert to 3.7V vhdl code 16 bit LFSR sw dip-4
Contextual Info: C O M M U N I C AT I O N S P R O D U C T S S E L E C T O R G U I D E Device Number B212 B103 B202 CCITT V.21 CCITT V.23 CCITT V.22 CCITT V.22bis Description Power Supply Available Packages +5V +5V +5V +5V +5V 28 DIP, 28 PLCC 22 DIP 22, 28 DIP, 28 PLCC 22 DIP

Heatsinks

Abstract: WLFT 404 PLCC-28 SMD
Contextual Info: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for PLCC B C art. no. ICK R Rth [K/W] [mm] 19 D 12 E art. no. ICK PLCC 28 Rth [K/W] [mm] 25 F 11.8 G art. no. ICK CC 64 Rth [K/W] [mm] 17 17 H surface: black anodised I K L M H H H Thermal conduct. foil WLFT 404/405

c225 diode smd

Abstract: HA1111 7C225-35 88518 CY7C225
Contextual Info: CY7C225 CYPRESS SEMICONDUCTOR • • CMOS for optimum speed/power • High speed — 25 ns max set-up • Slim 300-mil, 24-pin plastic or her­ metic DIP, 28-pin LCC, or 28-pin PLCC floating gate technology and byte-w ide in­ telligent program m ing algorithm s.

c225 diode smd

Abstract: CY7C225-40DC CY7C225 JTs smd diode
Contextual Info: bSE D CYPRESS SEMI CONDUCTOR CVP 5S ö ^ b b 2 c m i a m s CY7C225 CYPRESS SEMICONDUCTOR • Slim 300-mil, 24-pin plastic or her­ metic DIP, 28-pin LCC, or 28-pin PLCC • 5V ±10% V cc, commercial and military • TTL-compatible I/O • Direct replacement for bipolar

Equivalent IR 740

Abstract: ELC-68
Contextual Info: Photodiode EPD-740-9-0.4 6/28/2007 Preliminary rev. 01/07 Wavelength Type Technology Case Infrared SMD AlGaAs/AlGaAs TOPLED Description 2,8 ± 0,2 2,2 ± 0,1 Selective photodiode mounted in TOPLED PLCC-2 package, for easy circuit board mounting and assembling of arrays. Narrow response range 740

Contextual Info: CY7C225 CYPRESS SEMICONDUCTOR • Slim 300-mil, 24-pin plastic o r h e r­ m etic DIP, 28-pin LCC, o r 28-pin PLCC • C M O S for op tim u m speed/pow er • High speed — 25 n s m ax set-up — 12 ns clock to o u tp u t floating gate technology and byte-wide intelligentprogram m ingalgorithm s.

Contextual Info: CY7C235A PRELIMINARY CYPRESS SEMICONDUCTOR • Features • CM OS for optimum speed/power • High speed — 18 ns max set-up — 12 ns clock to output IK x 8 Registered PROM Slim, 300-m il, 24-pin plastic or her­ m etic D IP or 28-pin LCC and PLCC • 5V ± 10% Vcc> commercial and

Contextual Info: Heatsinks for DIL-IC, PLCC and SMD H eatsinks for DIL-IC art. no. ICK 6 8 L ICK 14 16 L ICK 20 L art. no. ICK ICK ICK ICK ICK ICK 14 16 B 24 B 28 B 36 B 40 B 1000 B Imml fo r housings Rth [K/W] 6 /8 contacts 3.5 83 1 4 /1 6 contacts 1 9.0 46 2 0 contacts 2 5 .0

Contextual Info: CY7C235A PRELIMINARY SEMICONDUCTOR IK x 8 Registered PROM • Slim , 300-m il, 24-pin p lastic o r h e r­ m etic D IP o r 28-pin LCC an d PLCC Features • C M O S fo r o p tim u m speed/pow er • H igh speed — 18 n s m ax set-up — 1 2 n s clock to o u tp u t

PLCC-44 SMD

Abstract: plcc socket 84 PLCC PLCC-44-SMD plcc socket 32 PLCC PLCC-32-SMD
Contextual Info: Grafik DesignStudio Alexander Dietzel • Postfach 2127 • W-5880 Lüdenscheid SMD-Fassung für PLCC SMD-Sockets for PLCC Supports SMD pour PLCC B ±0,2 D ±0,2 A 0,5 4 1,27 C ±0,2 1,27 Q E SMD-Fassungen für PLCC Plastic Leaded Chip Carrier SMD-Sockets for PLCC

PLCC-44 SMD

Abstract: plcc socket 44 PLCC plcc socket 84 PLCC PLCC-32-SMD PLCC-28 SMD plcc 32 socket plcc 68 PLCC-44-SMD jedec package PLCC 32
Contextual Info: SMD-Fassung für PLCC SMD-Sockets for PLCC Supports SMD pour PLCC B ±0,2 D ±0,2 A 0,5 4 1,27 C ±0,2 1,27 Q SMD-Fassungen für PLCC Plastic Leaded Chip Carrier SMD-Sockets for PLCC (Plastic Leaded Chip Carrier) Supports SMD pour PLCC (Plastic Leaded Chip Carrier)

Contextual Info: A Sockets for IC-PLCC SMD sockets for PLCC - low profile housing B These sockets conform to EIA/JEDEC "A" package requirements for leaded plastic chip carriers. B ±0,2 D ±0,2 A C ±0,2 C Q 1,27 A 0,5 4 1,27 art. no. PLCC PLCC PLCC PLCC PLCC PLCC PLCC 20

PLC-068-442T-P

Abstract: PLCC SOCKET 52 PIN SMD PLC-068-442T 470FG lcc 28 socket Pc 614
Contextual Info: ADVANCED Surface Mount PLCC Sockets INTERCONNECTIONS ® 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 • Email advintcorp@aol.com • Internet http://www.advintcorp.com Surface Mount PLCC Sockets for SMD

74F126

Abstract: 74F154 16 line to 1 multiplexer IC 74F112 BCD adder and subtractor
Contextual Info: Philips Semiconduclors-Signetics FAST TTL Logic Series Availability Guide SE^ AVAILABILITY NO. OF DEVICE ° ^ PINS DESCRIPTION DIP SMD 74F00 14 Quad 2-Input NAND Gate A SO 74F02 14 Quad 2-Input NOR Gate A SO 74F04 14 Hex Inverter A 74F06 14 Hex Inverter Buffer/Driver OC

Heatsinks

Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Contextual Info: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK

smd transistor HX

Abstract: TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
Contextual Info: Ordering Nomenclature Guides 2 2-3 Elantec TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 5962 SMD/DSCC - QML TYPES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: Multiadapter for SMT RE460 - EPOXY fibre-glass FR4 1.50 mm, double-side 35 µm CU pth - chem. NI/AU and solder stop mask - through holes plated bores dia 1.00 mm - grid pitches from 0.50 mm to 1.27 mm - adaption board for 23 different SMD-IC´s - 0.500 mm Pitch: 64, 100 Pin

PSOP3-20

Abstract: EIA-481-1 5C smd 12MM 24MM EIA-481-2 EIA-481-3 MO-169 TB347
Contextual Info: Harris Semiconductor No. TB347 Harris Packaging January 1997 Tape and Reel Specification for Integrated Circuits Author: Laszlo Nemeth Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The

SMD CODE 9Z

Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
Contextual Info: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2

EIA-481-2

Abstract: EIA-481-3 MO-169 TB347 304 MQFP
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief June 1999 TB347.1 Author: Laszlo Nemeth Introduction • EIA-481-1-A . . . . . . . for the 8mm and 12mm Wide Tape Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The

QFP-100

Abstract: PLCC 144 qfp-64
Contextual Info: SMD Multiadapter RE460 - Epoxyd FR4 1,50 mm, zweiseitig 35 µm CU durchkontaktiert - chem. AU und Lötstoppmaske - Lochdurchmesser 1,00 mm - Rasterabstände von 0,50 mm bis 1,27 mm - Adaptionsplatine für 23 verschiedene SMD-IC´s - vorgeritzte Sollbruchstellen zum Trennen einzelner Module von der Platine

circuito

Abstract: plcc 68 aplicacion
Contextual Info: Multiadaptador SMD RE460 - epóxido FR4 1,50 mm, por dos lados 35 µm CU - lados de dos componentes con una superficie terminal quimica de niquel / oro aplicado - agujeros con contactos metalizados de Ø 1,00 mm - distancias entre los agujeros de la trama de 0,50 mm - 1,27 mm

AN-450 surface mounting methods

Abstract: PLCC20 SO16W SO20W SO24W SO28W VSO40 VSO56 SMD ic catalogue Packaging trends
Contextual Info: Issued July 1995 020-420 Data Pack H An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering