PLCC 68 INTEL PACKAGE DIMENSIONS Search Results

Contextual Info: PA51GB-68 Z Data Sheet 68 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Intel 87C51GB microcontroller in either PLCC or CLCC package can be programmed on 40 pin DIP programmers capable of programming an 87C52.

PLCC 68 intel package dimensions

Abstract: 240800 intel packaging handbook 240800 MCS-96 N80C196KR INTEL PLCC 68 dimensions n80c196 Intel mcs-40 MCS-51 intel 68 PLCC
Contextual Info: MCS -51 and MCS -96 Packaging Information November 1994 Order Number 272118-001 COPYRIGHT INTEL CORPORATION 1995 1 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

Contextual Info: l p 13« PIMMMGT [PIF3EWEW in te l. 80L188EA8 16-BIT HIGH INTEGRATION EMBEDDED PROCESSOR • 3V Operation, Vcc = 2.7V-5.5V ■ Full Static Operation ■ True CMOS Inputs and Outputs Integrated Feature Set — Static 186 CPU Core — Power Save, Idle and Powerdown

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

EN80C186XL20

Abstract: EE80C186XL20 cross-reference es80C186XL20 es80C188 EE80C186XL20 EE80C188XL20 EE80C186XL12 IA188XLPLC68IR1 N80C186XL12 EE80C188XL12
Contextual Info: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet January 15, 2010 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-04 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 74 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL

ST16C554DCJ68-F

Contextual Info: ST16C554 -Quad UART with 16-Byte FIFOs HomeNewsCareers Investor Relations Contact Us PartnerNet Login Search CommunicationsInterfacePower Management ST16C554 Support Info Request How to Order Samples How to Buy Print this page Quad UART with 16-Byte FIFOs

EXAR ST16C654

Contextual Info: ST16C554/554D 2.97V TO 5.5V QUAD UART WITH 16-BYTE FIFO JUNE 2006 REV. 4.0.1 GENERAL DESCRIPTION FEATURES The ST16C554/554D 554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable receive FIFO trigger levels and data rates of up to 1.5

Contextual Info: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet June 30, 2011 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-08 UNCONTROLLED WHEN P RINTED OR COPIED Page 1 of 75 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

29f040b

Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Contextual Info: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3

st16c554dcj

Contextual Info: ST16C554/554D 2.97V TO 5.5V QUAD UART WITH 16-BYTE FIFO APRIL 2006 REV. 4.0.0 GENERAL DESCRIPTION FEATURES The ST16C554/554D 554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable receive FIFO trigger levels and data rates of up to 1.5

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

MCS-96

Abstract: 240800 intel packaging handbook 240800 PLCC 68 intel package dimensions intel HANDBOOK MCS-51 MCS 48 Intel 100 pin PQFP dimension mcs 96 rohs MCS-96 datasheet
Contextual Info: MCS -51 and MCS ®-96 Packaging Information July 2004 Order Number: 272118-002 1 COPYRIGHT INTEL CORPORATION: 2004 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in

en80l188eb13

Abstract: ts80c188eb20
Contextual Info: IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet March 29, 2009 IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet IA211080314-03 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 80 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186EB/IA188EB

ia188eb

Contextual Info: IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet June 12, 2011 IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet IA211080314-11 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 84 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186EB/IA188EB

en80c188eb20

Abstract: es80c188eb20 EN80C188EB13 EE80C188EB25 es80C188 YW80C186EB25 EN80C188EB-20 EN80C186EB13 IA211080314-08 circuit diagram TN80C188EB20
Contextual Info: IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet September 4, 2009 IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet IA211080314-08 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 84 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186EB/IA188EB

Contextual Info: IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers As of Production Ver. 00 April 2008 PRELIMINARY IA186EB/IA188EB 8-Bit/16-Bit Microcontrollers Data Sheet PRELIMINARY Document Version 1.2 April 2008 Copyright 2008 ENG211080314-02 Page 1 of 67 www.Innovasic.com

XR16V554IV-F

Contextual Info: XR16V554 -2.25V to 3.6V Quad UART with 16-Byte FIFO HomeNewsCareers Investor Relations Contact Us PartnerNet Login Search CommunicationsInterfacePower Management XR16V554 Support Info Request How to Order Samples How to Buy Print this page 2.25V to 3.6V Quad UART with 16-Byte FIFO

SC16C554B

Abstract: XR16V554IV 16-BYTE 16C550 ST16C454 ST16C554 TL16C554A XR16V554 d7522 RXB38
Contextual Info: XR16V554/554D 2.25V TO 3.6V QUAD UART WITH 16-BYTE FIFO MAY 2007 REV. 1.0.1 GENERAL DESCRIPTION FEATURES • Pin-to-pin compatible with ST16C454, ST16C554, The XR16V554 V554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable

Contextual Info: XR16V554/554D 2.25V TO 3.6V QUAD UART WITH 16-BYTE FIFO JANUARY 2007 REV. 1.0.0 GENERAL DESCRIPTION FEATURES • Pin-to-pin compatible with ST16C454, ST16C554, The XR16V554 V554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable