PLASTIC PIN GRID ARRAY PACKAGING Search Results

Matthey

Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

80C51

Abstract: TMS320C50 scl* by national TMS320C50 architecture
Contextual Info: N Customizable Solutions – ASIC N Customizable Solutions – ASIC Table of Contents National Semiconductor offers customizable “systems-on-a-chip” solutions to all process flows and extensive packaging options. A unique competency-based alliance with Cadence Design Systems and Aspec Technology

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

PLL WITH VCO 4046 appli note philips

Abstract: CD74HC4050 marking microstar ms 4011 CI 40106 8952 microcontroller ic 4017 decade counter datasheet ic HC 4066 AG GK 7002 7 SEGMENT DISPLAY LT 543 PIN CONFIGURATION LA 4508 as af power amplifier
Contextual Info: LOGIC OVERVIEW 1 PRODUCT INDEX 2 FUNCTIONAL CROSS−REFERENCE 3 DEVICE SELECTION GUIDE 4 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2004 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

74LS series logic gates 3 input or gate

Abstract: sn74 series TTL logic gates list 4017 counter IC datasheet data sheet ic 4017 IC CD 4033 pin configuration CMOS Data Book Texas Instruments Incorporated 74LS series logic gates hp 4514 TEXAS INSTRUMENTS SN7400 SERIES ic 4026 down counter
Contextual Info: LOGIC OVERVIEW 1 FOCUS ON THE IDEAL LITTLE LOGIC SOLUTION 2 FUNCTIONAL INDEX 3 FUNCTIONAL CROSSĆREFERENCE 4 DEVICE SELECTION GUIDE 5 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2002 IMPORTANT NOTICE

Contextual Info: PARADIGM Module Packaging Advanced Packaging Advances in packaging techniques permit a wide variety of solutions to board space problems. M odules are comprised of individual semiconductor devises with other support devises, such as decoders and capacitors

XC95288XL-10PQG208I

Abstract: XC95288XL-10TQ144I XC95288XL-10PQG208C XC95288XL XC95288XL-10TQG144C XAPP114 XAPP427 XC9500XL XC95288 xc95288xl-7fg256c
Contextual Info: XC95288XL High Performance CPLD DS055 v1.8 July 15, 2004 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 user I/O pins)

JESD51-9

Abstract: TFLGA AN 7823 JESD51-2
Contextual Info: FLGA Fine Pitch Land Grid Array • Array molded, cost effective, space-saving packaging solution • Available in 1.20mm TFLGA , 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness • Thinner than FBGA • Exposed thermal/mechanical lands available • Laminate substrate based enabling 2 and 4

EIAJ 8 pin

Abstract: AT25256 AT25128-10CC-1.8 AT25128 X101 X110 8S2 EIAJ SOIC
Contextual Info: Features • Serial Peripheral Interface SPI Compatible • Supports SPI Modes 0 (0,0) and 3 (1,1) • Low-voltage and Standard-voltage Operation • • • • • • • • – 5.0 (VCC = 4.5V to 5.5V) – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 3.6V)

BMA16X16

Contextual Info: SI GE C P L E S S E Y MARCH 1997 S E M I C O N D U C T O R S CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. Improvements in design combined with

8S1 SOIC 8 pin LAND PATTERN

Abstract: atmel 0713 AT93C56B FOOTPRINT MO-229 2X3 SOLDERING
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

Contextual Info: ISSI IS61LV12824 128K x 24 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • High-speed access time: 8, 10 ns • CMOS low power operation — 756 mW max. operating @ 8 ns — 36 mW (max.) standby @ 8 ns • TTL compatible interface levels • Single 3.3V power supply

APA075

Abstract: CCGA FBGA-484 datasheet APA1000 APA150 APA300 APA450 APA600 APA750 FG256
Contextual Info: Product Brief TM ProASICPLUS Flash Family FPGAs Features and Benefits • High Capacity High Performance Routing Hierarchy Commercial and Industrial • • • • • • • 75,000 to 1 Million System Gates 27 k to 198 kbits of Two-Port SRAM 66 to 712 User I/Os

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

smd marking g8

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet June 16, 2006 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

Actel

Abstract: CMOS OR Gates vq 44 quad flatpack 44 pin actel
Contextual Info: Addendum Accelerator Series FPGAs – ACT 3 Family The Ordering Information was updated to include RoHS information. A114100 A _ 1 RQ G 208 C Application Temperature Range C = Commercial (0 to +70˚C) I = Industrial (–40 to +85˚C) M = Military (–55 to +125˚C)

tai 24c04

Abstract: AT24C02-10TU-1 AT24C16B atmel 24c04 ATMEL 24C08A AT24C16A-10TU-2.7 atmel 24c02 AT24C01A AT24C08AY1 AT24C02
Contextual Info: Features • Low-voltage and Standard-voltage Operation • • • • • • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K)

atmel 811 24c02

Abstract: 24c02 atmel atmel 24c04 ATMEL 24C08A 24C02 sot atmel 24c04 pin configuration SL719 AT24C16A AT24C08AY1 24C02
Contextual Info: Features • Low-voltage and Standard-voltage Operation • • • • • • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K)

AT24C16C

Abstract: sot23-8 code book JEDEC MO-229 atmel
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • • • • • • – 1.8 VCC = 1.8V to 5.5V Internally Organized 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression

54SX72

Abstract: A54SX32APQ FBGA-484 A54SX16A THERMAL Fuse m20 tf 115 c PAR64 REQ64 A54SX08A A54SX16 A54SX32A
Contextual Info: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin

SPH-002T-P0.5S

Abstract: motorolla processor DSP56000 DSP56300 DSP56307 DSP56L307
Contextual Info: Order Number EB361/D: Rev. 1, 3/2001 MOTOROLA Semiconductor Products Sector Engineering Bulletin Functional Differences Between the Motorola DSP56307 and DSP56L307 The DSP56307 and DSP56L307, two members of the Motorola DSP56300 family of programmable digital signal processors

ra1613

Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
Contextual Info: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations

ibm ASIC SRAM

Abstract: IBM "embedded dram" IBM supports ccga
Contextual Info: Standard cell/gate array ASIC for high-function, high-density applications Blue Logic Cu-11 ASIC Highlights 0.11-µm L drawn enables designs of up to 40 million gates Advanced technologies include copper metallurgy and low-k dielectric Choice of packaging options

thermal printer 2 inch

Abstract: hermetic packages PCB land Solder paste stencil life IPC-A610A paste profile pcb board pin in paste X-RAY INSPECTION RT1400B6 SN63
Contextual Info: Note Number AN-C1-PCAG-A Printed Circuit Assembly Guidelines PRINTED CIRCUIT ASSEMBLY GUIDELINES APPLICATION NOTE INTRODUCTION Use of industry leading circuit deposition methods and equipment enables us to provide the highest packaging density and reliability while eliminating