PLASTIC MOLD PACKAGE Search Results

PCN0602

Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad

MGF4714AP

Contextual Info: MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4714AP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714AP low-noiseHEMT High Electron Mobili­ ty Transistor is designed for use in X band amplifiers. The plastic mold package offer high cost performance,

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

PCN0516

Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA

MA 17358

Abstract: B/TDA 16840
Contextual Info: O K I electronic components KGF1312_ Power FET for UHF-Band Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1312, housed in an SOT-89 type plastic-mold package, is a discrete UHF band power FET that features high efficiency and high output power. The KGF1312 specifications are

low noise hemt transistor

Abstract: MGF4714CP InGaAs HEMT mitsubishi
Contextual Info: MITSUBISHI SEMICONDUCTOR GaAs FET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714CP low-noise HEMT High Electron Mobility OUTLINE DRAWING Unit:millimeters (0.6 Transistor) is designed for use in L to Ku band amplifiers. 1 The plastic mold package offer high cost performance, and has a

Contextual Info: O K I electronic components KGF1323 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1323, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency and high output power. The KGF1323 specifications are

GM 2310 A

Abstract: low noise hemt transistor MGF4714CP L to Ku GAAS L to Ku band amplifiers transistor GC 40103 HEMT
Contextual Info: MITSUBISHI SEMICONDUCTOR GaAs FET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714CP OUTLINE DRAWING low-noise HEMT(High Electron Unit:m illim eters Mobility Transistor) is designed for use in L to Ku band amplifiers. The plastic mold package offer high cost performance, and has a

Contextual Info: O K I electronic components KGF1283_ Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1283, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency, high output power, and high gain. The KGF1283 specifications

Contextual Info: AU K CORP. Photo Transistor KDT3001A Description The KDT3001A is a high-sensitivity NPN silicon phototransistor mounted in 3mm T-1 all plastic mold type. Pin Connection 1. Emitter 2. Collector Features 3mm(T-1) all plastic mold type Colorless transparency lens

c 1181 H

Abstract: lD-10mA
Contextual Info: MITSUBISHI SEMICONDUCTOR GaAs F ET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION T he M GF4714CP OUTLINE DRAWING low-noise HEMT(High Electron Unit:millimeters Mobility T ransistor) is designed for use in L to Ku band amplifiers. T he plastic mold package offer high cost performance, and has a

container

Contextual Info: PLASTIC TUBE DIMENSIONS 2. PLASTIC TUBE CONTAINER DIMENSIONS DIP, SDIP, DMP, SDMP, SOP packages can pack in the plastic tube container the dimensions are mentioned as follows. • PLASTIC TUBE CONTAINER FOR DUAL IN LINE PLASTIC MOLD PACKAGE Plastic Tube Container for DIP16, SDIP22pin

Contextual Info: AUK CORP. Photo Transistor KDT3001A Description The KDT3001A is a high-sensitivity NPN silicon phototransistor mounted in Φ 3mm T-1 all plastic mold type. Pin Connection 1. Emitter 2. Collector Features Φ3mm(T-1) all plastic mold type Colorless transparency lens

DIP18

Abstract: DIP20 TO-220F-4
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold

DIP18

Abstract: DIP20
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold

DIP18

Abstract: DIP20 DIP40 702 mini transistor
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold

Contextual Info: O K I electronic components KGF1313 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1313, housed in an SOT-89 type plastic-mold package, is a discrete power FET with frequencies ranging from the UHF band to the L band. This device features high efficiency and

901 704 16 08 55

Abstract: marking S111 amplifier KGF1313 3301 dbm sot89 sot-89 marking ct 8511
Contextual Info: O K I electronic components KGF1313 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1313, housed in an SOT-89 type plastic-mold package, is a discrete power FET with frequencies ranging from the UHF band to the L band. This device features high efficiency and

cq 721

Abstract: ma 17393 KGF1323 P0* DBM SOT89 T4 0660
Contextual Info: O K I electronic components KGF1323 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type G E N E R A L DESCRIPTION The KGF1323, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency and high output power. The KGF1323 specifications are

HA 16630

Abstract: DBM-188 171-09 KGF1284
Contextual Info: O K I electronic components KGF1 284 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1284, housed in an SOT-89 type plastic-mold package, is a discrete pow er FET with frequencies ranging from the U H F to the L band. This device features high efficiency, high

819 39a

Abstract: KGF1283 HA 17458
Contextual Info: O K I electronic components KGF1283 _ Power FET for UHF-Band and PC S Frequencies Plastic Mold Type G EN ER A L D ESC RIPT IO N The KGF1283, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency, high output power, and high gain. The KGF1283 specifications

A2ND

Abstract: KELD001
Contextual Info: NEW PRODUCT Infrared Emitting Diode GaAs KELD001 Description The KELD001, high-power GaAs IRED mounted in a 2nd Mold package, is compact, and easy to mount. Features - Compact - Side-looking with plastic package - RoHS Compliance - Small 2nd Mold Package

QFJ032-P-R450-2

Contextual Info: PLASTIC LEADED CHIP CARRIER 32 PIN PLASTIC LCC-32P-M02 EIAJ code : ∗QFJ032-P-R450-2 32-pin plastic QFJ PLCC Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Plastic mold (LCC-32P-M02) 32-pin plastic QFJ (PLCC)

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max