PLASTIC MOLD PACKAGE Search Results

low noise hemt transistor

Abstract: MGF4714CP InGaAs HEMT mitsubishi
Contextual Info: MITSUBISHI SEMICONDUCTOR GaAs FET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714CP low-noise HEMT High Electron Mobility OUTLINE DRAWING Unit:millimeters (0.6 Transistor) is designed for use in L to Ku band amplifiers. 1 The plastic mold package offer high cost performance, and has a

DIP18

Abstract: DIP20 TO-220F-4
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold

EMP24-E3

Abstract: EMP20-E2 DIP18 DIP20 702 mini transistor 25PCS
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold

901 704 16 08 55

Abstract: marking S111 amplifier KGF1313 3301 dbm sot89 sot-89 marking ct 8511
Contextual Info: O K I electronic components KGF1313 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1313, housed in an SOT-89 type plastic-mold package, is a discrete power FET with frequencies ranging from the UHF band to the L band. This device features high efficiency and

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max

fujitsu

Abstract: BGA112
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 112 PIN PLASTIC To Top / Package Lineup / Package Index BGA-112P-M01 112-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 11 Sealing method Plastic mold BGA-112P-M01 112-pin plastic FBGA (BGA-112P-M01)

30-pin

Contextual Info: SHRINK SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 30 PIN PLASTIC To Top / Package Lineup / Package Index FPT-30P-M02 30-pin plastic SSOP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Plastic mold FPT-30P-M02 30-pin plastic SSOP

F16-800

Contextual Info: TEST PAD QFP FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC To Top / Package Lineup / Package Index FPT-168P-M02 168-pin plastic TPQ Lead pitch 0.30 mm Lead shape Gullwing Sealing method Plastic mold FPT-168P-M02 168-pin plastic TPQ (FPT-168P-M02) PRELIMINARY

QFJ068-P-S953-2

Contextual Info: PLASTIC LEADED CHIP CARRIER 68 PIN PLASTIC LCC-68P-M02 EIAJ code : ∗QFJ068-P-S953-2 Lead pitch 50mil Package width x package length 953 × 953mil Lead shape J bend Sealing method Plastic mold 68-pin plastic QFJ PLCC (LCC-68P-M02) 68-pin plastic QFJ (PLCC)

331 transistor

Abstract: 331 DATASHEET C 331 Transistor transistor 331 8 transistor C 331
Contextual Info: PLASTIC LEADED CHIP CARRIER 20 PIN PLASTIC LCC-20P-M02 Lead pitch 50mil Package width x package length 353 × 353mil Lead shape J bend Sealing method Plastic mold 20-pin plastic QFJ PLCC (LCC-20P-M02) 20-pin plastic QFJ (PLCC) (LCC-20P-M02) +0.22 4.30 –0.11

FPT-24P-M03

Contextual Info: SHRINK SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M03 24-pin plastic SSOP Lead pitch 0.65mm Lead shape Gullwing Sealing method Plastic mold FPT-24P-M03 * : These dimensions do not include resin protrusion. 24-pin plastic SSOP (FPT-24P-M03) +0.20

Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index LCC-20P-M02 20-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 353 × 353 mil Lead shape J bend Sealing method Plastic mold

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M08 64-pin plastic SOP Lead pitch 0.80 mm Package width 10.90 mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M08 64-pin plastic SOP

transistor 8P

Contextual Info: SHRINK SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M03 8-pin plastic SSOP Lead pitch 0.80 mm Lead shape Gullwing Sealing method Plastic mold FPT-8P-M03 8-pin plastic SSOP (FPT-8P-M03)

FPT-144P-M05

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M08 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold

34-pin

Contextual Info: SHRINK SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 34 PIN PLASTIC To Top / Package Lineup / Package Index FPT-34P-M02 34-pin plastic SSOP Lead pitch 1.00 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index FPT-32P-M07 32-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold

FPT-28P-M03

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M03 28-pin plastic TSOP I Lead pitch 0.55 mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Normal bend

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index FPT-32P-M04 32-pin plastic TSOP I Lead pitch 0.60 mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Normal bend

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index FPT-32P-M05 32-pin plastic TSOP I Lead pitch 0.60 mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend

24 lead

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index FPT-24P-M05 24-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold

FPT-48P-M20

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M20 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN PLASTIC To Top / Package Lineup / Package Index FPT-40P-M06 40-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold