PHILIPS PACKAGE DESIGNATOR Search Results

MAX6400-MAX6405

Contextual Info: INTEGRATED CIRCUITS MAX6400/MAX6401/MAX6402/ MAX6403/MAX6404/MAX6405 Ultra-low-power microprocessor reset circuit in 4-bump Chip-Scale package Product data Philips Semiconductors 2003 May 27 Philips Semiconductors Product data Ultra-low-power microprocessor reset circuit

philips package designator

Contextual Info: Philips Semiconductors Ordering information DATA COMMUNICATIONS, LOCAL AREA NETWORK, FUTUREBUS+ Example 1: S C N X X X X X C N 4 8 Pin count 14, 16, 20, 24, 28, 40, 48, etc. SC – Philips Designator Package Code A = Plastic Leaded Chip Carrier PLCC N = Plastic Dual In-Line

54F11

Abstract: GDFP1-F14
Contextual Info: Product specification Philips Semiconductors Military FAST Products 54F10/54F11 Triple three-input NAND ’F10 / AND (’F11) gates FUNCTION TABLE ORDERING INFORMATION PACKAGE DESIGNATOR* ORDER CODE DESCRIPTION 14-Pin Ceramic DIP 54F10/BCA, 54F11/BCA GDIP1-T14

54F245

Abstract: GDFP2-F20
Contextual Info: Product specification Philips Semiconductors Military FAST Products 54F245 Octal transceiver 3-State ORDERING INFORMATION FEATURES • 3-State buffer outputs sink 48mA • 12mA source current PACKAGE DESIGNATOR* ORDER CODE DESCRIPTION • Octal bidirectional bus interface

NC01B

Abstract: 54F38/B2A GDFP1-F14 GDFP2-F20 20-PIN 54F38
Contextual Info: Product spécification Philips Semiconductors Military FAST Products Quad two-input NAND buffer Open-Collector FUNCTION TABLE ORDERING INFORMATION DESCRIPTION ORDER CODE 54F38 PACKAGE DESIGNATOR* 14-PIN Ceramic DIP 54F38/BCA GDIP1-T14 14-PIN Ceramic Flat Pack

GDFP1-F14

Contextual Info: Philips Semiconductors Military FAST Products Product specification Quad two-input NAND buffer 54F37 ORDERING INFORMATION DESCRIPTION ORDER CODE FUNCTION TABLE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F37/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F37/BDA GDFP1-F14

54F125

Abstract: 54F125/BCA GDIP1-F14
Contextual Info: Philips Semiconductors Military FAST Products Product specification Quad buffer 3-State 54F125 FEATURES FUNCTION TABLE • High impedance NPN base inputs for reduced loading (20|iA in High and Low states) INPUTS ORDERING INFORMATION ORDER CODE PACKAGE DESIGNATOR*

54F51

Abstract: GDFP1-F14
Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual two-wide two-input, two-wide three-input AND-OR-lnvert gate ORDERING INFORMATION DESCRIPTION 54F51 PIN CONFIGURATION ORDER CODE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F51/BCA GDIP1-T14

706 B34

Abstract: 54F64 GDFP1-F14 CQCC2-N20
Contextual Info: Product specification Philips Semiconductors Military FAST Products Four-two-three-two-input AND-OR-invert gate 54F64 ORDERING INFORMATION DESCRIPTION ORDER CODE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F64/BCA GDIP1-T14 14-Pin Ceramic Flat Pack 54F64/BDA

54F64

Abstract: GDFP1-F14
Contextual Info: Product specification Philips Semiconductors Military FAST Products Four-two-three-two-input AND-OR-invert gate 54F64 ORDERING INFORMATION DESCRIPTION ORDER CODE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F64/BCA GDIP1-T14 14-Pin Ceramic Flat Pack 54F64/BDA

GDIP1-T14

Abstract: 54F04 GDFP1-F14
Contextual Info: Product specification Philips Semiconductors Military FAST Products Hex inverter 54F04 PIN CONFIGURATION ORDERING INFORMATION ORDER CODE DESCRIPTION PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F04/BCA GDIP1-T14 14-Pin Ceramic Flat Pack 54F04/BDA GDFP1-F14 a 20-Pin Ceramic LLCC

GDFP2-F16

Abstract: GDIP1-T16
Contextual Info: Philips Semiconductors Military FAST Products Product specification Buffer/driver 54F367 FEATURES ORDERING INFORMATION • High-impedance NPN base inputs for reduced loading 20|iA in Low and High states DESCRIPTION ORDER CODE PACKAGE DESIGNATOR* • 3-State buffer outputs sink 48mA

GDFP1-F14

Abstract: GDFP2-F20
Contextual Info: Philips Semiconductors Military FAST Products_ Q uad buffer 3-State 54F126 ORDERING INFORMATION FEATURES ORDER CODE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F126/BCA GDIP1-T14 14-Pin Ceramic Flat Pack 54F126/BDA GDFP1-F14 20-Pln Ceramic LLCC 54F126/B2A

LQFP Package 128-pin

Abstract: philips package designator PLCC-3
Contextual Info: Programmable Products CPLD Part Numbering System PZxyyyyk S zz YYY PZ = Philips Zero power YYY = Package Designator x = Supply Voltage A44 = 44 pin PLCC 3 = 3.3V A68 = 68 pin PLCC 5 = 5V A84 = 84 pin PLCC yyyy = Macrocell Count BB = 100 pin PQFP k = Operating Temperature/Architecture

Contextual Info: LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level

Contextual Info: Philips Semiconductors Military FAST Products Product specification Latch/Flip-Flops FEATURES • 54F573 is broadside pinout version of 54F373 • 54F574 is broadside pinout version of 54F374 • Inputs and outputs on opposite side of package allow easy interface to

CoolRunner

Abstract: P3Z22V10 PZ3032 PZ3064 PZ5032 A-84 Pqfp 100 PQFP-100
Contextual Info: Philips CoolRunner Family Selection Guide Part Number Package s Pkg Designator Macrocells Gates Is & I/Os P3Z22V10 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP

E4600

Abstract: se 1117 ad crystal oscillator 850mhz VGA Multiplier IC IS-54 KV1470 SA7025 SA900 SA900BE cell phone detector circuit philips
Contextual Info: NAPC/PHILIPS SEHICQND b7 E D • bbSB'JSM □OÔ'ISTS Philip* Semiconductor* RF Communication* Product* « S IC 3 û b l Product *peciflcation l/Q transmit modulator DESCRIPTION SA900 PIN CONFIGURATION BE Package # 5 3 l i - . - o . o l i l 3^1 Vcc H ] GND

C2631 transistor

Abstract: ql c307 cmos 4004 lc 9202 TC289 VGA Multiplier IC C307 IS-54 KV1470 L372
Contextual Info: Philips Sem iconductors Product specification l/Q transmit modulator SA900 DESCRIPTION PIN CONFIGURATION o GNI Vcc GNI Q 1 Q o 1 GN LO. LO. '“ i Û Vcc BE Package . Vcc The SA900 is a monolithic high performance, multi-function transmit modulator for use in cellular radio applications, fabricated in QUBiC

spice germanium diode

Abstract: SNW-EQ-611 PXTA14 sot89 JB TRANSISTOR SMD letter CODE PACKAGE SOT23 BSP15 BSP19 BST60 germanium transistor pnp MDA100
Contextual Info: GENERAL Page Quality 2 Pro Electron type numbering system 2 Rating systems 3 Letter symbols 4 S-parameter definitions 7 Equivalent package designators 8 Transistor ratings 8 Thermal considerations 11 Power derating curves for SMDs Power derating curve for SOT23

GDFP2-F20

Abstract: 817 BN 817 BN circuit 54F241/BSA 54F240 CQCC2-N20 54F240/BRA 54F241 E 817
Contextual Info: P hilips S e m iconductors M ilita ry FAST P roducts P ro du ct specification Octal inverting buffer, 3-State Octal buffer, (3-State) 54F240 54F241 FEATURES ORDERING INFORMATION • 3-state buffer outputs sink 48mA and source 12mA ORDER CODE PACKAGE DESIGNATOR*

0B71

Abstract: 54F398 54F399 GDFP2-F16 GDFP2-F20 GDIP1-T16
Contextual Info: P roduct s p e rili cation P hilips S e m iconductors M ilita ry FAST Products Quad 2-port register w/true & complimentary outputs Quad 2-port register • Select inputs from two data sources 54F398 54F399 ORDER CODE PACKAGE DESIGNATOR’ 20-Pin Ceramic DIP

ssop-5 footprint

Abstract: AN10161 philips naming convention SSOP-5 0.65 sot59 MO178 MO-203 SSOP5-P-0-65A SC70-5 SC74A
Contextual Info: INTEGRATED CIRCUITS ABSTRACT Different suppliers have introduced single-, dual-, and triple-gate devices, with many different names. This application note discusses the different call-outs for the various packages and provides the reader with a comparison of the drawings from different vendors.

ssop-5 footprint

Abstract: SOT753 footprint sot59 us8 Package SOT353 footprint AN10161 MO178 SC70-5 SC74A SC88A
Contextual Info: INTEGRATED CIRCUITS ABSTRACT Different suppliers have introduced single-, dual-, and triple-gate devices, with many different names. This application note discusses the different call-outs for the various packages and provides the reader with a comparison of the drawings from different vendors.