PBGA JC THERMAL RESISTANCE Search Results

Theta-JC

Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
Contextual Info: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external

82546

Abstract: 82545GM 82545EM 82546EB 82546GB I1244 AP-458
Contextual Info: 82546 EB/GB Gigabit Ethernet Controller Thermal Properties with External Heat Sink Application Note AP-458 Revision Number: 0.5 December 2003 82546 EB/GB Gigabit Ethernet Controller Thermal Properties with External Heat Sink Application Note (AP-458) Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

jc 540

Abstract: intel 540 PBGA jc thermal resistance
Contextual Info: Thermal Data for the 540-Lead PBGA Package Application Note June 2000 Order Number: 273390-001 Thermal Data for the 540-Lead PBGA Package Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

transistor 1167-01

Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC603E7TEC Rev. 5, 09/2011 PowerPC 603e RISC Microprocessor Family: PID7t-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC family of reduced instruction set computing

JESD51-9

Abstract: QL5064 QL2003 QL2005 QL2007 QL2009 QL3012 QL3025 JESD 51-7, ambient measurement Eclipse II Family
Contextual Info: QuickLogic Customer Specific Standard Products CSSPs — Package and Thermal Characteristics •••••• QuickLogic Application Note 62 Summary This document presents an overview of thermal packaging. It shows a simple method for calculating maximum

Contextual Info: MOTOROLA Order this document by MCM69P819/D SEMICONDUCTOR TECHNICAL DATA MCM69P819 Product Preview 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM The M C M 6 9P 8 19 is a 4 M bit syn ch ro n o u s fa st static RAM d e sig ned to provide a burstable, high pe rform ance, se co n d a ry cach e for the PowerPC™ and oth er

Contextual Info: CY7C1062G CY7C1062GE PRELIMINARY 16-Mbit 512 K words x 32 bits Static RAM with Error-Correcting Code (ECC) 16-Mbit (512 K words × 32 bits) Static RAM with Error-Correcting Code (ECC) Features • High speed ❐ tAA = 10 ns ■ Embedded error-correcting code (ECC) for single-bit error

Contextual Info: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:

WEDPS512K32V-XBX

Abstract: Theta JB bga thermal resistance max2014
Contextual Info: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:

WEDPS512K32V-XBX

Contextual Info: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:

D 602

Abstract: WEDPS512K32V-XBX
Contextual Info: WEDPS512K32V-XBX White Electronic Designs 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging • 143 PBGA, 16mm x 18mm, 288mm 2 • No clock or refresh required.

Contextual Info: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Low Power Data Retention 'L' Option Access Times of 12, 15, 17, 20ns TTL Compatible Inputs and Outputs Packaging Fully Static Operation: 2 • 143 PBGA, 16mm x 18mm, 288mm

WEDPS512K32-XBX

Contextual Info: WEDPS512K32-XBX White Electronic Designs 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES n Commercial, Industrial and Military Temperature Ranges n Access Times of 12, 15, 17, 20, ns n TTL Compatible Inputs and Outputs n Packaging n 5 Volt Power Supply n Low Power CMOS

FG676

Abstract: JESD-51
Contextual Info: Application Note AC220 Package Thermal Characteristics Introduction Managing heat in CMOS Logic devices is a growing issue for today's system designers. As densities increase and process geometries and form factors shrink, the amount of heat generated on these high-speed

WEDPS512K32-XBX

Abstract: bga thermal resistance
Contextual Info: WEDPS512K32-XBX White Electronic Designs 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES „ Access Times of 12, 15, 17, 20, ns „ Packaging • 16mm x 18mm, 143 PBGA „ Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 „ Commercial, Industrial and Military Temperature

tag 8708

Contextual Info: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

BGA 11x11 junction to board thermal resistance

Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature

CY7C1034DV33

Contextual Info: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz The CY7C1034DV33 is a high performance CMOS static RAM organized as 256K words by 24 bits. This device has an

Contextual Info: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Functional Description Features • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1034DV33 is a high performance CMOS static RAM

Contextual Info: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Functional Description Features • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1024DV33 is a high performance CMOS static RAM

Contextual Info: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns The CY7C1024DV33 is a high performance CMOS static RAM organized as 128K words by 24 bits. This device has an automatic power down feature that significantly reduces power

CY7C1024DV33

Contextual Info: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz The CY7C1024DV33 is a high performance CMOS static RAM organized as 128 K words by 24 bits. This device has an

CY7C1034DV33

Contextual Info: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at 10 ns ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1034DV33 is a high performance CMOS static RAM organized as 256K words by 24 bits. This device has an

Contextual Info: MOTOROLA Order this docum ent by MCM69P819/D SEMICONDUCTOR TECHNICAL DATA MCM69P819 Product Preview 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM The MCM69P819 is a 4M bit synchronous fast static RAM designed to provide a burstable, high performance, secondary cache for the PowerPC™ and other high