PACKAGE POWER DISSIPATION Search Results

2SC4911

Abstract: 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.

IPC-SM-780

Abstract: VN20NSP VN20N VN20SP
Contextual Info: APPLICATION NOTE  PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Todaythere is a great need for a true high power surface mount package. This power package was designed

Copper Alloy C151

Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
Contextual Info: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been

TL044CN

Abstract: TL044 TL044CJ TL044C
Contextual Info: TL044M, TL044C QUAD LOW-POWER OPERATIONAL AMPLIFIERS D1662, SEPTEMBER 1973-REVISED JUNE 1988 Very Low Power Consumption T L044M . . . J OR W DUAL-IN-LINE PACKAGE T L044C . . . J OR N PACKAGE Typical Power Dissipation with ±2-V Supplies . . . 340 pW TOP VIEW

RD2.0FM

Abstract: C11531E RD10FM RD11FM RD120FM RD12FM RD13FM RD15FM RD16FM RD18FM
Contextual Info: DATA SHEET ZENER DIODES RD2.0FM to RD120FM ZENER DIODES 1 W 2 PIN POWER MINI MOLD PACKAGE DIMENSIONS DESCRIPTION Unit: mm Type RD2.0FM to RD120FM series are 2 pin power mini mold package zener diodes possessing an 4.7 ±0.3 allowable power dissipation of 1 W.

Contextual Info: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of

TPP4000

Contextual Info: T P P 4000 MEDIVM-POWER DARLINGTON ARRAY This medium-power array consists of four Darlington pairs in a single 14-pin dual in-line plastic package. Features include a collectorcurrent rating of 4 A, a minimum hFE of 2000, and a package power dissipation rating of 2 W.

TSSOP16

Abstract: TSSOP16 datasheet sot223 transistor SOT23 sot89 To92 transistor TSSOP-16 SOP8 Package SSOT24
Contextual Info: Package Power Dissipation Power Dissipation: Pd（mW） Package Power Dissipation vs. Ambient Temperature Ambient Temperature: Ta（℃） USP6B/C SOT23/25/26/26W, SSOT24, MSOP8A/10 SOP8, TO92, SOT223 TSSOP16 SOT89/89-5 SOT23/25/26 When mounted on PCB TSSOP16 (When mounted on PCB)

s0103

Abstract: BAT42 equivalent BAT43 equivalent S0103C
Contextual Info: Schottky Diodes Silicon Schottky Barrier Diodes DO-35 Glass Package, MiniMELF Glass Package, SOD123 Plastic Package, SOT23 Plastic Package Type Peak Inv. Voltage PIV Power Dissipation at 25 °C Junction Temp. Forward Voltage Drop VF at lF Volts Reverse Current

TL022 equivalent

Contextual Info: TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1661, SEPTEM BER 1 9 7 3 -R E V IS E D SEPTEM BER 1990 TL022M . . . JG PACKAGE TL022C , . , D OR P PACKAGE TOP VIEWI • Very Low Power Consumption • Power Dissipation with +2-V Supplies . . . 170 pW Typ

TCA365

Abstract: P-T66-5-H TCA365B TCA 365 tca 365 to220 tca 220
Contextual Info: Power Operational Amplifiers • TCA 365 Bipolar 1C Type □ ■TCA 365 ■TC A 365 H Ordering Code Package Q67000-A1875 Q67000-A2145 Plastic power package P-T66-5-H Plastic power package P-T66-5-J similar to TO-220 The TCA 365 ICs are power op amps in a P-T66-5-H or a P-T66-5-J package. At a maximum

Contextual Info: TL022M, TL022C DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1 6 6 1 , SEPTEMBER 1 9 7 3 -R E V IS E D JULY 1 9 8 8 TL022M . . . JG PACKAGE TL022C . . . D, JG. OR P PACKAGE Very Low Power Consumption Power Dissipation with ± 2-V Supplies . . . 170 /tW Typ TOP VIEW

Contextual Info: 10160-F FEATURES LOGIC DIAGRAM • High functional density on on* chip reduces package count and saves system power • Fast propagation delay = 4.0ns TYP • Low power dissipation = 325mW/package type no load • High fanout capability — can drive 50Q lines

2SD797

Contextual Info: SavantIC Semiconductor Product Specification 2SD797 Silicon NPN Power Transistors DESCRIPTION •With TO-3 package ·High current capability ·High power dissipation APPLICATIONS ·High power amplifier applications ·High power switching applications ·DC-DC converter applications

ISO 14405

Contextual Info: Surface Mount Monolithic Amplifier Gali 39+ 50Ω Broadband Low Power DC to 7000 MHz Features • miniture SOT-89 Package • frequency range, DC to 7000 MHz • 10.5 dBm typ., output power • excellent package for heat dissipation, exposed metal bottom

Contextual Info: Surface Mount Monolithic Amplifier Gali 59+ 50Ω Broadband Medium Power DC to 5000 MHz Features • miniture SOT-89 Package • frequency range, DC to 5000 MHz • 17.6 dBm typ., output power • excellent package for heat dissipation, exposed metal bottom

E80276

Abstract: PS21562
Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Dual-In-Line <Dual-In-Line Package Package Intelligent Intelligent Power Power Module> Module> PS21562 PS21562 TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS21562 INTEGRATED POWER FUNCTIONS

9335 SOT89

Contextual Info: Surface Mount Monolithic Amplifier Gali 49+ 50Ω Broadband Medium Power DC to 5000 MHz Features • miniture SOT-89 Package • frequency range, DC to 5000 MHz • 16.4 dBm typ., output power • excellent package for heat dissipation, exposed metal bottom

M56787FP

Abstract: spindle motor driver FORWARD REVERSE 3 PHASE MOTOR operation dvd motor
Contextual Info: MITSUBISHI <CONTROL / DRIVER IC> M56787FP SPINDLE MOTOR DRIVER DESCRIPTION PIN CONFIGURATION TOP VIEW The M56787FP is a semiconductor integrated circuit in order to drive the spindle motor. FEATURES ● Low motor echo noise. ● 3.3V DSP available. ● Large power dissipation package(Power Package).

2SC2578

Contextual Info: SavantIC Semiconductor Product Specification 2SC2578 Silicon NPN Power Transistors DESCRIPTION •With TO-3PN package ·High power dissipation ·High current capability APPLICATIONS ·For audio frequency power amplifier applications PINNING PIN DESCRIPTION

BUXD87

Contextual Info: BUXD87 HIGH VOLTAGE NPN POWER TRANSISTOR • ■ ■ ■ ■ REVERSE PINS OUT Vs STANDARD IPAK/DPAK PACKAGE HIGH VOLTAGE CAPABILITY HIGH DC CURRENT GAIN THROUGH-HOLE IPAK TO-251 POWER PACKAGE IN TUBE (SUFFIX "-1") SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL

3th2

Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Dual-In-Line <Dual-In-Line Package Package Intelligent Intelligent Power Power Module> Module> PS21312 PS21312 TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS21312 INTEGRATED POWER FUNCTIONS

2SC2578

Contextual Info: Inchange Semiconductor Product Specification 2SC2578 Silicon NPN Power Transistors DESCRIPTION ・With TO-3PN package ・High power dissipation ・High current capability APPLICATIONS ・For audio frequency power amplifier applications PINNING PIN DESCRIPTION

2SC1027

Contextual Info: Product Specification www.jmnic.com 2SC1027 Silicon NPN Power Transistors DESCRIPTION ・With TO-3 package ・High power dissipation ・Low collector saturation voltage APPLICATIONS ・Switching regulators ・DC-DC convertor ・General purpose power amplifiers