PACKAGE POWER DISSIPATION Search Results

2SC4911

Abstract: 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.

SOD123 footprint

Abstract: SOD-110 SOD110 footprint SOD110 1.2V zener diodes 5.1V SMA Zener Diode SOD123 12V 0.5W POWER-DI-323 Diode, Zener, 5.1v, SOD123 tumd2 package
Contextual Info: New Product Announcement July 25, 2006 Announcing Our New Compact PowerDITM323 Power Package with Schottky Barrier Rectifiers and Zener Diodes TM PowerDI 323 Package Outline Package Cross Sections Diodes, Inc. flat lead frame heat-sink solder pad results in higher power dissipation

2SC 1885

Abstract: 2sc low noise
Contextual Info: T ransistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UMT • SMT Three types are available to allow the most suitable package depending on size specifications.

2SC5072

Abstract: 2sc5073 25d13 25D-13
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.

IPC-SM-780

Abstract: VN20NSP VN20N VN20SP
Contextual Info: APPLICATION NOTE  PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Todaythere is a great need for a true high power surface mount package. This power package was designed

Copper Alloy C151

Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
Contextual Info: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been

2SA1885

Abstract: T147
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to T0-220, Pc=35W transistors. EM3 • UMT • SMT Three types are available to allow the most suitable package depending on size specifications. Pc (mW)

TO220S - TO-220 Heatsink Small - Aluminium

Abstract: IPC-SM-780 "Intelligent Power Devices" VN20NSP IPC-SM-785 VN20SP
Contextual Info: APPLICATION NOTE PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Today there is a great need for a true high power surface mount package. This power package was designed

TL044CN

Abstract: TL044 TL044CJ TL044C
Contextual Info: TL044M, TL044C QUAD LOW-POWER OPERATIONAL AMPLIFIERS D1662, SEPTEMBER 1973-REVISED JUNE 1988 Very Low Power Consumption T L044M . . . J OR W DUAL-IN-LINE PACKAGE T L044C . . . J OR N PACKAGE Typical Power Dissipation with ±2-V Supplies . . . 340 pW TOP VIEW

TL022

Abstract: TL022C TL022CD TL022CDR TL022CP TL022M TL022MJG TL022MU
Contextual Info: TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS SLOS076 – SEPTEMBER 1973 – REVISED SEPTEMBER 1990 • • • • • • • • TL022M . . . JG PACKAGE TL022C . . . D OR P PACKAGE TOP VIEW Very Low Power Consumption Power Dissipation With ± 2-V Supplies

RD2.0FM

Abstract: C11531E RD10FM RD11FM RD120FM RD12FM RD13FM RD15FM RD16FM RD18FM
Contextual Info: DATA SHEET ZENER DIODES RD2.0FM to RD120FM ZENER DIODES 1 W 2 PIN POWER MINI MOLD PACKAGE DIMENSIONS DESCRIPTION Unit: mm Type RD2.0FM to RD120FM series are 2 pin power mini mold package zener diodes possessing an 4.7 ±0.3 allowable power dissipation of 1 W.

RD27FS

Abstract: RD2.0FS rd20fs RD15FS RD12FS RD24FS RD5.6FS RD51FS RD51FS(0)-T1-AY RD6.8FS
Contextual Info: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of

Contextual Info: WILLAS FM120-M+ 2SA1036KxLT1 THRU Medium Power Transistor *32V, *0.5A FM1200-M 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V Pb Free Produc SOD-123+ PACKAGE Package outline Features • Batch process design, excellent power dissipation offers

Contextual Info: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of

TPP4000

Contextual Info: T P P 4000 MEDIVM-POWER DARLINGTON ARRAY This medium-power array consists of four Darlington pairs in a single 14-pin dual in-line plastic package. Features include a collectorcurrent rating of 4 A, a minimum hFE of 2000, and a package power dissipation rating of 2 W.

TSSOP16

Abstract: TSSOP16 datasheet sot223 transistor SOT23 sot89 To92 transistor TSSOP-16 SOP8 Package SSOT24
Contextual Info: Package Power Dissipation Power Dissipation: Pd（mW） Package Power Dissipation vs. Ambient Temperature Ambient Temperature: Ta（℃） USP6B/C SOT23/25/26/26W, SSOT24, MSOP8A/10 SOP8, TO92, SOT223 TSSOP16 SOT89/89-5 SOT23/25/26 When mounted on PCB TSSOP16 (When mounted on PCB)

s0103

Abstract: BAT42 equivalent BAT43 equivalent S0103C
Contextual Info: Schottky Diodes Silicon Schottky Barrier Diodes DO-35 Glass Package, MiniMELF Glass Package, SOD123 Plastic Package, SOT23 Plastic Package Type Peak Inv. Voltage PIV Power Dissipation at 25 °C Junction Temp. Forward Voltage Drop VF at lF Volts Reverse Current

TL022 equivalent

Contextual Info: TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1661, SEPTEM BER 1 9 7 3 -R E V IS E D SEPTEM BER 1990 TL022M . . . JG PACKAGE TL022C , . , D OR P PACKAGE TOP VIEWI • Very Low Power Consumption • Power Dissipation with +2-V Supplies . . . 170 pW Typ

QFP PACKAGE thermal resistance

Abstract: ic and equivalent
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-signal transistors, extremely small so that with the exception of power ICs

TCA365

Abstract: P-T66-5-H TCA365B TCA 365 tca 365 to220 tca 220
Contextual Info: Power Operational Amplifiers • TCA 365 Bipolar 1C Type □ ■TCA 365 ■TC A 365 H Ordering Code Package Q67000-A1875 Q67000-A2145 Plastic power package P-T66-5-H Plastic power package P-T66-5-J similar to TO-220 The TCA 365 ICs are power op amps in a P-T66-5-H or a P-T66-5-J package. At a maximum

Contextual Info: TL022M, TL022C DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1 6 6 1 , SEPTEMBER 1 9 7 3 -R E V IS E D JULY 1 9 8 8 TL022M . . . JG PACKAGE TL022C . . . D, JG. OR P PACKAGE Very Low Power Consumption Power Dissipation with ± 2-V Supplies . . . 170 /tW Typ TOP VIEW

Contextual Info: 10160-F FEATURES LOGIC DIAGRAM • High functional density on on* chip reduces package count and saves system power • Fast propagation delay = 4.0ns TYP • Low power dissipation = 325mW/package type no load • High fanout capability — can drive 50Q lines

QTLP670C-2

Contextual Info: 0ÆRU&HT SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE PACKAGE DIMENSIONS Green QTLP670C4.7713D FEATURES • Non-diffused package excellent for back-lighting and coupling to light pipe • Low package profile • Low power dissipation • W ide viewing angle of 120°

"MARKING CODE CA"

Abstract: zener 6.8v
Contextual Info: MMSZ4691WS SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 6.2 ~ 15 Volts 200 mWatts POWER FEATURES 0.078 1.95 0.068(1.75) • Planar Die construction • 200mW Power Dissipation • Ultra Thin Profile Package for Space Constrained Utilization • Package suitable for Automated Handling