PACKAGE DIMENSIONS Search Results

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

32TSOP

Contextual Info: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE

2SC5652

Abstract: NE685 NE685M23 S21E RF TRANSISTOR 10 GHZ low noise
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5651

Abstract: NE688 NE688M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE688M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5650

Abstract: NE681 NE681M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

NEC NPN 2SC5653

Abstract: 2SC5653 NE687 NE687M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE687M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5649

Abstract: 2SC564 NE856 NE856M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M23 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

Contextual Info: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting ! GULL WING. diodes. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions

Contextual Info: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting diodes. ! GULL WING. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions

DO204AH Packages

Abstract: 904nm DO-204AH
Contextual Info: M1 Package Dimensions M1 This section contains the dimensions for the following packages: • “F” Package—TO-202AB, Type 1 Non-isolated • “Y” Package—DO-35 or DO-204AH • “R” Package—TO-220AB THERMOTAB (Non-isolated) • “L” Package—TO-220AB THERMOTAB (Isolated)

Contextual Info: 9. Power MOSFET Series Packages TO-3JML Package Package photograph Dimensions Features Fully-isolated insulated package S a m e size a s existing T O -3 P B L package Approximately 2 times larger chip area than TO3 P B L package m - Fully-isolated (insulated) allows parts count to

HD64F2612

Abstract: HD6432611 HD6432612 QFP-80 hitachi package
Contextual Info: C. Product Code Lineup Package Hitachi Package Code Product Type QFP-80 (FP-80Q) H8S/2612 F-ZTAT version Standard product HD64F2612 Mask ROM version* Standard product HD6432612 Standard product HD6432611 Note: * In planning D. Package Dimensions The package dimension that is shown in the Hitachi Semiconductor Package Data Book has

TO252

Abstract: TO-252
Contextual Info: Package Dimension TO252-5LD TO-252-5L PACKAGE OUTLINE DIMENSIONS HTC

bjt microwave 15 GHz npn

Abstract: 2SC5436 NE687 NE687M03 S21E transistor 1038 BF-104
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE687M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

431 transistor

Abstract: BJT IC Vce NE AND micro-X 2SC5433 NE681 NE681M03 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

MS-012AA

Contextual Info: BOURNS THYRISTOR SURGE PROTECTOR PRODUCTS PACKAGE MECHANICAL INFORMATION 8-Pin Plastic Small Outline Package Package Outline Dimensions This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound is

LED-0603

Abstract: Water Meter L191BC L191GC L191MBC L191QBC L191QGC L191QYC L191SRC L191YC
Contextual Info: American Opto Plus LED L191XC-TR series… 1.6x0.8x1.1mm CHIP LED 0603 Package, Tape & Reel MAIN FEATURES: LOW CURRENT FREQUIREMENT WIDE VIEWING AGNLE LOW POWER CONSUMPTION I.C. COMPATIBLE ULTRA BRIGHT TYPS SMD 0805 PACKAGE PACKAGE DIMENSIONS PACKAGE: 3000 PCS/REEL

MSL-854BV

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-854BV Description Package Dimensions The MSL-854BV is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l LCD backlighting

MSL-824HG1

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-824HG1 Description Package Dimensions The MSL-824HG1 is designed based on in an industry Units : mm standard package for ease of handing and use. The package is water clear epoxy within white plastic. Applications l l

MSL-854UG

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP Description MSL-854UG Package Dimensions The MSL-854UG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l LCD backlighting

MSL-824UYL

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP Description MSL-824UYL Package Dimensions The MSL-824UYL is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l LCD backlighting

MSL-824B

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-824B Description Package Dimensions The MSL-824B is designed based on an industry standard package for ease of handing and use. Units: mm The package is water clear epoxy within white plastic. Applications l LCD backlighting

MSL-854SO

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-854SO Description Package Dimensions The MSL-854SO is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l LCD backlighting

MSL-854TG

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-854TG Description Package Dimensions The MSL-854TG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l LCD backlighting