PACKAGE 559 Search Results

Contextual Info: Freescale Semiconductor Technical Data MC145170-2/D Rev. 5, 1/2005 MC145170-2 Package Information P Suffix SOG Package Case 648 MC145170-2 PLL Frequency Synthesizer with Serial Interface SCALE 2:1 Package Information D Suffix Plastic DIP Package Case 751B

AN1207

Abstract: AN1671/d 948C MC145170-1 MC145170-2 MC145170D2 MC145170DT2 MC145170P2 TSSOP-16 SOG-16
Contextual Info: Freescale Semiconductor Technical Data MC145170-2/D Rev. 5, 1/2005 MC145170-2 Package Information P Suffix SOG Package Case 648 MC145170-2 PLL Frequency Synthesizer with Serial Interface SCALE 2:1 Package Information D Suffix Plastic DIP Package Case 751B

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

F3000

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 30 PIN PLASTIC To Top / Package Lineup / Package Index FPT-30P-M01 30-pin plastic SOP Lead pitch 0.80 mm Package width 14.00 mm Lead shape Gullwing Sealing method Plastic mold FPT-30P-M01 30-pin plastic SOP

atmel 518

Abstract: CERAMIC LEADLESS CHIP CARRIER quad flat j-leaded package 0502a J-Lead, plcc MS-011-AC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20P3 40D6 MS-001
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP) .7-4

20P3

Abstract: MS-001 MS-011 MS-016 MS-018
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package 2 D PAK Package Weight mg 1700 Product Group Type No. SB820D –SB8200D SB820DC –SB8200DC SB1020D –SB10200D SB1020DC –SB10200DC SB1620D –SB16200D SB1620DC –SB16200DC

MIL-STD-1835

Abstract: 20P3 40D6 MS-011 MS-018
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).8-4

DB2211

Abstract: S5591 S5590-01
Contextual Info: HAMAMATSU TWO-DIMENSIONAL PSDs S5990-01, S5991 -01 Surface mount type PSDs pin-cushion types FEATURES •Large active area 55990-01: 4 x 4 mm 55991-01: 9 x 9 mm •C h ip carrier package for surface mounting (automatic mounting with solder reflow) thin package: 1.26 mmt

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPM Package Weight mg 1700 Product Group Type No. KBP005M – KBP10M KBP150G – KBP1510G 2KBP005M – 2KBP10M KBP200G – KBP2010G Component Die Doped Silicon* Die Attach

98ARL10519D

Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

MC144111P

Abstract: MC144110-MC144111 MC144111DW MC144111 MC144110 MC144110DW MC144110P
Contextual Info: Freescale Semiconductor Technical Data MC144110/D Rev. 2, 1/2005 MC144110 MC144110 and MC144111 Package Information P Suffix Plastic DIP Case 707 Package Information DW Suffix SOG Package Case 751D MC144111 Digital-to-Analog Converters with Serial Interface

JEDEC JESD51-8 BGA

Abstract: JESD51-8 jesd51 8 JESD51-5 G38-87 800E-02 JESD51-7 JEDEC JESD51-8 QFN PACKAGE thermal resistance AN2388
Contextual Info: Freescale Semiconductor Application Note AN2388 Rev. 1.0, 12/2005 Heatsink Small Outline Package HSOP 1.0 Purpose This document is intended to provide information on Heatsink Small Outline Package (HSOP) and it’s process. The package related information includes:

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

coin operated battery charger

Abstract: CEA-936-A GSM modem M10 MAPBGA-247 MC13783 spi CONTROLLED KEYPAD SCAN IC 4513 display driver K3LV
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC13783 Rev. 3.5, 7/2009 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management

K9LBG08U0M

Abstract: K9LAG08u0m k9lbg08 K9LBG IMx32 "NAND Flash" k9f2g08 K9LAG08 mx372 K9LAG08U
Contextual Info: i.MX Platform PDK 1.4 Advanced Toolkit ATK Standard Package Release Notes This document contains important information about the package contents, supported features, and known issues/limitations for this release. Contents 1 2 3 4 Standard Release Package Contents.2

CEA-936-A

Abstract: CEA-936 Todai Electric RS232 bus audio signal switcher body marking MCL coin operated battery charger GSM modem M10 handset charger circuit diagram M5 DIODE 22-35
Contextual Info: Freescale Semiconductor Technical Data Document Number: MC13783/D Rev. 3.4, 3/2007 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management

Contextual Info: Freescale Semiconductor Technical Data Document Number: MC13783/D Rev. 3.4, 3/2007 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC13783 Rev. 3.5, 7/2009 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)

mc13718

Abstract: Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR MC13717 Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight
Contextual Info: Freescale Semiconductor Advance Information MC13790/D Rev. 1.1, 11/2004 MC13790 Package Information QFN Package Case 1506-01 QFN–76 MC13790 Ordering Information Integrated Power Management IC Device Operating Temperature Range Package MC13790 TA = –20°C to 70°C

MO-142

Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,