OUTLINE DRAWINGS Search Results

Contextual Info: OUTLINE DRAWINGS Outline 101 Outline 102 Outline 105 Outline 107 Outlines/ General Info c Outline 108 X PULSAR MICROWAVE CORPORATION 3 OUTLINE DRAWINGS 3 Outlines/ General Info c 48 Industrial West • Clifton, NJ 07012 • Tel: (973) 779-6262 • Fax: (973) 779-2727

Contextual Info: OUTLINE DRAWINGS ORIENTATION IND CATOR \~ - .800 - H Outline 101 Outline 102 Outline 103 Outline 104 Miscellaneous V - ORIENTATION INDICATOR Outline 105 P u l s a r M i c r o w a v e C o r p o r a t i o n OUTLINE DRAWINGS 48 Industrial West ♦ Clifton, N J 07012

RM 1206

Contextual Info: Multilayer Ceramic Capacitors Outline Drawings Chip capacitors Outline drawing 1 Size 0805 1.2S;o,is Outline drawing 2 Size 1206 l,3m ax L" 1/14 o 0,5 ~T T e rm ina tion Termination Outline drawing 3 Size 1210 — 2.Si0.î — Outline drawing 4 Size 1812 1,3max

050T0

Contextual Info: Multilayer Ceramic Capacitors Outline Drawings Radiai-tead capacitors Outline drawing 6 Outline drawing 8 Outline drawing 7 S 5,0 max 2,5 m o* 5,0 max El A Yn \ N S. iMl B3 / f< i i / ! 0.50±0,05t 0.50t0,05 1 . K KE0222-U Outline drawing 9 X W M 2 5 -S

Mitsubishi

Abstract: outline packages
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4. PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS Each type of individual pack, inner and outer cartons are specified here, together with an outline drawing. The content indication labels also

w502

Abstract: W302 W203 W101 w603 W702 x101 W103 X103 w401
Contextual Info: OUTLINE DRAWING The content of this specification may change without notification 7/01/09 PIN Switches Outline Drawings Size: mm Outling Drawings X101 X103 X104 X105 W101 W102 OUTLINE DRAWING The content of this specification may change without notification 7/01/09

t431

Abstract: 3I 46 content t163
Contextual Info: Outline Drawings for Amplifiers The content of this specification may change without notification 8/01/09 A mplifiers Outline Drawings Size: mm S11 A1 C T16-3 T43 1 Outline Drawings for Amplifiers The content of this specification may change without notification 8/01/09

Contextual Info: 2 Outline drawings (Unit: mm) •O utline 1 (forming type) Outline 1 Dimension H1 4.5 7.5 ! 6.0 3.5 1 5.0 9.0 10.0 Forming type ■O utline 2 (straight type) Outline 2 TPS Dimension HO 2 .5 4 (5 .0 ) ( 17.5 : 20.5 ): SEL5020 and SEL5021 series Straight type

JEDEC

Contextual Info: Standard Outline Dimensions Various typ es o f H itachi diode p ackages are availab le to fu lfill sp e c ific a p p lication s and perform ance. For guaranteed d im en sio n on individual package, refer to the outline drawings for each d ev ice data sheet. Standard outline

9939

Abstract: footprints
Contextual Info: VCO Package Outline Drawings & Footprints All specifications are subject to change without notice. 9939 Via Pasar, San Diego, CA 92126 | Tel: 858.621.2700 | Fax: 858.621.2722 Email: applications@zcomm.com | URL: www.zcomm.com VCO Package Outline Drawings & Footprints

9939

Abstract: 2722
Contextual Info: PLL Package Outline Drawings & Footprints All specifications are subject to change without notice. 9939 Via Pasar, San Diego, CA 92126 | Tel: 858.621.2700 | Fax: 858.621.2722 Email: applications@zcomm.com | URL: www.zcomm.com PLL Package Outline Drawings & Footprints

footprints

Contextual Info: VCO Package Outline Drawings & Footprints All specifications are subject to change without notice. 14118 Stowe Drive, Suite B, Poway, CA 92064 | Tel: 858.621.2700 | Fax: 858.486.1927 Email: applications@zcomm.com | URL: www.zcomm.com VCO Package Outline Drawings & Footprints

Contextual Info: PLL Package Outline Drawings & Footprints All specifications are subject to change without notice. 14118 Stowe Drive, Suite B, Poway, CA 92064 | Tel: 858.621.2700 | Fax: 858.486.1927 Email: applications@zcomm.com | URL: www.zcomm.com PLL Package Outline Drawings & Footprints

SSOP20 300 mil

Abstract: DIP20 SC603 Package Outline philips ic06
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3

nec 44 pin LQFP

Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)

SOP 8 200MIL

Abstract: DIP16-P-300 0903 24pin SOP20-P-300
Contextual Info: C2M0S Logic TC74HC/HCT Series 14 Outline Drawings i— i i— i r— i i— > i— i i— i 1— 1 19.75MAX DIP 14-PIN Outline Drawing (DIP14-P-300 Ä J71 r a . n n i~ i n I8! 1t.7SM«x DIP 16-Pin Outline Drawing (DIP16-P-300) Units: mm TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.

chip Capacitors 100 nf

Contextual Info: Ceramic Capacitors Contents Multilayer chip capacitors Outline drawings COG X7R Z5U Radial-lead multilayer capacitors Outline drawings COG X7R Z5U V P, Type Page B37871 B37949 B37872, B37941 B37872 . B37956 B37942 B37873 . B37957 182 183 185 185 187 187

OP07P

Abstract: OP-07P L7667mja max3912 IH514851 max703mja IH5341MTW MX7502SQ IH5048
Contextual Info: SCOPE: HIGH VOLTAGE, FAULT PROTECTED, ANALOG MULTIPLEXER Device Type 01 02 Generic Number MAX378M x /883B MAX379M(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JE LP Case Outline Package Code

Contextual Info: ~PMO£N/;< M/c/?om^cap. Outline Drawings Pin# 1 2 3 .XX .XXX .02 .010 All Dimensions are in inches Std. outline Flipped Version Function Function RF In RF Out Vcc or R* Vcc or R* RF Out RF In

siemens ICA

Abstract: LX141 siemens r LG7137 DLO7135 0xlp
Contextual Info: Intelligente LED-Anzeigen Intelligent Displays Maßbilder in mm Siemens Aktiengesellschaft Outline drawings (in mm) 65 Intelligent Displays Intelligente LED-Anzeigen Maßbilder (in mm) Outline drawings (in mm) DL 3416 Figures 101 Figure 6 EIA date code Lum inous

sop package tray

Abstract: 29754* intel weight of SOP package SOP JEDEC tray
Contextual Info: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.

max703mja

Abstract: LCC-28 OP07P OP-07P TRUE RMS-TO-DC CONVERTER MX7502SQ IH5048
Contextual Info: SCOPE: QUAD, SPST, CMOS, TTL-Compatible Analog Switches Device Type: -01 -02 Generic Number: DG308AA x /883B DG309A(x)/883B Case Outline(s). Outline Letter Mil-Std-1835 K GDIP1-T16 or CDIP2-T16 Case Outline 16 LEAD CERDIP Package Code J16 Absolute Maximum Ratings

Contextual Info: Digital Attenuator Outline Drawings .625” Gullwing Package SG4 .800” x 1.37” DIP Package (DP5) .990” x 1.99” DIP Package (DP8) - 466 - Digital Attenuator Outline Drawings .775” Sq. DIP Package (DP11) Attenuator SMA Connectorized Housing 1

IH5048

Contextual Info: SCOPE: 100mA CMOS SWITCHED-CAPACITOR VOLTAGE CONVERTER 1.5V TO 8V Device Type 01 Generic Number MAX665M x /883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JA Mil-Std-1835 GDIP1-T8 or CDIP2-T8 Case Outline