OF BALL GRID ARRAY Search Results

FC-BGA

Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.

PBGA 256 reflow profile

Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

Contextual Info: ! j * . WPF1024K32-XPBX 1024Kx32 FLASH BALL GRID ARRAY PRELIMINARY * FEATURES • Access Times of 9 0 ,150ns ■ Organized as 1024Kx32 ■ Perimeter Ball Grid Packaging ■ Commercial and Industrial Temperature Ranges • 35mm BGA: ■ 5 Volt Power Supply, 12 V pp

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

g31 m7 te

Abstract: LC2-D LA4-DA adsp20 Socket AM2 AL-20 bmsa
Contextual Info: a Quad-SHARC DSP Multiprocessor Family AD14160/AD14160L OLE AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid

DBGA

Abstract: Scans-0066302 0836 1AMI amis
Contextual Info: AMI A M I S E M IC O N D U C T O R s DBGA Packaging Capabilities . . Description Surface Mount The Dimpled Ball Grid Array consists of a dimpled structure achieving around 2X the board joint reliability compared to that of conventional ceramic Ball Grid Arrays.

LC2D

Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting
Contextual Info: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned

transistor nec 8772

Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

NXR-1400

Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

FPBGA

Abstract: ga 25 diode M918 package diode
Contextual Info: Tape and Reel Specification M918 Tape and Reel Option Fine Pitch Ball Grid Array Package GA 25 / 26 Ball W P Direction of Feed Package Suffix Package Type GA fpBGA 050708 Ball Count Tape Width (W) 25 12 26 16 (mm) Pocket Pitch (P) Reel Diameter Units per Reel

32X32

Abstract: ADSP-TS202S ds206 l3bc ADDR31-0 b14 smd
Contextual Info: PRELIMINARY TECHNICAL DATA TigerSHARC Embedded Processor ADSP-TS202S a Preliminary Technical Data KEY FEATURES 500 MHz, 2.0 ns Instruction Cycle Rate 12M Bits of Internal—On-Chip—DRAM Memory 25؋25 mm 576-Ball Thermally Enhanced Ball Grid Array Package

32x32 Multiplier

Abstract: EE-174 32X32 ADSP-TS201S processor cross reference avr ms1 diagram ADSP-TS201SABP-ENG
Contextual Info: PRELIMINARY TECHNICAL DATA TigerSHARC Embedded Processor ADSP-TS201S a Preliminary Technical Data KEY FEATURES 500 MHz, 2.0 ns Instruction Cycle Rate 24M Bits of Internal—On-Chip—DRAM Memory 25؋25 mm 576-Ball Thermally Enhanced Ball Grid Array Package

Contextual Info: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.

Contextual Info: Description The MSM32512HBD is a plastic 512Kx32 SRAM multichip module housed in a 119 ball Ball Grid Array Package . Access times of 12, 15 or 17ns are available. The 3.3V device is available to commercial industrial or military temperature grade and is designed to operate in high reliability applications.

BM 1084

Abstract: ADSP-TS201Sw ADSP-TS201SWBP-050 ADSP-TS201SABP-050 ADSP-TS201SABP-060 ADSP-TS201S
Contextual Info: TigerSHARC Embedded Processor ADSP-TS201S a KEY FEATURES KEY BENEFITS Up to 600 MHz, 1.67 ns instruction cycle rate 24M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array package Dual-computation blocks—each containing an ALU, a

ADSP-TS201SWBP-050

Abstract: 7485 pin configuration ADSP-TS201S SYSCON 3 ADSP-TS201SABP-050 ADSP-TS201SABP-060 ADSP-TS201SwBP
Contextual Info: TigerSHARC Embedded Processor ADSP-TS201S a KEY FEATURES KEY BENEFITS Up to 600 MHz, 1.67 ns instruction cycle rate 24M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array package Dual-computation blocks—each containing an ALU, a

SMD phase shifter 0201

Abstract: ts201S ADSP-TS201SABP-050 ADSP-TS201SABP-060 l3bc
Contextual Info: TigerSHARC Embedded Processor ADSP-TS201S • a KEY FEATURES KEY BENEFITS Up to 600 MHz, 1.67 ns instruction cycle rate 24M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array package Dual-computation blocks—each containing an ALU, a

e2cmos technology

Abstract: 3256E BGA Package "lattice semiconductor"
Contextual Info: Product Bulletin January, 1998 #PB1087 It's a Whole New Ball Game! Lattice Releases New Space-Saving BGA Packages Introduction Lattice Semiconductor is adding two new Ball Grid Array BGA packages to its offering of PLDs available in advanced, space-saving packages. The ispLSI 3192, available in the 272ball BGA package, and the ispLSI 3256E, available in the 320-ball BGA package, are the first

PF 08112

Abstract: BR3100 ADSP-TS203S ADSP-TS201
Contextual Info: TigerSHARC Embedded Processor ADSP-TS203S KEY FEATURES 1149.1 IEEE-compliant JTAG test access port for on-chip emulation On-chip arbitration for glueless multiprocessing 500 MHz, 2.0 ns instruction cycle rate 4M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array

ts201

Abstract: ADSP-TS201S ADSP-TS201SYBP-050 PF 08112 BM 1084 ADSP-TS201 SDRAM ADSP-TS201SABP-050 ADSP-TS201SABP-060 ADSP-TS201SABPZ050 ADSP-TS201SABPZ060
Contextual Info: TigerSHARC Embedded Processor ADSP-TS201S • a KEY FEATURES KEY BENEFITS Up to 600 MHz, 1.67 ns instruction cycle rate 24M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array package Dual-computation blocks—each containing an ALU, a

MO-205

Abstract: BGA96A
Contextual Info: Revised June 2001 BGA96A 96-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA96A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

ADSP-TS203S

Abstract: ADSP-TS201
Contextual Info: TigerSHARC Embedded Processor ADSP-TS203S a KEY FEATURES KEY BENEFITS 500 MHz, 2.0 ns instruction cycle rate 4M bits of internal—on-chip—DRAM memory 25 mm x 25 mm 576-ball thermally enhanced ball grid array package Dual-computation blocks—each containing an ALU, a multiplier, a shifter, and a register file