OF BALL GRID ARRAY Search Results

PSR4000 AUS308

Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
Contextual Info: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array

Solder Balls

Abstract: V356
Contextual Info: Plastic Packages for Integrated Circuits Heatsink Plastic Ball Grid Array Package HPBGA 27.00 A1 BALL PAD CORNER 0.20 (4X) V356.27x27C A 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) 24.00 +0.35 -0.05 4X 10.00 B NO. OF LAYERS DIM “A” DIM “B”

V356

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Package PBGA V356.27x27B 0.20 (4X) 27.00 24.00 A1 BALL PAD CORNER A 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) +0.35 -0.05 B 4X 10.00 NO. OF LAYERS DIM “A” DIM “B” NOTES 4 2.33±0.21

Intel reflow soldering profile BGA

Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
Contextual Info: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular

solder paste alpha WS609

Abstract: WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga
Contextual Info: Ceramic Ball Grid Array Surface Mount Assembly Application Note 1298 1. Package Description Ceramic Ball Grid Array CBGA is a custom platform supporting a wide variety of performance applications. This package uses flip chip as the first level interconnection and solder ball as the second level

BGA PROFILING

Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

FC-BGA

Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.

PBGA 256 reflow profile

Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

Contextual Info: ! j * . WPF1024K32-XPBX 1024Kx32 FLASH BALL GRID ARRAY PRELIMINARY * FEATURES • Access Times of 9 0 ,150ns ■ Organized as 1024Kx32 ■ Perimeter Ball Grid Packaging ■ Commercial and Industrial Temperature Ranges • 35mm BGA: ■ 5 Volt Power Supply, 12 V pp

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

g31 m7 te

Abstract: LC2-D LA4-DA adsp20 Socket AM2 AL-20 bmsa
Contextual Info: a Quad-SHARC DSP Multiprocessor Family AD14160/AD14160L OLE AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid

MPC823

Abstract: AN1231
Contextual Info: Mechanical Data and Ordering Information 24.3 PACKAGE DIMENSIONS–PLASTIC BALL GRID ARRAY PBGA For more information on the printed circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid

DBGA

Abstract: Scans-0066302 0836 1AMI amis
Contextual Info: AMI A M I S E M IC O N D U C T O R s DBGA Packaging Capabilities . . Description Surface Mount The Dimpled Ball Grid Array consists of a dimpled structure achieving around 2X the board joint reliability compared to that of conventional ceramic Ball Grid Arrays.

hbr Y1

Abstract: lc1d
Contextual Info: BACK a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned

Contextual Info: Arrays PGA / Z IF Pin Grid A rray / Zero Insertion Force (Pages 9-18) BGA / C SP (Ball Grid A rray / Chip Scale Packaging) (Pages 19-21) liBGA" / C SP (Micro Ball Grid A rray / Chip Scale Packaging) (Pages 22-30) ^iBGA is a a registered Tradem ark of Tessera Inc. All rights reserved.

qfn 6 x 6 TRAY

Abstract: QFn Package tray pd0018 tfBGA 8 x 8 tray package tray outline ufdfpn 639X qfn 5 x 6 TRAY qfn tray 5 mm x 6 mm qfn 5 x 5 TRAY
Contextual Info: PD0018 Packing information Tray for Ball Grid Array and QFN packages Introduction Tray for Ball Grid Array and QFN UFDFPN packages can be supplied in tray packing. Refer to Table 1 for the list of packages supplied in trays. The objective of this document is provide a detailed description of the tray.

transistor nec 8772

Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

NXR-1400

Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

BGA PROFILING

Abstract: hot air bga bga rework fine BGA thermal profile reflow hot air BGA
Contextual Info: 2xxxx-APP-002-A September 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for Ball Grid Array (BGA) packages. The BGA packages that can

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: WHITE /MICROELECTRONICS WPF1024K32-XPBX 1024Kx32 FLASH BALL GRID ARRAY PRELIMINARY* FEATURES • A c c e s s Tim es of 9 0 , 150ns ■ Organized a s 1024K x32 ■ Perim eter Ball Grid Pa ckaging ■ Com m ercial and Industrial Tem perature R a n ge s • 35m m BG A:

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems