NCSM Search Results

TI BINARY DATE CODE

Abstract: BQ20Z80-V101 BQ2940
Contextual Info: bq20z80-V101 www.ti.com SLUS625C – SEPTEMBER 2004 – REVISED JULY 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312 FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

PL10SMS-12C

Abstract: 1402ma
Contextual Info: PL10SMS-12C NON-ISOLATED DC-DC Converter 8.3-14Vin, 0.75- 5.0Vout, 10A INSTALLATION / APPLICATION NOTE PL10SMS-12C Page 1 PL10SMS-12C Content 1. INTRODUCTION 3 2. MODELS 3 3. CONVERTER FEATURES 3 4. GENERAL DESCRIPTION 4.1 Electrical Description 3 3 4.2 Thermal Packaging and Physical Design

PL20S-W12C

Abstract: w12c 14BTYP Fuse 250V T 2,5A PL20SMS-W12C
Contextual Info: PL20S-W12C, PL20SMS-W12C NON-ISOLATED DC-DC Converter 6.0-14Vin, 0.75- 5.0Vout, 20A INSTALLATION / APPLICATION NOTE PL20S-W12C PL20SMS-W12C PL20S-W12C, PL20SMS-W12C Content 1. INTRODUCTION 3 2. CONVERTER FEATURES 3 3. GENERAL DESCRIPTION 3.1 Electrical Description

9416A

Contextual Info: PL16S-12C, PL16SMS-12C NON-ISOLATED DC-DC Converter 9.0-14Vin, 0.75- 5.0Vout, 16A INSTALLATION / APPLICATION NOTE PL16S-12C PL16SMS-12C Page 1 PL16S-12C, PL16SMS-12C Contents 1. INTRODUCTION 3 2. MODELS 3 3. CONVERTER FEATURES 3 4. GENERAL DESCRIPTION 4.1 Electrical Description

AMD-756

Abstract: AMD-756AC AMD-756AC B Date Code c AMD 1998 AMD-751 Northbridge AMD756AC
Contextual Info: Preliminary Information Version Created May 11, 2000 AMD-756 TM Peripheral Bus Controller Revision Guide Publication # 22591 Rev: C Issue Date: May 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced

KVM SWITCH schematic

Abstract: iC-XU-PDIP22 motortreiber ic-xu KVM SWITCH IC
Contextual Info: FEATURES APPLICATIONS ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 4 independently controllable channels with 8 power output stages Power output stages for 350m A continuous current and high impulse load Integrated free-wheeling diodes Microprocessor-compatible drive circuit for up to 4

VPOL16A-12-SIP

Contextual Info: VPOL16A-12-SIP Data Sheet Features * Industry standard pin out * High efficiency to 94% * 300 KHz switching frequency * 9.0-14 VDC wide input range * 0.75-5.0 VDC wide output range * Over temperature protection * Continuous short circuit protection * Remote on/off

soc fuse

Abstract: SLUS681
Contextual Info: bq20z80-V102 www.ti.com SLUS681 – NOVEMBER 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312A FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology Accurately Measures Available Charge in

LGA voiding

Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal

BQ20Z80-V101

Contextual Info: bq20z80-V101 www.ti.com SLUS625D – SEPTEMBER 2004 – REVISED OCTOBER 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312A FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology

TDA 11136

Abstract: SLUA379 SLUU265A bq20z70-V150 SLUA359 SLUA372 0x2673 TDA 1343 code BQ voltage protection for n cell lion battery SBS 15 battery
Contextual Info: bq20z70-V150 + bq29330, bq20z75 Technical Reference Manual Literature Number: SLUU265A October 2006 – Revised August 2007 2 SLUU265A – October 2006 – Revised August 2007 Submit Documentation Feedback Contents 1 2 Preface . 7

TDA 12110

Abstract: TDA 3116 BQ20Z65-R1
Contextual Info: bq20z60-R1/bq20z65-R1 Technical Reference Literature Number: SLUU386 January 2010 2 SLUU386 – January 2010 Submit Documentation Feedback Copyright 2010, Texas Instruments Incorporated Contents 1 Preface 1.1 1.2 2 . 7

NC-SMQ92

Abstract: SN63
Contextual Info: • VPOL5A-5-SMT Content 1. INTRODUCTION 2. MODELS 3. SMT CONVERTER FEATURES 4. GENERAL DESCRIPTION 4.1 Electrical Description 4.2 Thermal Packaging and Physical Design. 5. MAIN FEATURES AND FUNCTIONS 5.1 Operating Temperature Range 5.2 Over-Temperature Protection OTP

AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

HUmiseal 1B73

Abstract: CLD-AP25 Dow Corning 1-2577 HUmiseal Dow corning 3-1953 nc-smq92 SN62 PB36 ag2 pliobond 1B73 NC-SMQ92J
Contextual Info: Cree XLamp® LED 焊接和处理 XLamp XP 系列 LED 本应用说明适用于 XLamp XP 系列 LED ： XLamp XP-CXP-E 和 XP-G LED，它们的订购代码 格式如下 ： XPxxxx-xx-xxxx-xxxxxx 此应用说明解释了在制造过程中，应当如何处理 XLamp XP 系列 LED 和含有这些 LED 的组件。

NC-SMQ92J solder paste

Abstract: NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram
Contextual Info: Cree XLamp® LED Soldering & Handling XLamp MP-L EasyWhite LEDs This application note applies to XLamp MP-L EasyWhite LEDs which have order codes in the following format: MPLEZW-XX-XXXX-XXXXXXXXX This application note explains how XLamp MP-L EasyWhite LEDs and assemblies

HUmiseal 1B73

Abstract: HUmiseal NC-SMQ92J CLD-AP25 1b73 Solder Paste, Indium, Type 3 cree led Cree optics hydrocarbon polymeric arctic silver alumina
Contextual Info: Cree XLamp® LED Soldering & Handling XLamp XP Family LEDs This application note applies to XLamp XP Family LEDs: XLamp XP-C, XP-E & XP-G LEDs, which have order codes in the following fomat: XPxxxx-xx-xxxx-xxxxxx This application note explains how XLamp XP Family LEDs and assemblies

pliobond 20

Abstract: Dow Corning 1-2577 1B73 Dow corning 3-1953 HUmiseal HUmiseal 1B73 Loctite 4105 NC-SMQ92J Loctite sumo radio shack led
Contextual Info: Cree XLamp® LED 焊接和处理 XLamp 4550 与 XR 系列 LED 本应用说明适用于 XLamp 4550 与 XR 系列（XR-EXR-C 和 XR）LED，它们的订购代码格式分别如下： XL4550xx-xx-xxxx XR7090xx-xx-xxxx XRCxxx-xx-xxxx-xxxxxx XRExxx-xx-xxxx-xxxxxx

Contextual Info: C IT I LAN83C175 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION LAN83C175 - EPIC/C Ethernet CARDBUS Integrated Controller With Modem Support FEATURES IEEE 802.3 Com pliant 10/100 Mb/s Ethernet Controller Fully Com pliant Glueless Integrated CardBus Interface

D2061 transistor

Abstract: B1ABCF000176 C1BA00000407 r2003 TRANSISTOR c5536 C1BB00000732 C2068 B0BC7R500001 B1BACD000018 B1AACF000064
Contextual Info: ORDER NO. MD0604120A3 DVD Stereo System SA-VK650GCP Colour S . Silver Type Please use this manual together with the service manual for Model No. [SA-VK650GC/GN/GS/GCS/GCT-S, Order No. MD0604118C3]. Specifications n SYSTEM SC-VK650(GCP) Notes: Music Center: SA-VK650 (GCP)

Contextual Info: Technical D ata_ CD54/74AC373, CD54/74AC533 CD54/74ACT373, CD54/74ACT533 D O - 373 533 -0 0 00 0 1 - - Q1 01 02- -02 -03 02 53 -0 4 -0 5 -06 05 56 - 07 5> 0 3 -0 4 -0 5 -0 6 -0 7 -L E - 1

Lead Free reflow soldering profile BGA

Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Contextual Info: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array