MTE28 Search Results

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80H36-UV Peak Emission Wavelength: 280nm The MTE280H36-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-5 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80H33-UV Peak Emission Wavelength: 280nm The MTE280H33-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-5 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80H21-UV Peak Emission Wavelength: 280nm The MTE280H21-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-46 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80H41-UV Peak Emission Wavelength: 280nm The MTE280H41-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-46 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 280F13-UV Peak Emission Wavelength: 280nm The MTE280F13-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-39 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80SMD-UV Peak Emission Wavelength: 280nm The MTE280SMD-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a SMD package with a special UV glass lens for optimum life time and device

Contextual Info: Ultraviolet Emitter Product No: M T E 2 80H32-UV Peak Emission Wavelength: 280nm The MTE280H32-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-46 hermetically sealed package with a special UV glass lens for optimum life time and

Contextual Info: Ultraviolet Emitter Product No: M T E 280F11-UV Peak Emission Wavelength: 280nm The MTE280F11-UV UV emitter is a specifically designed for applications requiring high radiant power output and accuracy in a TO-18 hermetically sealed package with a special UV glass lens for optimum life time and

SmD TRANSISTOR a42

Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

vjp44a

Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

iso 1043-1

Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

T03A

Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

MTD32

Abstract: MTC24 MTA20 MTB24 MTC08 MTC14 MTC16 MTC20 MTE38
Contextual Info: Thin Shrink Small Outline Package TSSOP 8 Lead Molded Thin Shrink Small Outline Package NS Package Number MTC08 1999 National Semiconductor Corporation MS101178 www.national.com Thin Shrink Small Outline Package (TSSOP) May 1999 14 Lead Molded Thin Shrink Small Outline Package