MQFP 52 PACKAGE Search Results

on 5295

Abstract: on 5295 transistor MQFP 52 PACKAGE
Contextual Info: a 0.95 0.0374 0.80 (0.0315) 0.65 (0.0256) 52-Lead MQFP Package (S-52) Dimensions shown in millimeters and (inches) 13.45 (0.5295) 13.20 (0.5197) SQ 12.95 (0.5098) 2.45 (0.0965) MAX 39 27 40 SEATING PLANE 26 7.80 (0.3071) REF 10.11 (0.3980) 10.00 (0.3937) SQ

MS-022-AC

Abstract: s52-1 S521
Contextual Info: a 52-Lead Metric Quad Flat Package [MQFP] S-52-1 Dimensions shown in millimeters 1.03 0.88 0.73 13.45 13.20 SQ 12.95 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10؇ 6؇ 2؇ 2.20 2.00 1.80 0.25 0.10 VIEW A ROTATED 90؇ CCW 10.20 10.00 SQ 9.80 (PINS DOWN)

s522

Contextual Info: a 52-Lead Metric Quad Flat Package [MQFP] S-52-2 Dimensions shown in millimeters 1.03 0.88 0.73 14.15 13.90 SQ 13.65 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10.20 10.00 SQ 9.80 (PINS DOWN) 10؇ 6؇ 2؇ 2.10 2.00 1.95 0.25 MIN VIEW A 0.23 0.11

MQUAD

Contextual Info: MECHANICAL DATA MMQF010 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK MEP (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° ā 0,60 0,40 Seating Plane

Contextual Info: MECHANICAL DATA MMQF009 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK (DIE-DOWN) MEO (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° 0,60 0,40 Seating Plane

ICL7109

Abstract: PDIP-40 ICL7109CPL icl7109cqh icl7109ejl
Contextual Info: Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. Package Information

CXD1160aq

Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
Contextual Info: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

VL82C486-FC2

Abstract: NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ
Contextual Info: Issued November 1994 018-994 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

JESD51-7

Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Contextual Info: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull

HI-7159

Abstract: ICL7135 HI3276 HI-5701 HI5714 HI5746 HI-574A HI5766 HI5767 ISL51002
Contextual Info: Data Converters 5 2008 P RODUCT S ELECTION GUIDE Data Converters pg. 5-1 1-Channel (ADCs) (pg. 5-2) 1-Channel (DACs) (pg. 5-4) 2-Channel (ADCs) (pg. 5-3) 2-Channel (DACs) (pg. 5-5) Integrating Display Output (A-D) Data Converters (pg. 5-3) Non-Volatile DACs

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

ad1882 soundmax integrated digital audio

Abstract: AD1845 AD1835 AD1986A AD74111 op27 ad1836aasz
Contextual Info: Analog Devices AD1836A - Multichannel 96 kHz Codec Search: Parametric Search | Page 1 of 6 Replacement Parts Search View Cart | My Acco Home > Audio/Video Products > Audio CODECs Contact Us Audio/Video Products Analog/HDMI/DVI Interfaces Audio A/D Converters

ms 022 gc 1

Abstract: nqfp MS-022 BAS76
Contextual Info: -m A -ED D1 2 D 2 IBimiRHBIBiHI IMHMmiHIIIIH T~ AA IB 111111111111111 iimiw tas 4x H aaa 1CIA-B |D i iÆ . 4XlQ|bbb|C|A-BlD| / s _ n j SEATING PLANE N-4 X A AAA \ ÎA l O U DETAIL B e hETôTTôTc V r -DETAIL C NX b 10] ccc (9>1Cl A-B <SlD0] A FIGURE 1 PRINCIPAL DIMENSIONS I DATUMS

YPBPR TO VGA

Abstract: rgb to vga circuit datasheet composite video converter CGMS-A Composite Video to VGA LQFP Package NTSC/PAL to RGB/VGA Encoding vga to composite composite video to vga converter MQFP 80 PACKAGE
Contextual Info: Analog Devices: Data Converters: Video Encoder Products Selection Table Page 1 of 2 Video Encoder Products Selection Table Digital Video Encoders High Definition Digital Video Encoders ADV7330 ADV7314 ADV7312 ADV7310/11 ADV7304A/05A ADV7302A/03A ADV7300A/01A ADV7197 ADV7196A ADV7195

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

Contextual Info: Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

ISL6247CR

Abstract: ISL3880IK EL6119CL ISL6225A 4080A EL4093 ISL3871IK18 TA52607BR48 l 871i HIP2101IR
Contextual Info: Intersil’s Pb-Free and Green Initiatives November, 2004 TB428.4 Pb-Free/Green Definitions & Drivers • • Definitions – Pb-Free: Lead Content <0.1wt% – Green: Halide Content and PDD & PBDE < 0.1wt% Sb, Pb, Hg, and Cr+6 < 1000 ppm Cd < 100 ppm Drivers

Rbl 69

Abstract: HC5519 HC5519CQ
Contextual Info: HC5519 S E M I C O N D U C T O R ADVANCE INFORMATION SLIC Subscriber Line Interface Circuit January 1997 Features Description • Complete A-Law Codec, Filter, and SLIC Functions with Serial Digital Control and Status Monitoring The HC5519 SLIC is designed to meet the technical requirements of the China Telecommunications network. It provides

1N737

Abstract: 1N14 1N10 2916B 1N15 LSP2916 LSP2916A LSP2916B BA 1N16 BA 1N11
Contextual Info: a8e re AdLib systems OCR Evaluation Preliminary Data Sheet July 2001 LSP2916 16-Channel, High-Voltage Driver Features . 16 amplifier channels available in one package . . Outputs from 0 V to -298 V per channel . . Programmable output current limit 50 pA to

B272

Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

B272

Abstract: 203d6
Contextual Info: ispLSI 3160 High Density Programmable Logic Features Functional Block Diagram E3 E2 E1 E0 A0 ORP OR Array ORP A2 A3 D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP • HIGH PERFORMANCE E CMOS TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency — tpd = 7.5 ns Propagation Delay

B272

Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

XLT08SO

Abstract: XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint
Contextual Info: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION 2005 Microchip Technology Inc. DS51194L Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.