MPSU 10 Search Results

h7673

Abstract: 360-Pin MPSU 60 transistor tray dimensions BGA21
Contextual Info: TRAY CONTAINER UNIT : mm 5 x 12=60 20.15 135° C MAX. 23.90 BGA21 × 21A A' 21.20 23.90 26.05 21.20 NEC 95.6 135.9 MPSU A 262.9 315.0 322.6 SECTION A-A' (4.62) 6.35 7.62 21.20 Applied Package Quantity (pcs) 360-pin Plastic BGA (21×21) (FLIP CHIP TYPE)

Contextual Info: 125°C BAKE/140°C MAX 109.9 13.00 15.70 TQFP 10x10 1.0T 135.9 UNIT : mm 12.37 A A' 15.20 12.37 288.8 13.1 315.0 322.6 SECTION A-A' 6.35 7.62 12.37 6.401 Applied Package Quantity (pcs) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 160 Tray Material

0615

Abstract: ND1414 JEDEC tray standard TQFP MPSU 140
Contextual Info: ND1414 1.0 0615 6 105.0 A' 21.00 15.45 A 150°C MAX. 135.9 UNIT : mm 16.4 20.30 16.4 15.40 284.2 315.0 322.6 SECTION A – A' 16.4 5.97 7.62 6.35 14.0 Applied Package Quantity (pcs) 100-pin Plastic TQFP(1.0mm thick) 120-pin Plastic TQFP(1.0mm thick) MAX. 90

JEDEC TRAY DIMENSIONS

Abstract: TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 shipping tray jedec tray scale TSOP package tray
Contextual Info: _L _L _L 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 208. 3. TRAY VACUUM PICKUP METHOD REQUIRES A 28m m SQUARE MINIMUM WALLED PICKUP AREA , LOCATED AS CLOSE TO

Contextual Info: 17.90 14.6 286.4 14.30 14.6 ND 1212 1.0 0717 6 A' 18.00 13.95 A 150 C MAX. 108.0 135.9 UNIT : mm 315.0 322.6 SECTION A – A' 14.6 6.22 6.35 7.62 11.93 Applied Package Quantity (pcs) 64-pin Plastic TQFP(1.0mm thick) 80-pin Plastic TQFP(1.0mm thick) MAX. 119

tqfp 7x7 tray

Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Contextual Info: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1

DAEWON tray drawing

Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
Contextual Info: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.

MJE520

Abstract: bd189 sc 6038 MJE12007 MOTOROLA 527 33A mj4647 mje13006 BD 433NPNTO-126 Je105 mps-u
Contextual Info: MOTORCLA SC XSTRS/R F 12E D | t3t?5SM aüâ4m ? T | T -9 1 -0 1 Selection By Package Motorola power transistors are available in a wide variety of metal and plastic packages to match thermal, electrical and cost requirements. The following table com pares the basic

DAEWON tray drawing

Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
Contextual Info: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN

TRAY 15X15

Abstract: bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515
Contextual Info: I AMSUN ELECTRONICS KS8664B_ CDMA/AMPS Dual Mode Modem Processor DATA SHEET Ordering July, Information Dev ice Package KS8664B 196PBGA KS8664BQ 176TQFP 1999 CDMA Team System LSI/Semiconductor SAMSUNG Electronics Co., LTD. [\D r\D ^ Uí KÍ I— o

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
Contextual Info: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*

DAEWON tray drawing

Abstract: IL110 daewon tray 12C05 daewoo tray
Contextual Info: DUTUL DOT KAVMG DATE APPROVED 13/17/20« SA CHJNG 6 .3 5 SEE D ETA IL 'D ' 10.20 M l A l Z 1 7 ,6 2 m 92.1 SECTI DN ' X - X * SECTI DN *Y-Y* TRAY STACKING D E TA I L SCALE i 3/1 12.7 S E E D E TA IL ' F ' ( S E E SHT.#2> C H A M FE R 3 .0 X 4 5\M + 3 A 1 C 6

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing JEDEC TRAY 10 X 10
Contextual Info: 12_I_ U _ I_ 10_ I_ 9_ I_ 8_ I_ 7_ I_ 6_ I_ 5_ I_ 4_ I_ 3_ I_ 2_ I_ 1

12CD6

Contextual Info: M IE APPROVED OE/IB/ESOO SA CHJNG — 6.35 SEE DETAIL 'D' — 7.62 in frl0.20 M IAIZ(M ) MH0.20(M)IAIX(M)I 92.1 SECTIDN SECTIDN * X- X* TRAY STACKIN G SEE DETAIL 'F' (SEE SHT.#2) 1.6 R. 3 PLACES 7\M+3A1C6 3.11 [EH xxxxxxx CABGA loi0.76 I DETAIL 'H' 8XR2.54 MAX — >

DAEWON tray drawing

Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Contextual Info: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect

Contextual Info: TH IS DRAW ING IS ta/u/w m a ama. mere ft DAEW DN P R O P R IE T A R Y ND CDPY IS ALLOVEI] VITHDUT DAEMON'S PERMISSION [ -6 .3 5 H f lH M E E a - 7,6£ - — i3e.oa 311.15 - m + -8 :f: +0.25 +0.25 -a i3 -0,13 - 31166 — < - 132.59 — i $ io.2Q<h>i m z <B>

3469b

Abstract: daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU
Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-35 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048

LEI-4

Abstract: E1A-541 RE53 JEDEC TRAY 10 X 10
Contextual Info: •V i THIS DRAWING IS A DAEWDN PRDPRIETARV 3MTW. ELCm *m imunn JL/Mflft •1 ISM ND COPY IS ALLOWED WITHGUT DAEWUN'S PERMISSIDN KH0.20<EDIAIXfl -6 .3 5 - -7 .6 2 WH020(H IAIZW1 311.15 — -1 3 2 .0 8 — m +0.25 -013 1 3 B 5 9 - ■ » lo .g o a iiA iz W I

DAEWON JEDEC TRAY 10 X 10

Abstract: daewon MPSU 140 LEI-4 DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Contextual Info: <322.65 — 6.35 • 315.0 - VACUUM PICKUP CELLS 14 PLACES 12 CENTER CELLS, 2 SIDE CELI — 7.62 V BBUMPS l 7 PLACES = 1 E jE E T ilB D ii] mo.20(H iAiz(n>i - 311.15-+0.25 -0.13 - 132.08-+0.25 -0.13 Vj r a X H* Da +0.25 -0.13 - 132.59-M0.20(H)IAIZ<H>

DAEWON JEDEC TRAY

Abstract: DAEWON JEDEC TRAY 10 X 10 JEDEC tray standard 17 x 17 JEDEC tray standard 13 jedec tray scale TRAY DAEWON MPSU DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Contextual Info: 06/09/8000 SA CHUNG • 3 2 2 .6 - -6.35 SEE DETAIL 'D' VACUUM PICKUP C E L L S 14 P L A C E S (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 P L A C E S 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9

MPS8000

Abstract: MPS-U31 MPS-8000 citizen mhz MPS8001 ic rf 961
Contextual Info: MPS8000 SILICON NPN S IL IC O N A N N U L A R R F T R A N S IS T O R 625 mW - 27 MHz R F D R IV E R T R A N S IS T O R . . . designed for use in Citizen-Sand Com munications equipment operating to 30 MHz. High current gain available for driver applica­

MPSU45 REPLACEMENT

Abstract: MPSU06 equivalent Motorola MPSU45 mpsu07 equivalent MPSU45 mpsu95 equivalent MPSU10 equivalent mps-u56 equivalent MPSU51 equivalent MPS-U05
Contextual Info: 1 CENTRAL SEMICONDUCTOR b l DE | n tm b B □DDDS40 T ~Ö Z - |T Central's CEÜ-U o I Ideal second source for Motorola’s MPS-U series power transistors Exact electrical equivalent in JE D E C TO-202 case._ • Superior power dissipation p D t A = 25 °C 1.75 W atts vs. 1.0 W att Motorola

poly aluminum chloride

Abstract: rubidium radioactive
Contextual Info: ‹ Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials