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    MLP08C Search Results

    MLP08C Datasheets Context Search

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    SJ 38

    Abstract: qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14
    Contextual Info: Revised February 2004 Logic and Switch Products Ordering Information Ordering Information TinyLogic is a trademark of Fairchild Semiconductor Corporation. CROSSVOLT, FACT, FACT Quiet Series, FAST, FASTr, and MicroPak are trademarks of Fairchild Semiconductor Corporation.


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    MS012540 SJ 38 qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14 PDF

    FIN1027

    Abstract: FIN1028 FIN1028M FIN1028MPX M08A MO-229
    Contextual Info: Revised June 2003 FIN1028 3.3V LVDS 2-Bit High Speed Differential Receiver General Description Features This dual receiver is designed for high speed interconnects utilizing Low Voltage Differential Signaling LVDS technology. The receiver translates LVDS levels, with a typical differential input threshold of 100 mV, to LVTTL signal levels.


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    FIN1028 400Mbs FIN1028 FIN1027, FIN1027 FIN1028M FIN1028MPX M08A MO-229 PDF

    FIN1027

    Abstract: FIN1028 FIN1028K8X FIN1028M FIN1028MPX M08A
    Contextual Info: Revised May 2004 FIN1028 3.3V LVDS 2-Bit High Speed Differential Receiver General Description Features This dual receiver is designed for high speed interconnects utilizing Low Voltage Differential Signaling LVDS technology. The receiver translates LVDS levels, with a typical differential input threshold of 100 mV, to LVTTL signal levels.


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    FIN1028 400Mbs FIN1028 FIN1027, FIN1027 FIN1028K8X FIN1028M FIN1028MPX M08A PDF

    IPC-7525

    Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
    Contextual Info: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in


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    AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220 PDF

    FIN1027

    Abstract: FIN1027A FIN1027AM FIN1027AMX FIN1027K8X FIN1027M FIN1027MPX FIN1027MX FIN1028
    Contextual Info: Revised June 2003 FIN1027 FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver General Description Features This dual driver is designed for high speed interconnects utilizing Low Voltage Differential Signaling LVDS technology. The driver translates LVTTL signal levels to LVDS levels with a typical differential output swing of 350 mV which


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    FIN1027 FIN1027A 600Mbs FIN1027 FIN1027A FIN1028, TIA/EIA-644 FIN1027AM FIN1027AMX FIN1027K8X FIN1027M FIN1027MPX FIN1027MX FIN1028 PDF