with or without underfill
Abstract: WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX 21mmx25mm
Contextual Info: PowerPC 755E/8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C755E8M-XBX Features • 300 or 350 MHz 755E Rev RISC µProcessor • 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for
|
Original
|
755e/8mbitwed3c755e8m-xbx128kx7225x21mm+9525mm2x64/x72wed3c755e8mmif2032with or without underfillwed3c7410e16m-400bxwed3c750a8m-200bxwed3c7558m-xbx21mmx25mm
|
PDF
|