MC 4528 Search Results

ANSI C78.377

Abstract: CREE MCE RGBW LM 3751 Lm 4046 cree lm
Contextual Info: CLD-AP20 Rev 7A binning & labeling Cree XLamp MC-E LED ® MC-E White MC-E Color Introduction MC-E Dynamic White table of contents This document describes the product nomenclature Introduction. 1 required to select and order Cree XLamp MC-E LEDs.

CREE MCE

Abstract: cree led mce lm 3844 LM 386-3 3874 Cree optics transistor k 4212 wp 4046 4017
Contextual Info: Cree XLamp® MC-E LED Binning and Labeling Introduction This document describes the product nomenclature required to select and order Cree XLamp MC-E LEDs. XLamp MC-E LEDs are tested and sorted into bins which are then combined into orderable kits identified by an order code.

LM 4138

Abstract: k 3919
Contextual Info: CLD-AP20 REV 6 BINNING & LABELING Cree XLamp MC-E LED ® INTRODUCTION TABLE OF CONTENTS This document describes the product nomenclature Introduction. 2 required to select and order Cree XLamp MC-E LEDs.

ec81 TUBE

Abstract: MC 4528 4528 EC81 philips BC ec81w
Contextual Info: PHILIPS fÊcsi UHF OSCILLATOR TRIODE up to 750 Mc/s TB IODE OSCILLATRICE U.H.F.( Jusqu'à 750 Jîo/s) UHF-OSZILLATORTRIODE (bis 750 MHz) Heating : indirect by A.C.or D.O. parallel supply Chauffage: indirect par C.A.ou C.C. alimentation- parallèle Heizung s indirekt durch Wechselöder Gleichstrom

0650

Contextual Info: 0.650" 0.650" top and bottom pad width only see side view for side pad width 0.503" 0.018" typ. Top View 1 0.050" typ. 0.018" dia. typ. 2 0.250" 0.062" MO 12/1 MC Side View .65 mm 0.015" typ. Rev Cha Upd B A compatible target board land dimensions A< 0.590"

Contextual Info: F-205-1 M M C X -P -P -H -S T -T H 1 M M C X -J-P -H -S T -T H 1 M MC X -J -P -H -R A -T H 1 in ru u y ii \ JEWMICRO-MINI RF THRU-HOLE SERIES SPECIFICATIONS For complete specifications see www.samtec.com?MMCX-TH C ontact Material: BeCu Insu lator Material:

irfb4115

Abstract: BTY79 equivalent diode skn 21-04 marking CODE W04 sot-23 bbc 598 479 DIODE mw 137 600g TFK 401 S 673 Vishay Telefunken tfk transistor INFINEON transistor marking W31 JYs marking transistor
Contextual Info: 573 Technical portal and online community for Design Engineers - www.element-14.com Discrete & Power Devices Page 700 Bridge Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . Diodes Schottky . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: C200H-MC221 Motion Control Unit Operation Manual: Details Revised January 1999 iv Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator and only for the purposes described in this manual. The following conventions are used to indicate and classify precautions in this manual. Always heed

JRC 45600

Abstract: YD 803 SGS 45600 JRC TDA 7277 TDA 5072 krp power source sps 6360 2904 JRC Sony SHA T90 SA philips HFE 4541
Contextual Info: I SEMICON INDEXES Contents and Introduction Manufacturers' Information V O LU M E 3 INTERNATIONAL INTEGRATED CIRCUITS INDEX 15th EDITION 1997 Numerical Listing of Integrated Circuits Substitution Guide U D C 621.382.3 Diagram s THE S E M IC O N INTERNATIONAL INDEXES

logos 4012B

Abstract: 1LB553 Rauland ETS-003 Silec Semiconductors MCP 7833 4057A transistor sr52 74c912 1TK552 74S485
Contextual Info: L p i > « , * S E m Ic O N VOLUM E 3 INTERNATIONAL INTEGRATED CIRCUITS INDEX 5th EDITION 1985 Revised June 1985 COMPILED AND PUBLISHED BY S E M IC O N IN D E X E S L IM IT E D THE SEMICON INDEX SERIES CONSISTS OF VOLUME 1 TRANSISTOR INDEX VOLUME 2 DIODE & SCR INDEX

PA-QIP70-01

Contextual Info: 0.600" 0.400" 0.100" 0.050" 1991 I.E. 1.800" QIP70-01/02 0.100" Top View 1.000" Side View 0.297" 0.173" 0.300" Side View with Wire Wrap Pins 0.018" 0.193" 0.700" 0.025" sqr. PA-QIP70-01 Drawing © 1995 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121

SF-QFE144SB-L-01

Abstract: QFP132-G-01 qfp132
Contextual Info: Surface mountable QFP emulator foot; leadless version, sized to fit on 144 Body + 3.9mm. position 0.65mm. pitch land pattern. 1.220" 0.050" 0.018" 0.250" 0.063" 0.65mm 1.220" A Substrate: FR4/G10, 0.0625"±0.007" thick. Pins: Material - Brass Alloy 360, 1/2H ; finish - 10µ" Gold over 100/150µ" Nickel.

SF-PLCC52-J-05

Contextual Info: 0.050" 1 47 8 2 0.770" 34 21 2 0.770" 0.050" 0.018"±0.001" dia. 1 0.266" Top View 0.094" Side View 1 2 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Description: Surface Mount PLCC emulator foot (low profile)

dip32

Contextual Info: 0.700" 1.600" 0.100" typ. 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 0.600" 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: 0.700" DIP20-02 PCB 1991 I.E. 1.000" 1 0.600" 3 0.173" 0.297" 2 0.020" 0.400" 0.6" Female -0.4" Male PC-DIP/DIP20-02 Drawing © 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: 651 452-8100 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

Contextual Info: 0.500" 1.400" 1 0.400" 3 0.173" 0.288" .4"F-.3"M 0.018" 0.300" PC-DIP/DIP28-05 Drawing 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

Contextual Info: 0.700" 1.400" 1 0.600" 3 0.173" 0.297" .6"F-.3"M 0.018" 2 0.300" PC-DIP/DIP28-03 Drawing 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

DIP64

Abstract: DIP-64
Contextual Info: 3.200" 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: 0.700" 1.600" 1 Top View 0.600" 3 0.173" 0.297" 0.020" 2 0.400" End View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .

Contextual Info: 1.600" 1 0.382" 0.700" 0.297" 0.173" 2 3 0.018" Dia. Typ. 0.600" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

SF-PLCC84-J-01

Contextual Info: Pin 1 75 12 75 1 12 54 33 Top View with pin assignments 54 33 Side A 0.050" typ. 0.018"±0.001" dia. typ. 0.373" 0.207" Side View 0.050" typ. 0.017" 1.136" 1.186" A compatible target board land dimensions A< 1.096" B> 1.176" Generic pattern not representative

DIP64

Contextual Info: 1.000" 3.200" 1 0.900" 0.297" 0.173" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: 1 22 1 22 11 12 0.800" 0.100" 1 12 0.400" 3 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

qfp132

Abstract: SF-PLCC84-J-05 QFP132-G-01
Contextual Info: Pin 1 75 12 75 1 12 54 33 Top View with pin assignments 54 33 0.050" typ. 0.018"±0.001" dia. typ. 0.264" 0.098" Side View 0.017" 0.050" typ. 1.136" 1.186" A compatible target board land dimensions A< 1.096" B> 1.176" Generic pattern not representative of actual land