MARKING WLC Search Results

nxp Standard Marking

Contextual Info: R_10001 Guideline for the laser marking layout of WLCSP devices Rev. 01 — 10 February 2010 Report Document information Info Content Title R_10001 Short title 1 line R_10001 Subtitle Guideline for the laser marking layout of WLCSP devices Short subtitle (1 line) WLCSP marking guideline

STK and STR integrated circuits

Abstract: transistor smd zG 1e STR-Z4579 Turuta 6 pin TRANSISTOR SMD CODE PA transistor 5d smd ELM85361A STK and STR integrated circuits, 2011 edition 5g smd transistor 15D diode smd code
Contextual Info: SMD-codes DATABOOK Active SMD semiconductor components marking codes • 235.000 SMD-codes for active semiconductor components: • Diodes, Transistors, Thyristors, Integrated Circuits • Case pin assignment • Pinout • Marking style • Schematic diagram

ME-R1113Z-0310

Abstract: R1113Z Series R1113Z R1113Z201B
Contextual Info: POWER MANAGEMENT ICs MARK INFORMATIONS R1113Z SERIES MARK SPECIFICATION • WLCSP-4-P1 : F Fixed 1 1 • 2 3 2 , 3 : Lot Number Part Number vs. Marking Part Number Product Code Part Number 1 Product Code 1 R1113Z151B F R1113Z301B F R1113Z161B F R1113Z311B

Contextual Info: MARK INFORMATION ME-R5326Z-070806 R5326Z SERIES MARK SPECIFICATION • WLCSP-6-P1 : H Fixed 1 1 • 2 3 2 , 3 : Lot Number Product Code vs. Marking (A part number is discriminable from a product code and a lot number) Part Number Product Code Part Number

ME-R5323Z-0505

Contextual Info: MARK INFORMATION ME-R5323Z-0505 R5323Z SERIES MARK SPECIFICATION • WLCSP-6-P1 : G Fixed 1 1 • 2 3 2 , 3 : Lot Number Product Code vs. Marking Part Number Product Code Part Number 1 Product Code Part Number 1 Product Code Part Number 1 Product Code 1

GPI048

Abstract: upd3 PD30111
Contextual Info: ¿¿PD30111 NEC 23. ELECTRICAL SPECIFICATIONS This section shows the electrical specifications of versions 1.1 and 2.0 of the V r41 11. The revision is identified by the marking in the top of the package. 23.1 Version 1.1 Absolute Maximum Ratings T a = 25°C

a 3101

Contextual Info: BJB Product Details Page 1 of 1 Home > Lampholders > Low Voltage Halogen Lampholders > GU5.3 25.105.3101 1/1 Part No. 25.105.3101.00 Color other 1/1 Package qty. 500 Wt. 8 Screw mount 12 mm centers T-Marking: 250 Connection: Cable PTFE, rear cable entry Housing: Housing ceramic

Contextual Info: CM1457 4-, 6-, 8-Channel EMI Filter Array with ESD Protection Description • Four, Six or Eight Channels of EMI Filtering • ±15 kV ESD Protection IEC 61000−4−2, Contact Discharge at • • • WLCSP15 CP SUFFIX CASE 567BR WLCSP10 CP SUFFIX CASE 567BJ

WLCSP66

Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
Contextual Info: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.

WLCSP stencil design

Abstract: PI0297 JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code
Contextual Info: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.

maxim CODE TOP MARKING

Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Contextual Info: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and

WECR64

Abstract: hokuriku
Contextual Info: Wide Terminal Type Chip Resistor Hokuriku Electric Industry Co.,Ltd 【Model Number】 WECR*/WLCR*/WCR* 【Features】 •Due to wide side terminal, high power handling was achieved. Compared to same size other type, 1～2 higher rank is possible） possible）

2388x

Abstract: WLCSP-26
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP26, 2.388x2.233 CASE 567CY−01 ISSUE O DATE 02 NOV 2010 SCALE 4:1 D PIN A1 REFERENCE 2X 0.10 C 2X 0.10 C ÈÈ ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.

WLCSP35

Abstract: WLCSP-35 WLCSP
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP35, 3.63x2.68 CASE 567AG−01 ISSUE A SCALE 4:1 PIN A1 REFERENCE ÈÈ ÈÈ D A DATE 02 NOV 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

POWER STBY CONTROL Circuit

Abstract: ROHm marking 1F
Contextual Info: 1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT CMOS-type Series Regulator ＢＨＸＸＳＡ３ＷＧＵＴ Series TYPE FEATURE ○Circuit Current 40 A ○0.96mm x 0.96mm x 0.6mm 4pin WLCSP ○Built-in Over Current Protection ○ABSOLUTE MAXIMUM RATINGS Ta=25℃

A96V

Contextual Info: DMN2023UCB4 N-CHANNEL ENHANCEMENT MODE FIELD MOSFET Product Summary Features V BR DSS RSS(ON) Package 24V 26mΩ @ VGS = 4.5V X1-WLB1818-4 IS TA = +25°C 6.0A NEW PRODUCT Description This new generation MOSFET has been designed to minimize the on-state resistance (RDS(ON) with thin WLCSP packaging process

Contextual Info: P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -2.6 A, 140 mΩ Features General Description „ Max rDS on = 140 mΩ at VGS = -4.5 V, ID = -2 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process,

Contextual Info: P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -2.6 A, 140 mΩ Features General Description ̈ Max rDS on = 140 mΩ at VGS = -4.5 V, ID = -2 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process,

Contextual Info: P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -2.7 A, 134 mΩ Features General Description „ Max rDS on = 134 mΩ at VGS = -4.5 V, ID = -2 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process,

Contextual Info: P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -2.7 A, 134 mΩ Features General Description ̈ Max rDS on = 134 mΩ at VGS = -4.5 V, ID = -2 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process,

Contextual Info: FDZ193P P-Channel 1.7V PowerTrench WL-CSP MOSFET -20V, -1A, 90m: Features General Description „ Occupies only 1.5 mm2 of PCB area Less than 50% of the area of 2 x 2 BGA Designed on Fairchild's advanced 1.7V PowerTrench® process with state of the art "low pitch" WLCSP packaging process, the

Contextual Info: FDZ191P P-Channel 1.5V Specified PowerTrenchTM WL-CSP MOSFET General Description Features Designed on Fairchild’s advanced 1.5V PowerTrench process with state of the art “low pitch” WLCSP packaging process, the FDZ191P minimizes both PCB space and RDS ON . This advanced WLCSP MOSFET

Contextual Info: FDZ371PZ P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -3.7 A, 75 mΩ Features General Description „ Max rDS on = 75 mΩ at VGS = -4.5 V, ID = -2.0 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process,

Contextual Info: FDZ197PZ P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -3.8 A, 64 mΩ Features General Description „ Max rDS on = 64 mΩ at VGS = -4.5 V, ID = -2.0 A Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" WLCSP packaging process, the