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    MARKING CODE 213I Search Results

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    MARKING CODE 213I Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC4511BP
    Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, BCD-to-7-Segment Decoder, DIP16 Datasheet
    68305-001LF
    Amphenol Communications Solutions Din Accessory Coding PDF
    65197-001LF
    Amphenol Communications Solutions Din Accessory Coding Part PDF
    70275-001LF
    Amphenol Communications Solutions 70275-001LF-METRAL FEM CODING PART PDF
    91290-101LF
    Amphenol Communications Solutions Board-to-Board Coding System, Receptacle Key, LF PDF

    MARKING CODE 213I Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    2450BM15A0002

    Abstract: 5400BL15B100 2450BM14A0002 microwave product 2450AT42A100 STLC2690 inductor marking Johanson Technology 2450FB15L0001 bluetooth BC05 5400BL15B050
    Contextual Info: CH EA ce /R lian HSmp Ro Co High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)


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    Hz-10 2450BM15A0002 5400BL15B100 2450BM14A0002 microwave product 2450AT42A100 STLC2690 inductor marking Johanson Technology 2450FB15L0001 bluetooth BC05 5400BL15B050 PDF

    2n2 j100

    Contextual Info: CH EA ce /R lian on iti HSmp Ro Co Ed 12 20 High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)


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    Hz-10 2n2 j100 PDF

    MARKING CODE 213I

    Contextual Info: IQMS-200, -210, -220, -230 Series MEMS OSCILLATORS Outline mm - IQMS-200, -201, -202, -203 Description 7.0±0.15 4 oscillators based on the latest MEMS technology with high performance and low jitter ▪▪ 7 x 5mm (IQMS-200, 201, 202, 203) ▪▪ 5 x 3.2mm (IQMS-210, 211, 212, 213)


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    IQMS-200, 2002/95/EC IQMS-210, IQMS-220, IQMS-230, 200MHz MARKING CODE 213I PDF

    0900BL18B200

    Abstract: S805D 500L41L120XG4 smd V05 2450BL15B200 substitution 0900BL18B100 SMD transistor package code V12 SMD package code V12 Johanson Dielectrics marking code v4t
    Contextual Info: C e HlSianc Roomp High Frequency Ceramic Solutions Antennas Baluns Capacitors - Low Loss Couplers Combiners Diplexers Filters - Notch, BP, LP Inductors IPC’s Integrated Passive Components Modules 90 Hybrids Substrates 931 VIA ALONDRA, CAMARILLO, CALIFORNIA 93012 • TEL (805) 389-1166 • FAX (805) 389-1821


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    TCAT-1103 0900BL18B200 S805D 500L41L120XG4 smd V05 2450BL15B200 substitution 0900BL18B100 SMD transistor package code V12 SMD package code V12 Johanson Dielectrics marking code v4t PDF

    Contextual Info: High Frequency Ceramic Component Solutions 931 VIA ALONDRA, CAMARILLO, CALIFORNIA 93012 • TEL 805 389-1166 • FAX (805) 389-1821 2 www.johansontechnology.com Your Technology Partner With over 15 years of experience, Johanson Technology Incorporated can provide you


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    ISO9001-certified 100/TRAY PDF

    Au Sn eutectic

    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, Au Sn eutectic PDF

    Contextual Info: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-202, 204-G, MIL-S-883, 210-C, 213-I, PDF

    Contextual Info: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, PDF

    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS Key FeaTuReS • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-202, 204-G, MIL-S-883, 210-C, 213-I, PDF

    500UDDB200JG4W

    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-202, 204-G, MIL-S-883, 210-C, 213-I, 500UDDB200JG4W PDF

    Contextual Info: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, PDF

    gaas f25 marking code

    Abstract: 471 E25 RF Transistors Ceramic MARKING F25 BD160
    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Six SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, gaas f25 marking code 471 E25 RF Transistors Ceramic MARKING F25 BD160 PDF

    Au Sn eutectic

    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Six SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, Au Sn eutectic PDF

    Au Sn eutectic

    Contextual Info: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Six SLC Device Types to Fit Many Applications:


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    MIL-S-883, MIL-S-202, 210-C, 213-I, 204-G, Au Sn eutectic PDF

    LTLS E3

    Abstract: SO-8 LTLS e3 TFK 7 segment displays TFK U 212 B 80286 architecture bc 107 equivalent l4fl Scans-049 lc 3101 led TIL Display
    Contextual Info: FliE FORMATS FOR POPUIAR PC SOFTWARE A PROGRAMMER'S REFERENCE Jeff W alden Computers n Read and write the data files of today’s most popular programs—in the same formats those programs use. MORE FHE FORMATS FOB POPU1AB PC SOFTWARE A PROGRAMMER'S REFERENCE


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    RCA SK CROSS-REFERENCE

    Abstract: CD4003 2N2505 TF408 1N4465 250PA120 2N3017 pt 3570 trw rf pa189 Semicon volume 1
    Contextual Info: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered


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