LTCC CHIP Search Results

dupont 951

Abstract: dupont 951 green tape dupont 9k7 dupont 943 CT702 heraeus CT-702
Contextual Info: LTCC Design Guide 800-544-2414 > www.anaren.com About this LTCC Design Guide This LTCC Design Guide reflects the current LTCC capabilities of Anaren Ceramics’ facility and experience. We’ve provided it to assist you in the initial evaluation of your design’s compatibility with the LTCC technologies we offer – as well as to

CT702

Abstract: dupont 951 dupont 951 green tape CT-702 dupont 943 heraeus Ceramic Resonator GHz DSA004570 ltcc chip Ferro
Contextual Info: LTCC Design Guide 800-544-2414 > www.anaren.com About this LTCC Design Guide This LTCC Design Guide reflects the current LTCC capabilities of Anaren Ceramics’ facility and experience. We’ve provided it to assist you in the initial evaluation of your design’s compatibility with the LTCC technologies we offer – as well as to

LTCC

Abstract: ltcc chip
Contextual Info: LTCC SUBSTRATES LTCC LTCC MULTILAYER SUBSTRATES KLC STRUCTURE ⑩ ① 1 2 3 4 5 6 7 8 9 10 ② ⑨ ③ ⑧ ④ ⑦ ⑥ Cavity IC-chip Conductor pattern Via Capacitor Thermal via Inductor Transmission line Buried resistor Surface resistor All these products meet

ltcc

Abstract: ltcc antenna FR4 substrate with dielectric constant 4 LTCCAAB62 parameters of FR4 substrate with dielectric LTCCJHB62 ltcc chip ltcc filter ltcc antenna 9GHZ KYOCERA vco
Contextual Info: LTCC Low Temperature Co-fired Ceramics With increasing demands for high density and miniature modules, Kyocera LTCC featuring thick film printing and multi-layer technologies offers the best fit solutions for those market demands. This LTCC is especially suited for telecom devices such as RF power amplifier, antenna

Contextual Info: LTCC Multilayer Substrate LTCC Package Low Temperature Co-fired Ceramics Multilayer Ceramics & Cavity Packages Enable Complex Module Creation • Optimal for Bare Chip Modules • Miniaturization & Integration - Highly controlled dimensions and flatness - Low thermal expansion enhances use of ICs

LTCC

Abstract: heraeus ltcc overview RF Prime ltcc chip
Contextual Info: rmance PWB sMultimission, multifunction LTCC Solutions for space & defense > Complex, high-frequency solutions at all levels of integration: - high-precision building blocks — high-rel PWBs, LTCC packaging, high-performance mil-spec components - modules & assemblies — hybrid modules,

Chequers Electronic

Abstract: C 3205 CHINA MOBILE ltcc chip balun 0805 mobile & balun LTCC filter SLFH SLFH2
Contextual Info: Chequers Electronic China Limited Multilayer Chip LC Filter (High Pass, SLFH Series) ● Dimension SLFH21-01 ● Features - Low insertion loss - Internal shielding - Excellent solderability - SMD chip balun based on LTCC technology - Operating temperature:

SI 3205

Abstract: smd diode g6 SLFL2 C 3205 SLFL3 SLFB2 SLFB3 Chequers Electronic
Contextual Info: Chequers Electronic China Limited Multilayer Chip LC Filter (Low Pass, SLFL Series) ● Dimension SLFL21G SLFB21T ● Features - Low insertion loss - Internal shielding - Excellent solderability - SMD chip balun based on LTCC technology - Operating temperature:

ltcc chip

Contextual Info: Multilayer Chip Low Pass Filters NGFL Series RoHS Compliant FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • INTERNAL SHIELDING • SMALL SIZE & LOW PROFILE LTCC CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION includes all homogeneous materials

NGFP0402AG2R450G050TRF

Abstract: NGFP1008AG3R275G225TRF LTCC X band
Contextual Info: Multilayer Chip Band Pass Filters NGFP Series RoHS Compliant FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • INTERNAL SHIELDING • SMALL SIZE & LOW PROFILE LTCC CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION includes all homogeneous materials

NGD_C

Contextual Info: Multilayer Chip Diplexers NGD_C Series FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • LOW COST LTCC CONSTRUCTION • SURFACE MOUNTABLE CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION RoHS Compliant includes all homogeneous materials *See Part Number System for Details

Contextual Info: Multilayer Chip LC Filter High pass – SLFH Series Operating Temp. : -40℃~+85℃ FEATURES z Small size, light weight, Low Insertion loss Inside shielding SMD Chip based on LTCC technology Centre frequencies and responses are ready for customization ●

NGD1210C

Abstract: Chip Multilayer Diplexers diplexer NGD0805 NGD_C
Contextual Info: Multilayer Chip Diplexers NGD_C Series FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • LOW COST LTCC CONSTRUCTION • SURFACE MOUNTABLE CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION RoHS Compliant includes all homogeneous materials *See Part Number System for Details

RFBLN2012090K1T

Abstract: balun 0805 RFBLN
Contextual Info: Walsin Technology Corporation Multi Layer Chip BALUN – 5GHz 2012 0805 Patent Pending – RFBLN2012090K1T Series For WLAN 802.11a/ HiperLAN 5GHz Application CONSTRUCTION FEATURES 1. Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology 2. Miniatured Size 2.00 x 1.25 x 0.95 mm3

ltcc

Abstract: thermal conductivity maruwa ML07 HTCC ltcc chip
Contextual Info: MARUWA GENERAL CATALOG MULTILAYER CERAMIC SUBSTRATES [ LTCC Low Temperature Co-fired Ceramic ] a Features Materialization of high-density, multi-functional products for high-frequency use thick-film Ag electrode with excellent solder wettability is used.

Contextual Info: Multilayer Chip LC Filter Low pass – SLFL Series Operating Temp. : -40℃~+85℃ FEATURES z z z z z Small size, light weight Low insertion loss Inside shielding SMD chip based on LTCC technology Centre frequencies and responses are ready for customization

ltcc

Abstract: HUGHES LMX2326 silver ag wire Bond
Contextual Info: National Semiconductor’s Low Temperature Cofired Ceramics Program N Historical Perspective • LTCC was originally developed by Hughes for MIL systems • National acquired the manufacturing line, licensed the technology, & hired key personnel from Hughes in Aug. 1995

uwb antenna

Abstract: ANT1085-4R1-01A-ES4 ltcc antenna ANT1085 ltcc chip
Contextual Info: PRELIMINARY under development May/2006 Ver.3.0 TDK Corporation Page 1 of 4 TDK PROPRIETARY CONFIDENTIAL LTCC CHIP ANTENNA FOR UWB SAMPLE P/N: ANT1085-4R1-01A-ES4.5 [MECHANICAL DIMENSIONS] TOP VIEW BOTTOM VIEW 2. 3. 1. SIDE VIEW 1. 2. 3. GND Feed GND [Unit: mm]

Fuse m1 250C

Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405
Contextual Info: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2

GSM1800

Abstract: NJG1656LK4 SP9T grx2 GSM1900 GSM900
Contextual Info: NJG1656LK4 SP9T ANTENNA SWITCH GaAs MMIC GENERAL DESCRIPTION The NJG1656LK4 is a GaAs SP9T antenna switch IC for GSM/TD-SCDMA multi-band handsets. The IC contains a MMIC switch die with on-chip logic circuits and a LTCC substrate with built-in three-LPFs on GSM/TD-SCDMA transmit

epcos SAW ltcc

Abstract: B69893K2457A101 EPCOS SAW Filters zibis ltcc qualcomm 7200 RF LTCC Filter LTCC GHz
Contextual Info: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457A101 Preliminary Data Sheet Features • Low Profile maximum height 0.9 mm • High attenuation at GSM (900, 1800, 1900) bands Change History Revision P1 P2 P3 Detail of change

Contextual Info: NJG1672LK4 SP9T ANTENNA SWITCH GaAs MMIC GENERAL DESCRIPTION The NJG1672LK4 is a GaAs SP9T antenna switch IC for GSM/TD-SCDMA multi-band handsets. The IC contains a MMIC switch die with on-chip logic circuits and a LTCC substrate with built-in three LPFs on GSM/TD-SCDMA transmit paths for

KLC AB1

Abstract: LTCC EXCEL SMD smd transistor ab1
Contextual Info: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 52 KLC LTCC multilayer substrates EU features • The high-density wiring by the fine line and pattern is available • Miniaturization is possible by burying L, C and Strip-line

Contextual Info: KLC LTCC multilayer substrates EU features • The high-density wiring by the fine line and pattern is available • Miniaturization is possible by burying L, C and Strip-line • By the uses of low dielectric-loss ceramics and low loss conductors, the substrates excel in the high frequency