LQFP 7X7 TRAY Search Results

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

lqfp 7x7 tray

Abstract: MS-026 7X748LD amkor
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

tray qfn 6x6

Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Contextual Info: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA

AD5820

Abstract: ad6548
Contextual Info: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

Techpoint

Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Contextual Info: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

QFN tray

Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
Contextual Info: Packaging Product Specification PS007229-1010 Copyright 2010 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

LQFP 128 pin Socket

Abstract: lqfp 7x7 tray
Contextual Info: MC100LVE164 3.3V ECL 16:1 Multiplexer The MC100LVE164 is a 16:1 multiplexer with a differential output. The select inputs SEL0, 1, 2, 3 control which one of the sixteen data inputs (A0 − A15) is propragated to the output. The device is functionally equivalent to the MC100E164 except it operates from a 3.3 V supply. The

R5F100

Abstract: R5F100LEA R5F1016AA R5F101 R5f104 r5f100fea
Contextual Info: RL78 The True Low Power Microcontroller Platform www.renesas.eu 2013.09 RL78 The True Low Power Microcontroller Platform RL78 Low Power Modes RL78 from Renesas Electronics is an advanced family of general purpose and application specific microcontrollers MCU‘s combining true low power and high performance operation.

MC100EP111

Abstract: MPC9109 MPC940L MPC940LAC MPC940LFA MPC940LFAR2 MPC942
Contextual Info: LOW VOLTAGE 1:18 CLOCK DISTRIBUTION CHIP The MPC940L is a 1:18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS output capabilities. The device features the capability to select either a differential LVPECL or an LVCMOS compatible input. The 18 outputs are 2.5 V or 3.3 V LVCMOS

AND8020

Abstract: MC100E164 MC100LVE164 MC100LVE164FA MC100LVE164FAR2
Contextual Info: MC100LVE164 3.3VĄECL 16:1 Multiplexer The MC100LVE164 is a 16:1 multiplexer with a differential output. The select inputs SEL0, 1, 2, 3 control which one of the sixteen data inputs (A0 – A15) is propragated to the output. The device is functionally equivalent to the MC100E164 except it operates from a 3.3 V supply. The

Contextual Info: LOW VOLTAGE 1:18 CLOCK DISTRIBUTION CHIP NRND – Not Recommend for New Designs DATASHEET The MPC940L is a 1:18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS output capabilities. The device features the capability to select either a differential

Contextual Info: Freescale Semiconductor Product Brief Document Number:KL15PB Rev. 2, 6/2012 KL14/KL15 Product Brief Supports all KL14 and KL15 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

sqfp 14x20

Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Contextual Info: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has

kl15

Contextual Info: Freescale Semiconductor Product Brief Document Number:KL1xPB Rev. 2.1, 10/2012 KL14/KL15 Product Brief Supports all KL14, KL15 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

MKL25Z128VLK4

Abstract: MKL25Z128VLH4 ARM cortex m0 MKL25Z64VFM4 MKL25Z128 MKL24Z64VFM4 KL25 MKL25Z128VFT4 MKL24Z32VFM4 MKL24Z32VLH4
Contextual Info: Freescale Semiconductor Product Brief Document Number:KL25PB Rev. 2, 6/2012 KL24/KL25 Product Brief Supports all KL24 and KL25 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

Contextual Info: STM8AF5xxx STM8AF6x69/7x/8x/9x/Ax Automotive 8-bit MCU, with up to 128 Kbytes Flash, data EEPROM, 10-bit ADC, timers, LIN, CAN, USART, SPI, I2C, 3 to 5.5 V Datasheet − production data Features • Core – Max fCPU: 24 MHz – Advanced STM8A core with Harvard

STM8AF5288

Abstract: VFQFPN-32 footprint ax 2008 lqfp 48 P6188 STM8S 4800 compare 4804 CTA150 programme counter bit length STM8AH61x PM0047
Contextual Info: STM8AF5xxx STM8AF6x69/7x/8x/9x/Ax Automotive 8-bit MCU, with up to 128 Kbytes Flash, data EEPROM, 10-bit ADC, timers, LIN, CAN, USART, SPI, I2C, 3 to 5.5 V Datasheet − production data Features • Core – Max fCPU: 24 MHz – Advanced STM8A core with Harvard

Contextual Info: AMIS-492x0 AMIS-492x0 Fieldbus MAU Overview AMIS−492x0 Fieldbus MAU Media Access Unit is a transceiver chip for low speed FOUNDATION Fieldbus and Profibus PA devices. The AMIS−49200 was originally designed to be a near pin-for-pin replacement of the Yokogawa mSAA22Q MAU. “Near

Contextual Info: Freescale Semiconductor Product Brief Document Number:KL0xPB Rev 3.2, 5/2013 KL02/KL04/KL05 Product Brief Supports all KL02, KL04 and KL05 devices Contents 1 Kinetis L series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex®-M0+ MCUs in the

MK20DX256VLQ10

Abstract: MK20DN512VLK10 CEA-709 MK20DN512VMC10 MK20DN512VLL10 MK21dn QFN 64 8x8 footprint MK21DN512VMC5 MK20DX256VMC10 MK20DX128VLH5
Contextual Info: Freescale Semiconductor Product Brief Document Number:K20PB Rev. 11, 08/2012 K20 Family Product Brief Supports all K20 devices Contents 1 Kinetis Portfolio 1 Kinetis Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of