LPCC16 Search Results

SK39110

Abstract: LPCC-16
Contextual Info: GaAs IC High Isolation SPDT Non-Reflective Switch with Driver DC–6.0 GHz AS196-307 Features • Positive Voltage Control 0/+3 to 0/+5 V LPCC 4 x 4 (-307) ■ High Isolation (55 dB @ 0.9 GHz and 1.9 GHz) TOP VIEW PIN 1 INDICATOR BOTTOM VIEW -A- 0.026 (0.65 mm)

LPCC-16

Abstract: SSOP-16 SOT-143 212 sot-23 QFN-20 SOT 213 LPCC-20 transistor sc 308 MSOP-10 SSOP-20
Contextual Info: Package Style/Part Number Reference Package Style Packaging Part Number Suffix Package Style Packaging Part Number Suffix Ceramic Surface Mount Package -A2 SSOP-8 Chip/Wafer -000 5 Lead Ceramic Package -65 SOT-23 -001 SOT-5 -72 SOT-23 -003 SOT-6 -73 SOT-23

170M8554

Abstract: bussmann Fuse 450 amps 250 volts max zs FM09 PS Jet 20A 300v fuse
Contextual Info: Circuit Protection Products for the Electrical Industry New Products for All Markets For product data sheets, visit www.cooper.bussmann.com/products/datasheet.asp Circuit Protection Products for the Electrical Industry Table of Contents RED indicates NEW information

ana 658 solar charge

Abstract: RD2004 for 4120 40A 14VDC relay pico fuse color code varistor 20sp Lucent SLC 96 cabinet MDM cooper bussmann semiconductor fuse catalogue MDQ 100a 600v bridge rectifier GBA 616
Contextual Info: Bussmann electrical full line catalog Leadership in Circuit Protection Introducing Bussmann by Eaton The protection you rely on. For more, visit Bussmann.com Leadership in Circuit Protection. The only company that can provide a complete circuit protection solution for all applications.

LPCC-16

Abstract: AS196-307 LPCC16
Contextual Info: Preliminary GaAs IC High Isolation SPDT Non-Reflective Switch with Driver DC–6.0 GHz AS196-307 Features LPCC 4 x 4 -307 • Positive Voltage Control (0/+3 to 0/+5 V) TOP VIEW PIN 1 INDICATOR ■ High Isolation (55 dB @ 0.9 GHz and 1.9 GHz) BOTTOM VIEW

tssop 16 exposed pad stencil

Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

Contextual Info: Low-Peak Class CC LP-CC — 600Vac/300Vdc, 1⁄2-30A Time-Delay Fuses Dimensions - in mm 1.5" (± 0.031) (38.1mm) Description: Ultimate protection Class CC current-limiting, time-delay fuses. Time-delay – 12 seconds (minimum) at 200% of rated current.

Contextual Info: Low-Peak Class CC LP-CC — 600Vac/300Vdc, 1⁄2-30A Time-Delay Fuses Dimensions - in 1.5" ± 0.031 (38.1mm) Description: Ultimate protection Class CC current-limiting, time-delay fuses. Time-delay – 12 seconds (minimum) at 200% of rated current. Catalog Symbol: LP-CC-(amp)

220v AC voltage stabilizer schematic diagram

Abstract: FUSE M2 250e 11kV breaker control circuit diagram bussmann Fuse 170L series bussmann semiconductor fuse catalogue arc welder schematic HRC fuse gg GEC relay applications for 6.6kV switchgear ups circuits 170E bussmann
Contextual Info: Circuit Protection Products for the Electrical Industry New Products for All Markets For product data sheets, visit www.cooper.bussmann.com/products/datasheet.asp Circuit Protection Products for the Electrical Industry Table of Contents RED indicates NEW information

Contextual Info: DATA SHEET SKY13286-359LF: GaAs High Isolation SPDT Absorptive Switch 100 MHz–6 GHz Functional Block Diagram Features ● ● ● ● ● Single positive voltage control 0/3 to 0/5 V High isolation 64 dB at 1 GHz and 2 GHz Integrated silicon CMOS driver

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

srf 3417

Abstract: transistor srf 3417 SKY77329 transistor tt 2170 em digrf SKY77519 MARKING CODE EA1 SKY77408 sky72302-21 sky77506
Contextual Info: Product Selection Guide Spring 2007 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity. The company’s power amplifiers, front-end modules and direct conversion radios are at the heart of many of today’s leading-edge

Contextual Info: DATA SHEET AS196-307, AS196-307LF: GaAs IC High-Isolation SPDT Nonreflective Switch with Driver LF–6 GHz Functional Block Diagram Features Positive voltage control 0/3 to 0/5 V ● High isolation (55 dB @ 0.9 GHz and 1.9 GHz) ● LPCC 4 x 4 mm package

QFN12

Abstract: pHEMT QFN-12 AS183-92LF p-HEMT
Contextual Info: Switches DC–6 GHZ PLASTIC PACKAGED AND CHIP — CONTROL FET AND SPST Part Number Frequency GHz Description Insertion Loss Range (dB) Typ. Isolation Range (dB) Typ. IP3 > 0.5 GHz (dBm) Typ. Package (mm) Control FET 300 kHz–1.0 GHz High Power 0.20–0.30

lga-16 4x4

Abstract: LGA-16 LPCC16
Contextual Info: APPLICATION NOTE Discrete Devices and IC Switch/Attenuators Tape and Reel Package Orientation Tape Dimensions Label P1 P0 P2 D0 40 75 00 s1 A 30 Y. trie V. QT C us RE EV. Ind 00 R rks 94 E1 o -9 I 3 0-0 yw 07 ULT 90 4 Sk MP13 R-M DE-9 338-1 _ S AF E C O - 1 _ _ _ _

6LF6

Abstract: AS196-307LF AS196-307 LPCC-16
Contextual Info: DATA SHEET AS196-307, AS196-307LF: GaAs IC High-Isolation SPDT Nonreflective Switch with Driver LF–6 GHz Features Functional Block Diagram Positive voltage control 0/3 to 0/5 V ● High isolation (55 dB @ 0.9 GHz and 1.9 GHz) ● LPCC 4 x 4 mm package

Contextual Info: DATA SHEET AS196-307, AS196-307LF: GaAs IC High Isolation SPDT Non-Reflective Switch with Driver DC–6.0 GHz Features LPCC 4 x 4 -307 Positive voltage control (0/+3 to 0/+5 V) ● High isolation (55 dB @ 0.9 GHz and 1.9 GHz) ● LPCC 4 x 4 mm package ● Integrated silicon CMOS driver

212 s sot-23

Abstract: 212 sot-23 LPCC-20 338 sot-23 a3 sot143
Contextual Info: o JO Package Style/Part Number Reference <o < o PACKAGE STYLE PACKAGING PART NUMBER SUFFIX Ceramic Surface Mount Package -A2 8 Lead Ceramic Package -60 Ceramic Surface Mount Package -A3 LQFP-32 7 x 7 mm -61 Ceramic Surface Mount Package -A4 SSOP-8 -62 Chip/Wafer

LPCC-16

Abstract: recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern
Contextual Info: GaAs RFICs and Modules Footprints Surface Mount Land Patterns Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface mount design and land pattern standard: IPC-SM-782.

AS131-59

Abstract: p-HEMT
Contextual Info: GaAsRFICs and Modules Plastic Packaged Control Products Control FETs Description Insertion Loss Range dB Typ. Isolation Range (dB) Typ. IP3 > 0.5 GHz (dBm) Typ. Package DC-2.5 General Purpose 0.50-0.70 50-10 43 SOT-23 D C -1.0 High Power 0.20-0.30 30-7 60

C1316C

Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
Contextual Info: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface

T32 fuse l 250v

Abstract: LPCC-20 LPJ600SP NOS 600 amp fuses LPSRK1712SP LPJ-20SP CDF30J3 EFJ30X-3PB6 fuse base IEC 269 KRPC2000SP
Contextual Info: Low Voltage, Branch Circuit Rated Fuses Page 12-14 15-16 Class Fuses Volts CC . . . . . . LP-CC . . . . . . . . . . . . . . . 600V . . . . . 17 FNQ-R . . . . . . . . . . . . . . . KTK-R . . . . . . . . . . . . . . . 600V . . . . . 600V . . . . . 18 19 600V . . . . .

LPCC-16

Abstract: LPCC 24
Contextual Info: Preliminary GaAs IC High Isolation SPDT Non-Reflective Switch with Driver DC–6.0 GHz AS196-307 Features • Positive Voltage Control 0/+3 to 0/+5 V LPCC 4 x 4 (-307) TOP VIEW PIN 1 INDICATOR ■ High Isolation (55 dB @ 0.9 GHz and 1.9 GHz) BOTTOM VIEW

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and