LGA JEDEC Search Results

Contextual Info: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket

LGA 2011 Socket diagram

Abstract: LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930
Contextual Info: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket

LGA16 footprint

Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents

lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and

LGA 2011 Socket diagram

Abstract: BR17
Contextual Info: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series

picor

Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
Contextual Info: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1

pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
Contextual Info: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1

Contextual Info: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

LGA voiding

Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Contextual Info: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8 x 8 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LGA weight

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 4 x 4 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LGA weight

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 6 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

"material declaration"

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 7 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LSM9DS0

Contextual Info: LSM9DS0 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer Datasheet - production data Applications • Indoor navigation  Smart user interfaces  Advanced gesture recognition  Gaming and virtual reality input devices LGA-24 4x4x1.0 mm

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 9 x 9 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 5 x 5 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LIS2DH12

Contextual Info: LIS2DH12 MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer Datasheet - production data Applications • Motion-activated functions  Display orientation  Shake control  Pedometer LGA-12 2.0x2.0x1 mm

Contextual Info: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15

LIS302DL c source

Abstract: LIS302DL self test example AN2335 LIS302DL self test LIS302DL LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14
Contextual Info: AN2335 Application note LIS302DL: 3-Axis - ±2g/±8g digital output ultracompact linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.

BMA120

Abstract: bma220 IC BOSCH 44 z 04g BOSCH marking code BOSCH cross reference bosch map sensor Bosch microcontroller triaxial accelerometer sensor BMA22
Contextual Info: BMA220 BMA220 Digital, triaxial acceleration Data sheet sensor Bosch Sensortec Data sheet Bosch Sensortec BMA220 data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.10

Contextual Info: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8L 4.9 x 3.2 mm (-315) Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: BMA250 BMA250 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA250 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15