LEADLESS PACKAGE Search Results

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
Contextual Info: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)

leadless chip carrier

Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
Contextual Info: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

clcc 44

Abstract: MATRA MHS
Contextual Info: Packages Leadless Chip Carrier LCC package outlines 22 Leads .050 center leadless rectangular chip carrier Code : 4H Date : 25–04–96 28 Leads .050 center leadless rectangular chip carrier Code : 4P MATRA MHS Date : 29–02–96 1 Packages 32 Leads .040 center leadless square chip carrier

CERAMIC LEADLESS CHIP CARRIER

Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
Contextual Info: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram

44 Lead Ceramic Leadless Chip Carrier

Abstract: leadless chip carrier MIL-STD-1835
Contextual Info: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13

NTLMS4506N

Abstract: MOSfet 4392
Contextual Info: NTLMS4506N Advance Information Power MOSFET 30 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

4392 mosfet

Contextual Info: NTLMS4501N Advance Information Power MOSFET 17 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

NTLMS4502N

Contextual Info: NTLMS4502N Advance Information Power MOSFET 17 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

ntlms4504n

Contextual Info: NTLMS4504N Advance Information Power MOSFET 28 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

NTLMS4403N

Abstract: MOSfet 4392
Contextual Info: NTLMS4403N Advance Information Power MOSFET 22 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

NTLMS4505N

Abstract: 4392 MOSFET
Contextual Info: NTLMS4505N Advance Information Power MOSFET 31 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

Contextual Info: Leadless Inductors: NL Series CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for autom atic mounting have been developed in response to the trend toward

Contextual Info: PRELIMINARY M IC R O N I 4 MEG X SfcMCONOUCTORMC MT12D436 36, 8 MEG x 18 DRAM MODULE 4 MEG X 36, 8 MEG x 18 DRAM MODULE FAST PAGE MODE FEATURES OPTIONS MARKING • Tim ing 60ns access 70ns access • Packages Leadless 7 2 -pin Leadless 7 2 -pin Leadless 7 2 -pin

NL322522T-1R0K

Abstract: NL453232-331K NL322522T-220K NL453232-330K NL453232-1R5K NL453232-8R2K NL453232-102K NL322522T-5R6K NL453232 NL453232-560K
Contextual Info: CAL-CHIP ELECTRONICS IN 54E • ^ 0 0 0 0 5 5 OODQOlt, TDb CAL-CHIP LEADLESS INDUCTORS CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for automatic mounting

MLL34

Abstract: MLL5243B mll5232bt1 1N5221 MLL41 MLL5221B MLL5222B MLL5223B MLL5224B MLL-34
Contextual Info: Leadless Zener Diodes Leadless Diodes — MLL34 8mm tape and MLL41 (12mm tape) • S m all, convenient leadless package. A full range of i watt and 1 w att z e n e r diodes a re av ailab le using the sam e die as products presently offered in DO-35 (1N5221 S eries) and DO-41 (N4728 S eries) zeners.

Contextual Info: Vishay Electro-Films Thin Film Packaged Product Networks STYLE SURFACE MOUNT LEADLESS PACKAGED PRODUCTS LEADLESS CHIP CARRIER PERFORMANCE SINGLE LAYER MODEL SLR.131 PACKAGED PRODUCTS NETWORKS Performance Key www.vishay.com 130 TCR ± 10 ppm/°C

vco using varactor diode for carrier generation

Abstract: voltage variable capacitor "Voltage Controlled Oscillators" Voltage Controlled Oscillators MAVCML0034 MAVCML0043 MAVCML0044 power varactor
Contextual Info: Leadless Packaged Voltage Controlled Oscillators MAVCMLSeries V1 Features • • • • • • • Extremely Linear Tuning High Tuning Speed Low Phase Noise Leadless Package Hermetically Sealed Suitable for High Reliability Applications Custom Designs Available

GDZ3V9LP3

Contextual Info: GDZ3V9LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes

LFB01

Abstract: LFB01L
Contextual Info: Ordering number:EN1885C LFB01, 01L Silicon Planar Leadless Type Ultrahigh-Speed Switching Diode Features Package Dimensions • Highly reliable leadless glass sleeve structure. · Very small size. · Capable of being suface-mounted. · Forward voltage : VF max=1.2V.

r 2501 kk 135

Abstract: 0922E atf-*m4 r 2501 kk 346 r 2501 kk 250 r 2501 kk 106 r 2501 kk 341
Contextual Info: ATF-541M4 Low Noise Enhancement Mode ­Pseudomorphic HEMT in a ­Miniature Leadless Package Data Sheet Description Features Avago Technologies’ ­ ATF­‑541M4 is a high linearity, low noise, single supply E‑PHEMT housed in a miniature leadless package.

Contextual Info: NTLTS3107P Power MOSFET -20 V, -8.3 A, Single P-Channel, Micro8 Leadless Package Features •ăLow RDS on for Extended Battery Life •ăSurface Mount Micro8 Leadless for Improved Thermal Performance •ăLow Profile (<1.0 mm) Optimal for Portable Designs

C1316C

Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
Contextual Info: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface

tssop 16 exposed pad stencil

Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and