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    LEAD FRAME QFP Search Results

    LEAD FRAME QFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    71662-001LF
    		Amphenol Communications Solutions Din Accessory Lock Frame PDF
    71662-002LF
    		Amphenol Communications Solutions Din Accessory Male Lock Frame PDF
    85261-001LF
    		Amphenol Communications Solutions Din Accessory Locking Frame 3x16 PDF
    65184-001LF
    		Amphenol Communications Solutions Din Accessory Latching Frame Modular 1 module PDF
    77429-001LF
    		Amphenol Communications Solutions Din Accessory Latching Frame Reversed 3x32 PDF

    LEAD FRAME QFP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    LEAD FRAME SURFACE MOUNT

    Abstract: ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23
    Contextual Info: Package Characteristics External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Full name Symbol External outline Frame IC Package Description Pitch Lead type TO-92 Transistor Outline


    Original     		O-220F OT-89 O-252 LEAD FRAME SURFACE MOUNT ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23 PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		16-pin MF202 160P6) 152P6T) 135S8) 42Alloy) leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES PDF

    ic package

    Abstract: Cu Alloy 42 transistor outline package 3
    Contextual Info: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name External outline IC Package Description Frame Pitch TO-92 Transistor Outline Package


    Original     		O-220F OT-89 O-252 ic package Cu Alloy 42 transistor outline package 3 PDF

    LEAD FRAME SURFACE MOUNT

    Abstract: Alloy 42 Cu Alloy 42 lead frame led lead frame
    Contextual Info: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name IC Package Description External outline Frame Pitch TO-220F Transistor Outline Package


    Original     		O-220F OT-89 O-252 778mm LEAD FRAME SURFACE MOUNT Alloy 42 Cu Alloy 42 lead frame led lead frame PDF

    QFP64-P-1414

    Contextual Info: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999


    Original     		QFP64-P1414-0 80-BK QFP64-P-1414 PDF

    QFP128-P-2828-0

    Contextual Info: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996


    Original     		QFP128-P-2828-0 80-DK PDF

    QFP100-P-1420-0

    Contextual Info: QFP100-P-1420-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.29 TYP. 4/Nov. 28, 1996


    Original     		QFP100-P-1420-0 65-BK PDF

    QFP80-P

    Contextual Info: QFP80-P-1414-0.65-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.85 TYP. 3/Nov. 28, 1996


    Original     		QFP80-P-1414-0 QFP80-P PDF

    QFP208-P-2828-0

    Abstract: QFP208-P
    Contextual Info: QFP208-P-2828-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.65 TYP. 2/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-BK4 QFP208-P PDF

    QFP56-P

    Contextual Info: QFP56-P-910-0.65-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.43 TYP. 4/Nov. 28, 1996


    Original     		QFP56-P-910-0 65-2K QFP56-P PDF

    QFP160-P-2828-0

    Contextual Info: QFP160-P-2828-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		QFP160-P-2828-0 65-BK4 PDF

    QFP160-P-2828-0

    Contextual Info: QFP160-P-2828-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		QFP160-P-2828-0 65-BK PDF

    QFP44-P-910-0

    Contextual Info: QFP44-P-910-0.80-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.41 TYP. 4/Nov. 28, 1996


    Original     		QFP44-P-910-0 80-2K PDF

    QFP128-P-2828-0

    Abstract: QFP128-P
    Contextual Info: QFP128-P-2828-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.58 TYP. 3/Nov. 28, 1996


    Original     		QFP128-P-2828-0 80-BK QFP128-P PDF

    Contextual Info: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001


    Original     		QFP64-P-1414-0 80-BK PDF

    BK-4

    Abstract: qfp304 QFP304-P-4040-0
    Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996


    Original     		QFP304-P-4040-0 50-BK4 BK-4 qfp304 PDF

    QFP128-P-1420-0

    Abstract: qfp128p
    Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996


    Original     		QFP128-P-1420-0 qfp128p PDF

    QFP80-P-1420-0

    Contextual Info: QFP80-P-1420-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 4/Nov. 28, 1996


    Original     		QFP80-P-1420-0 80-BK PDF

    QFP100-P-1420-0

    Contextual Info: QFP100-P-1420-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.54 TYP. 4/Nov. 28, 1996


    Original     		QFP100-P-1420-0 65-BK4 PDF

    QFP272-P-3636-0

    Contextual Info: QFP272-P-3636-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 9.96 TYP. 2/Nov. 28, 1996


    Original     		QFP272-P-3636-0 50-BK4 PDF

    QFP240-P-3232-0

    Contextual Info: QFP240-P-3232-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 7.82 TYP. 2/Nov. 28, 1996


    Original     		QFP240-P-3232-0 50-BK4 PDF

    QFP208-P-2828-0

    Contextual Info: QFP208-P-2828-0.50-EK4 Built-in PCB Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.35 TYP. 3/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-EK4 PDF

    QFP208-P-2828-0

    Contextual Info: QFP208-P-2828-0.50-CK4 Built-in heat spreader Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.70 TYP. 4/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-CK4 PDF