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    LEAD FRAME QFP Search Results

    LEAD FRAME QFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ101KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KB4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ102MN4A
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ472MA4B
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF

    LEAD FRAME QFP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    LEAD FRAME SURFACE MOUNT

    Abstract: ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23
    Contextual Info: Package Characteristics External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Full name Symbol External outline Frame IC Package Description Pitch Lead type TO-92 Transistor Outline


    Original     		O-220F OT-89 O-252 LEAD FRAME SURFACE MOUNT ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23 PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		16-pin MF202 160P6) 152P6T) 135S8) 42Alloy) leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES PDF

    ic package

    Abstract: Cu Alloy 42 transistor outline package 3
    Contextual Info: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name External outline IC Package Description Frame Pitch TO-92 Transistor Outline Package


    Original     		O-220F OT-89 O-252 ic package Cu Alloy 42 transistor outline package 3 PDF

    LEAD FRAME SURFACE MOUNT

    Abstract: Alloy 42 Cu Alloy 42 lead frame led lead frame
    Contextual Info: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name IC Package Description External outline Frame Pitch TO-220F Transistor Outline Package


    Original     		O-220F OT-89 O-252 778mm LEAD FRAME SURFACE MOUNT Alloy 42 Cu Alloy 42 lead frame led lead frame PDF

    QFP64-P-1414

    Contextual Info: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999


    Original     		QFP64-P1414-0 80-BK QFP64-P-1414 PDF

    QFP128-P-2828-0

    Contextual Info: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996


    Original     		QFP128-P-2828-0 80-DK PDF

    QFP100-P-1420-0

    Contextual Info: QFP100-P-1420-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.29 TYP. 4/Nov. 28, 1996


    Original     		QFP100-P-1420-0 65-BK PDF

    QFP80-P

    Contextual Info: QFP80-P-1414-0.65-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.85 TYP. 3/Nov. 28, 1996


    Original     		QFP80-P-1414-0 QFP80-P PDF

    QFP208-P-2828-0

    Abstract: QFP208-P
    Contextual Info: QFP208-P-2828-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.65 TYP. 2/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-BK4 QFP208-P PDF

    QFP56-P

    Contextual Info: QFP56-P-910-0.65-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.43 TYP. 4/Nov. 28, 1996


    Original     		QFP56-P-910-0 65-2K QFP56-P PDF

    QFP160-P-2828-0

    Contextual Info: QFP160-P-2828-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		QFP160-P-2828-0 65-BK4 PDF

    QFP160-P-2828-0

    Contextual Info: QFP160-P-2828-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		QFP160-P-2828-0 65-BK PDF

    QFP44-P-910-0

    Contextual Info: QFP44-P-910-0.80-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.41 TYP. 4/Nov. 28, 1996


    Original     		QFP44-P-910-0 80-2K PDF

    QFP128-P-2828-0

    Abstract: QFP128-P
    Contextual Info: QFP128-P-2828-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.58 TYP. 3/Nov. 28, 1996


    Original     		QFP128-P-2828-0 80-BK QFP128-P PDF

    Contextual Info: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001


    Original     		QFP64-P-1414-0 80-BK PDF

    BK-4

    Abstract: qfp304 QFP304-P-4040-0
    Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996


    Original     		QFP304-P-4040-0 50-BK4 BK-4 qfp304 PDF

    QFP128-P-1420-0

    Abstract: qfp128p
    Contextual Info: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996


    Original     		QFP128-P-1420-0 qfp128p PDF

    QFP80-P-1420-0

    Contextual Info: QFP80-P-1420-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 4/Nov. 28, 1996


    Original     		QFP80-P-1420-0 80-BK PDF

    QFP100-P-1420-0

    Contextual Info: QFP100-P-1420-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.54 TYP. 4/Nov. 28, 1996


    Original     		QFP100-P-1420-0 65-BK4 PDF

    QFP272-P-3636-0

    Contextual Info: QFP272-P-3636-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 9.96 TYP. 2/Nov. 28, 1996


    Original     		QFP272-P-3636-0 50-BK4 PDF

    QFP240-P-3232-0

    Contextual Info: QFP240-P-3232-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 7.82 TYP. 2/Nov. 28, 1996


    Original     		QFP240-P-3232-0 50-BK4 PDF

    QFP208-P-2828-0

    Contextual Info: QFP208-P-2828-0.50-EK4 Built-in PCB Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.35 TYP. 3/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-EK4 PDF

    QFP208-P-2828-0

    Contextual Info: QFP208-P-2828-0.50-CK4 Built-in heat spreader Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.70 TYP. 4/Nov. 28, 1996


    Original     		QFP208-P-2828-0 50-CK4 PDF