LATTICE PACKAGE DIMENSIONS Search Results

22V10A

Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Contextual Info: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

22V10

Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Contextual Info: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

Contextual Info: PA1048-T128-01A Data Sheet 128 pin TQFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in TQFP packages can be programmed on 28 pin DIP programmers. This socket will only work for the TQFP package.

Lattice PLSI

Abstract: lattice semiconductor tape and reel
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

16-mm

Abstract: 16MM TAPE PACKAGE
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

LED43

Contextual Info: LED43 v 2.0 24.11.2014 Description LED43 series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 4.15 µm and optical power of typ. 0.01 mW qCW. It comes in TO-18 package a with a glass window.

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel

LED21

Contextual Info: LED21 v 1.0 12.02.2014 Description LED21 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.15 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package a with a glass window.

LED38

Contextual Info: LED38 v 2.0 01.12.2014 Description LED19-PR series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 3.75 µm and optical power of typ. 30 µW qCW. It comes in TO-18 package, with cap and without window on request .

Contextual Info: LED23 rev 2.0 29.04.2015 Description LED23 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.35 µm and optical power of typ. 0.8 mW qCW. It comes in TO-18 package, with cap and without window on request .

LED19-PR

Contextual Info: LED19-PR v 2.0 24.11.2014 Description LED19-PR series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 1.95 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package, with a parabolic reflector and a without window on request .

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

84 pin plcc lattice dimension

Abstract: C045
Contextual Info: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE

14.5M 1982

Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
Contextual Info: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

Lattice Semiconductor Package Diagrams 256-Ball fpBGA

Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
Contextual Info: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

TMS 3880

Abstract: vantis jtag schematic e2cmos technology jtag cable lattice Schematic NT 407 F lattice electrically erasable gal 1985 Vantis ISP cable lattice 1996
Contextual Info: L A T T I C E S E M I C O N D U C T O R New Dimensions in ISP Programmable Analog Circuits Programmable Analog Circuits WORLD LEADER FOR IN-SYSTEM PROGRAMMABILITY ISP from LATTICE—THE Digital Lattice ispPACTM—Programmable Analog Devices that are custom designed and

JESD22-A108-A

Abstract: JESD22-A104-A JESD22*108 EIA-671 JEDS22-C101-A doc-70 ISO14000 J-STD-035 8110014 Distributors and Sales Partners
Contextual Info: Reliability and Quality Assurance February 2002 Introduction Lattice Semiconductor Corporation LSC designs, develops and markets high performance programmable logic devices (PLDs) and related development system software. Lattice Semiconductor is the inventor and world's leading supplier of in-system programmable (ISPtm) CPLDs. PLDs are standard semiconductor components that can

Date Code restriction

Abstract: On semiconductor date Code shelf life JESD22-B102-C J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Contextual Info: Technical Bulletin July 2002 PB# 1146 Date Code Restriction and Product Shelf Life High Performance Programmable Logic Products Introduction Date Code Restrictions and the associated shelf life of products are commonly raised issues for advanced semiconductor products. The common concern is for the fitness of use of product that has been held in

ISPVM embedded

Abstract: post card schematic with ispgal Supercool TQFP-100 footprint matrix converting circuit VHDL or CPLD code low pass Filter VHDL code microcontroller using vhdl ISPVM ieee 1532 ispPAC80
Contextual Info: Lattice Semiconductor Corporation • Fall 2000 • Volume 7, Number 1 In This Issue ispGDX 240VA Completes Popular 3.3V Family The SuperFAST Family Just Got Faster! Entire ispMACH™ 4A Family Now Released to Production ispPAC®80 Operating Frequency Extended to

Recommended land pattern smd-0.5

Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout

LCMXO2-1200

Abstract: CEL-9750ZHF CEL-9750ZHF10
Contextual Info: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The

spartan3 fpga development boards

Abstract: M25PXX XCF08S ddr spi flash XCF16S PLCC-48 footprint spi flash m25pxx W25PXX XC3S1000 XC3S1500
Contextual Info: LOW-COST FPGA CONFIGURATION VIA INDUSTRY-STANDARD SPI SERIAL FLASH & LatticeECP/EC FPGAs A Lattice Semiconductor White Paper June 2004 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com

J-STD-033

Abstract: Date Code restriction JESD22-B102 jstd for msl 3
Contextual Info: Product Bulletin #PB1146b Date Code Restriction and Product Shelf Life High Performance Programmable Logic Products Introduction Date Code Restrictions and the associated shelf life of products are commonly raised issues for advanced semiconductor products. The common concern is for the fitness of use of product that has been held in