SB-U-02-002
Abstract: 79RV4640-XXXDU SB-U-03-003 SB-U-02-004 SB-U-03-002 79RV4650-XXXDP 79RC64V474 SB-U-01-001 79RC64V475-XXXDP EME-6730UC
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN November 8, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: M9911-03 DATE: Product Affected: 79RC64V475-XXXDP; 79RC64V474-XXXDZ Product Mark
|
Original
|
m9911-0379rc64v475-xxxdp79rc64v474-xxxdz79rv4640-xxxdu+979rv4650-xxxdpsb-u-04-043sb-u-02-002sb-u-03-003sb-u-02-004sb-u-03-00279rc64v474sb-u-01-001eme-6730uc
|
PDF
|
84-1lmisr4
Abstract: 841LMISR4 84-1-lmis-r4 KMC-184 IDT77252L155PGI
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: I0008-09 DATE: IDT77252L155PGI Product Affected: Manufacturing Location Affected: 1/22/01 MEANS OF DISTINGUISHING CHANGED DEVICES: Package designator change from PG to DU
|
Original
|
i0008-09idt77252l155pgiidt77252l-155dui168hrs+484-1lmisr4841lmisr484-1-lmis-r4kmc-184
|
PDF
|
shinetsu
Abstract: kmc-184 140C JESD22 shinetsu KMC-184
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98108, Version 1.0 July, 1998 28 Ld, 209 mil SSOP Package Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: 28 Ld, 209 mil SSOP QTP# 98108, V. 1.0 2 of 4 July, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
|
Original
|
kmc-18484-1lmisr4jesd22-a11285c/85+5cy2310nzpvcshinetsu140cjesd22shinetsu kmc-184
|
PDF
|
Ablestik 84-1
Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
Contextual Info: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM
|
Original
|
cs100hee200mafm93c46eafm93c56ca+13fm93c66bafm93c86aafm93cs46aaablestik 84-1kmc-184sumitomo epoxyolin 7025sumitomo 7351teme6600cssumitomo eme6600cs74stdkmc184-7megatest tester
|
PDF
|
IDT79RC32V332-XXXDH
Abstract: KMC-184 IDT79RC32V332-XXXDP WIRE SHEAR PULL MIL-STD 8361J I0110 KMC184
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: I0110-01 DATE: 10/19/01 Product Affected: IDT79RC32V332-XXXDP Date Effective: Contact: Title: Phone #: Fax #: E-mail: 1/19/02 Bimla Paul
|
Original
|
i0110-01idt79rc32v332-xxxdpidt79rc32v332-xxxdh79rc32v332+5kmc-184wire shear pull mil-std8361ji0110kmc184
|
PDF
|
ablestik 8390
Abstract: SUMItomo EME-G700 JESD22-B107C EME-G700 SUMITOMO EME G700 IDT72V3672L15PQFI EME-G700 datasheet KMC-184 SUMITOMO G700 Sumitomo EME-G700 material
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0506-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 8/15/2005 PQFP packages (see attachment for affected part #s).
|
Original
|
pl15pqfidt723672l12pqfidt723672l15pqfidt72v3611l12pqf+16idt72v3611l15pqfidt72v3611l20pqfidt72v3612l12pqfidt72v3612l15pqfidt72v3612l20pqfidt72v3613l12pqfablestik 8390sumitomo eme-g700jesd22-b107ceme-g700sumitomo eme g700idt72v3672l15pqfieme-g700 datasheetkmc-184sumitomo g700sumitomo eme-g700 material
|
PDF
|
Eftec ra 308
Abstract: Ablebond 84-1LMISR4 JM2500 wafer fab control plan MICRON 64T
Contextual Info: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
|
Original
|
eftec ra 308ablebond 84-1lmisr4jm2500wafer fab control plan+1micron 64t
|
PDF
|
tanaka wire
Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL
|
Original
|
g9911-05kmc184kmc184vaeme-6730+11eme-9730mil-std-883tanaka wiremac-3070shinetsutanaka au wireeme-6730ucablestikkmc-184g991tanaka wire 10 mils
|
PDF
|
KMC-184VA
Abstract: 84-1MISR4 KMC-184
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97461, VERSION 1.0 April, 1998 3.3V, Light Device 16-Bit FCT Family CY74FCT163LD*/CY74FCT163LDH* Cypress Semiconductor FCT 16-Bit Family, 3.3V, R3 Technology, Fab 4 Devices:CY74FCT163LD*/CY74FCT163LDH* Package: 56-Pin SSOP
|
Original
|
16-bitcy74fct163ld/cy74fct163ldh56-pin+4cy74fct163ldhkmc-184va84-1misr4kmc-184
|
PDF
|
KMC-184
Abstract: JESD22 KMC184
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97294 VERSION 1.0 January, 1998 32K x 8 SRAM / 2 Meg ROM CY61257R2*V0/CY61256R2*V0 Cypress Semiconductor 32K x 8 SRAM/2 Meg ROM - R32 Technology Device: CY61257R202V0 Package: Small TSOP QTP# 97294, V. 1.0
|
Original
|
cy61257r2v0/cy61256r2cy61257r202v0cy6157r202v0-zac+5349705604l130c/60kmc-184jesd22kmc184
|
PDF
|
N20X DIODE
Abstract: A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825
Contextual Info: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
|
Original
|
100lpqfp160lpqfp28lsoicn20x diode+9a35355ta8923ta8872ta8903ta8782ta7833transistor 123ta7811ta8825
|
PDF
|
KMC-184
Abstract: ESD test plan Q092XS1 76 HC10 hf2c N00186 PF40 TS921 TS922 TS924
Contextual Info: Q092XS1 QUALIFICATION REPORT SHORT FORM DEVICE INFORMATION TYPE TS92X FUNCTION RAIL TO RAIL HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER FAMILY FAMILY R/R OPAMP DIE PROCESS PROCESS WAFER SIZE CHIP DIMENSION µm TS921 HF2CMOS 6" 1380 * 1190 TS922 HF2CMOS 6"
|
Original
|
q092xs1ts92xts921ts924+12ts925ts922ot23-5168h1000htssop16dip16kmc-184esd test plan76 hc10hf2cn00186pf40
|
PDF
|