HLQFP 176 Package
Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)
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13x3613x4514x3717x56+1517x57o-92lot-2510x1015x15hlqfp 176 packagefbga package 14x14121 bga 10x10bga 27x27 pitch23x23lfbga 12x121.0/daewon bga 7x7hssoptqfp 14x20tsop 14x20
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