JEDEC QFP44 Search Results

QFP44-P-1010-0

Abstract: 44P6N
Contextual Info: 44P6N-A Plastic 44pin 10✕10mm body QFP EIAJ Package Code QFP44-P-1010-0.80 Weight g 0.59 Lead Material Alloy 42 MD e JEDEC Code – HD 34 b2 44 ME D 1 33 I2 HE E Recommended Mount Pad Symbol 23 11 12 22 A A2 L1 b y A1 e c F L Detail F A A1 A2 b c D E e

44P6N

Contextual Info: 44P6N-B Plastic 44pin 10✕10mm body QFP EIAJ Package Code QFP44-P-1010-0.80 Weight g 0.59 Lead Material Alloy 42 MD e JEDEC Code – HD 34 b2 44 ME D 1 33 I2 HE E Recommended Mount Pad Symbol 23 11 12 22 A c A2 L1 b y F A1 e L Detail F A A1 A2 b c D E e

QFP44

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A

jedec QFP44

Abstract: SOT205-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM

sot853

Abstract: QFP44
Contextual Info: Package outline Philips Semiconductors QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT853-1 c y X A 33 23 34 ZE 22 e A A2 E HE (A 3) A1 w pin 1 index θ M Lp bp L 44 detail X 12 1 11 w bp e ZD M D v M A v M B B HD

QFP44

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM

QFP44

Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ bp 44 Lp L 12 detail X 1 11 ZD e v M A wM

MS-022

Abstract: QFP44 SOT803-1 sot803
Contextual Info: PDF: 2003 Jan 31 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT803-1 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 pin 1 index θ bp Lp L 12 44 detail X 1 11 wM bp e v M A ZD

QFP44

Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 detail X 11 1 wM bp e ZD v M A

Contextual Info: Package outline QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT803-1 c y X A 33 23 34 22 ZE e E HE A A2 wM pin 1 index (A 3) A1 θ bp Lp L 12 44 detail X 1 11 wM bp e v M A ZD D B v M B HD 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ bp 44 Lp L 12 detail X 1 11 e ZD wM bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

DIP18 package

Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20

VQFN28

Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
Contextual Info: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一

QFP80

Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

PLCC84 package

Abstract: DBS13P DBS17P DIP18 DIP20 HDIP18 LQFP48 LQFP64 LQFP80 PLCC68
Contextual Info: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP VSO Soldering nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL

SOP18 EIAJ

Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

QFP80

Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28
Contextual Info: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一

DIP18

Abstract: DIP20 DIP40
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

sc6038

Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
Contextual Info: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL

MS-013

Abstract: MS013 jedec MS-013 SOP40 jedec DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28
Contextual Info: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 jedec MS-013 SC-43A
Contextual Info: パッケージコード一覧 ２．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)