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    JEDEC PIN1 QFN TAPE Search Results

    JEDEC PIN1 QFN TAPE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LMX2325TMX-G
    Rochester Electronics LLC LMX2325 - RoHS - T/R, PLL Freq Synthesizer PDF Buy
    HSCHD02AR0001R
    Amphenol Communications Solutions HSC Right Angle plug,Tape and Reel,Black housing PDF
    HSDNBSPPCB14WBA
    Amphenol Communications Solutions HSD Right plug,Tape and Reel,Cream white housing PDF
    HSCHD02BR1001R
    Amphenol Communications Solutions HSC Right Angle plug,Tape and Reel,Blue housing PDF
    HSCHD02CR2001R
    Amphenol Communications Solutions HSC Right Angle plug,Tape and Reel,Brown housing PDF

    JEDEC PIN1 QFN TAPE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ATMEL 740

    Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
    Contextual Info: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer


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    JESD97. 4845C ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode PDF

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


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    SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb PDF

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


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    SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100 PDF

    TPS59611

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59611RHBR TPS59611RHBT TPS59611 PDF

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59610RHBR TPS59610RHBT PDF

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT PDF

    TPS59610

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59610RHBR TPS59610RHBT TPS59610 PDF

    40spq

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59610RHBR TPS59610RHBT 40spq PDF

    TI QFN marking

    Abstract: TPS59611
    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59611RHBR TPS59611RHBT TI QFN marking TPS59611 PDF

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS59610RHBR TPS59610RHBT PDF

    tps5161

    Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT tps5161 PDF

    CDC857-2

    Abstract: CY2SSTV857-32
    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2 PDF

    CDC857-2

    Abstract: CY2SSTV857-32
    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2 PDF

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE PDF

    ML200M

    Abstract: F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2 12065A104JAT2A
    Contextual Info: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 2, 4/2005 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    MMG2401 MMG2401NR2 ML200M F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2 12065A104JAT2A PDF

    Schematics 5250

    Abstract: schematic 5250 GP 035 F QFN 3X3 A113 A114 A115 AN1955 C101 JESD22
    Contextual Info: Document Number: MMG5004N Rev. 0, 8/2006 Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology InGaP HBT MMG5004NR2 WLAN Power Amplifier Designed for 802.11a applications with frequencies from 4900 to 5900 MHz. • 23 dBm P1dB CW @ 5.25 GHz


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    MMG5004N MMG5004NR2 Schematics 5250 schematic 5250 GP 035 F QFN 3X3 A113 A114 A115 AN1955 C101 JESD22 PDF

    12065A104JAT2A

    Abstract: 12065A105JAT2A F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2
    Contextual Info: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 3, 5/2006 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    MMG2401 MMG2401NR2 12065A104JAT2A 12065A105JAT2A F QFN 3X3 A113 A114 A115 C101 JESD22 MMG2401 MMG2401NR2 PDF

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE PDF

    QFN-40 weight

    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CDC857-2 48-pin CY2SSTV857-32 QFN-40 weight PDF

    12065A104JAT2A

    Contextual Info: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 3, 5/2006 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    MMG2401 MMG2401NR2 12065A104JAT2A PDF

    12065A104JAT2A

    Contextual Info: Freescale Semiconductor Technical Data Document Number: MMG2401 Rev. 2, 4/2005 Indium Gallium Phosphorus HBT WLAN Power Amplifier Designed for 802.11g and dual mode applications with frequencies from 2400 to 2500 MHz. MMG2401NR2 • 26.5 dBm P1dB @ 2450 MHz


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    MMG2401 MMG2401NR2 MMG2401 12065A104JAT2A PDF

    CDC857-2

    Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 CY2SSTV857LFI-32 PDF

    JEDEC MO 224

    Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
    Contextual Info: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps


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    CY2SSTU877 500-MHz, 10-Output 52-ball 40-pin CY2SSTU877 JEDEC MO 224 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape PDF

    PC3200-Compliant

    Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    CY2SSTV857-32 DDR400/PC3200-Compliant 400-MHz CDC857-2 48-pin CY2SSTV857-32 250MHz 230MHz PC3200-Compliant PDF