JEDEC PACKAGE STANDARDS Search Results

Contextual Info: OM1905STM OM1912STM OM1915STM QM1905NTM OM1912NTM OM1915NTM ISOLATED HERMETIC FIXED VOLTAGE NEGATIVE REGULATORS APPROVED TO DESC DRAWINGS Three Terminal, Fixed Voltage, 1.5 Amp Precision Negative Regulators In Hermetic JEDEC TO-257AA Package FEATURES Isolated Hermetic Package, JEDEC TO-257AA Outline

JEDEC Jc-11 free

Abstract: Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines
Contextual Info: JEDEC Publication 95 Microelectronic Package Standard Application Report 1999 Printed in U.S.A. 0199 SZZA006 JEDEC Publication 95 Microelectronic Package Standard SZZA006 January 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products

do-204ac footprint

Abstract: DO-204AC F126 TP30-100 TP30-62 TP30-68 VDE0433 VDE0878
Contextual Info: TP30-xxx Series  TRISILTM FEATURES BIDIRECTIONAL CROWBAR PROTECTION. VOLTAGE RANGE: FROM 62 V TO 270 V. HOLDING CURRENT : IH = 150 mA min. REPETITIVE PEAK PULSE CURRENT : IPP = 30 A, 10/1000 µs. JEDEC REGISTERED PACKAGE OUTLINE F126 JEDEC DO-204AC DESCRIPTION

SMP30-100

Abstract: SMP30-120 SMP30-62 SMP30-68 VDE0433 VDE0878
Contextual Info: SMP30-xxx Series  TRISILTM FEATURES BIDIRECTIONAL CROWBAR PROTECTION. VOLTAGE RANGE: FROM 62 V TO 270 V. HOLDING CURRENT : IH = 150 mA min. REPETITIVE PEAK PULSE CURRENT : IPP = 30 A, 10/1000 µs. JEDEC REGISTERED PACKAGE OUTLINE SMA JEDEC DO-214AA DESCRIPTION

SMP30-100

Abstract: SMP30-120 SMP30-62 SMP30-68 VDE0433 VDE0878 TR-NWT001089
Contextual Info: SMP30-xxx Series  TRISILTM FEATURES n n n n n BIDIRECTIONAL CROWBAR PROTECTION. VOLTAGE RANGE: FROM 62 V TO 270 V. HOLDING CURRENT : IH = 150 mA min. REPETITIVE PEAK PULSE CURRENT : IPP = 30 A, 10/1000 µs. JEDEC REGISTERED PACKAGE OUTLINE SMA JEDEC DO-214AA

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

BUV 481

Abstract: bbg "marking" diode IPC7531 bbg marking st transil marking bbz ST BUN marking BBW smbj12a SMBJ24a SMBJ12A-TR
Contextual Info: SMBJ Transil Features • Peak pulse power: – 600 W 10/1000 s ■ Stand off voltage range: from 5 V to 188 V ■ Unidirectional and bidirectional types ■ Operating Tj max: 150 °C ■ JEDEC registered package outline A K Unidirectional SMB (JEDEC DO-214AA)

smd transistor M7A

Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
Contextual Info: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages

HC2700JL

Contextual Info: HC2700LCC SERIES MyComp, Inc. +10 V, -10 V, and ±10 V Precision Vbltage References in JEDEC-Compatible Leadless Chip Carrier Packages FEATURES • 2700 - Type Reference in JEDEC-Compatible 28-Pin LCC Package • Standard Outputs of +10 V, -1 0 V, ±10 V • Kelvin Sense/Force

ST FBJ

Abstract: SMCJ24A st fus diode IEC60286-3 SMCJ15CA SMCJ40A data sheet marking gbn STMicroelectronics MARKING CODE FUB 1SMCJ SMCJ48A
Contextual Info: SMCJ Transil Features • Peak pulse power: – 1500 W 10/1000 s ■ Stand off voltage range: from 5 V to 188 V ■ Unidirectional and bidirectional types ■ Operating Tj max: 150 °C K ■ JEDEC registered package outline Unidirectional A SMC (JEDEC DO-214AB)

4146

Contextual Info: SMLVT3V3 Low voltage Transil Features • Peak pulse power 600 W 10/1000 s ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed

Contextual Info: SMLVT3V3 Low voltage Transil Features • Peak pulse power 600 W 10/1000 s ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed

JEDEC DO-214AA

Abstract: marking sm DO-214AA DO-214AA 3v3 do-214aa footprint JESD97 DO-214AA diode SMLVT3V3
Contextual Info: SMLVT3V3 Low voltage Transil Features • Peak pulse power 600 W 10/1000 s ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed

TE1204

Abstract: ta7291 SSOP10 Package EIA481A RC-1009B
Contextual Info: [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 1. Scope Specifications for embossed-tape packing for flat-package bipolar ICs and related issues such as ordering are usually in accordance with the relevant JEITA and JEDEC standards (RC-1009B and

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

TiO2

Abstract: AA0177 PB10 PB12
Contextual Info: SECTION 3 PACKAGING PACKAGE AND PIN-OUT INFORMATION This section contains package and pin-out information for the 100-pin Thin Quad Flat Pack TQFP configuration of the DSP56L811. All devices manufactured by Motorola conform to current JEDEC standards. Complete mechanical information regarding DSP56L811 packaging is available

schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Contextual Info: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

1500IC

Contextual Info: 6. Embossed Taping Specifications for Flat Packages 1. Scope Embossed taping package specification for bipolar IC flat package products and related matters are, as a rule, in accordance with EIAJ RC-1009B and JEDEC (EIA481A). 2. Shapes and Sizes of Tapes

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs