JEDEC PACKAGE STANDARDS Search Results

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

HC2700JL

Contextual Info: HC2700LCC SERIES MyComp, Inc. +10 V, -10 V, and ±10 V Precision Vbltage References in JEDEC-Compatible Leadless Chip Carrier Packages FEATURES • 2700 - Type Reference in JEDEC-Compatible 28-Pin LCC Package • Standard Outputs of +10 V, -1 0 V, ±10 V • Kelvin Sense/Force

4146

Contextual Info: SMLVT3V3 Low voltage Transil Features • Peak pulse power 600 W 10/1000 s ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed

JEDEC DO-214AA

Abstract: marking sm DO-214AA DO-214AA 3v3 do-214aa footprint JESD97 DO-214AA diode SMLVT3V3
Contextual Info: SMLVT3V3 Low voltage Transil Features • Peak pulse power 600 W 10/1000 s ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

TiO2

Abstract: AA0177 PB10 PB12
Contextual Info: SECTION 3 PACKAGING PACKAGE AND PIN-OUT INFORMATION This section contains package and pin-out information for the 100-pin Thin Quad Flat Pack TQFP configuration of the DSP56L811. All devices manufactured by Motorola conform to current JEDEC standards. Complete mechanical information regarding DSP56L811 packaging is available

1500IC

Contextual Info: 6. Embossed Taping Specifications for Flat Packages 1. Scope Embossed taping package specification for bipolar IC flat package products and related matters are, as a rule, in accordance with EIAJ RC-1009B and JEDEC (EIA481A). 2. Shapes and Sizes of Tapes

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

330g

Abstract: 953F
Contextual Info: Package Dimensions Modified TO-220 The Modified TO-220 package is designed to meet mechanical standards as set forth in JEDEC publication number 95. A O D TEMPERATURE MEASUREMENT POINT F P G PIN 3 PIN 2 PIN 1 L M K H N J Millimeters MIN MAX MIN MAX A 0.400

Contextual Info: i860 64-BIT MICROPROCESSOR • Compatible with Industry Standards — ANSI/IEEE Standard 754-1985 for Binary Floating-Point Arithmetic — 386™ /i486TM Microprocessor Data Formats and Page Table Entries — JEDEC 168-pin Ceramic Pin Grid Array Package see Packaging

7912

Abstract: 7912 12V 1A negative voltage regulator datasheet 7915 fixed voltage regulator 7905 regulator 7912 regulator datasheet data sheet 7912 OM1905NTM OM1905STM OM1912NTM OM1912STM
Contextual Info: OM1905STM OM1912STM OM1915STM OM1905NTM OM1912NTM OM1915NTM ISOLATED HERMETIC FIXED VOLTAGE NEGATIVE REGULATORS APPROVED TO DESC DRAWINGS Three Terminal, Fixed Voltage, 1.5 Amp Precision Negative Regulators In Hermetic JEDEC TO-257AA Package FEATURES • •

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

ox-6500

Contextual Info: Crystal oscillator Oven Controlled Crystal Oscillator OCXO OX-6500GG series •Features : : : : Low profile full SMD package Very fast warm-up and accurate stability IPC/JEDEC J-STD-020C reflowable SC-Cut Crystal unit Specifications (characteristics) Item

Contextual Info: Moisture Absorption Control Level Moisture Sensitivity Level Product Name : TCK106G Package Name : WCSP4 Always store the Product under moisture sensitivity level equivalent to level 1 (JEDEC J-STD-020 Moisture Sensitivity Level). In the event the Product

7905/7912 voltage regulator

Abstract: 0001h31 7905 regulator 7915 fixed voltage regulator 7915 negative voltage regulator L 7912 OM1905NTM OM1905STM OM1912NTM OM1912STM
Contextual Info: OM1905STM OM19Q5NTM OM1912STM OM1912NTM OM1915STM OM1915NTM ISOLATED HERMETIC FIXED VOLTAGE NEGATIVE REGULATORS APPROVED TO DESC DRAWINGS B FEATURES • • • • • • • Isolated Hermetic Package, JEDEC TO-257AA Outline Output Voltages: -5V, -12V, -15V

Contextual Info: Crystal oscillator Epson Toyocom Oven Controlled Crystal Oscillator OCXO OX - 6500GG series •Features : : : : Low profile full SMD package Very fast warm-up and accurate stability IPC/JEDEC J-STD-020C reflowable SC-Cut Crystal unit Specifications (characteristics)

Contextual Info: Crystal oscillator Epson Toyocom Oven Controlled Crystal Oscillator OCXO OX - 6500GG series •Features : : : : Low profile full SMD package Very fast warm-up and accurate stability IPC/JEDEC J-STD-020C reflowable SC-Cut Crystal unit Specifications (characteristics)

J-STD-020D

Abstract: TOYOCOM CRYSTAL OSCILLATOR 6 mhz 6501G
Contextual Info: Crystal oscillator Epson Toyocom Product number please contact us X1G002901xxxx00 Oven Controlled Crystal Oscillator (OCXO) OX - 6501GG series •Features : : : : Low profile full SMD package Very fast warm-up and accurate stability IPC/JEDEC J-STD-020D reflowable

Contextual Info: Moisture Absorption Control Level Moisture Sensitivity Level Product Name : TCA62723FMG Package Name : SON10 Always store the Product under moisture sensitivity level equivalent to level 1 (JEDEC J-STD-020 Moisture Sensitivity Level). In the event the Product

Contextual Info: VS-VSKCU300/06PbF www.vishay.com Vishay Semiconductors Ultrafast Diodes, 300 A INT-A-PAK Power Modules FEATURES • Electrically insulated by DBC ceramic • 3500 VRMS isolating voltage • Standard JEDEC package • Simplified mechanical designs, rapid assembly

Contextual Info: Bulletin PD-21073 08/05 IRKDU162/12 HexfredTM Utrafast DIODES INT-A-pakTM Power Modules Features Electrically isolated: DBC base plate 100 A 3500 VRMS isolating voltage Standard JEDEC package Simplified mechanical designs, rapid assembly High surge capability

Contextual Info: Bulletin PD-21073 08/05 IRKDU162/12 HexfredTM Utrafast DIODES INT-A-pakTM Power Modules Features Electrically isolated: DBC base plate 100 A 3500 VRMS isolating voltage Standard JEDEC package Simplified mechanical designs, rapid assembly High surge capability

Contextual Info: VS-VSKDU300/06PbF www.vishay.com Vishay Semiconductors Ultrafast Diodes, 300 A INT-A-PAK Power Modules FEATURES • Electrically insulated by DBC ceramic • 3500 VRMS isolating voltage • Standard JEDEC package • Simplified mechanical designs, rapid assembly