JEDEC FBGA 11 Search Results

K4W1G1646E

Abstract: samsung K4W1G1646E-HC11
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646E 1Gb gDDR3 SDRAM E-die 96 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

K4W1G1646D-EC15

Abstract: K4W1G1646D
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646D 1Gb gDDR3 SGRAM D-die 100 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

Contextual Info: 1Gb DDR3 SDRAM K4B1G04 08/16 46D 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Pb-free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

Contextual Info: V826765G24SA 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

ddr4

Contextual Info: V826765G24SB 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

DRAM 2164

Abstract: pc133 SDRAM DIMM PC133 registered reference design 168-PIN Registered FBGA SDRAM
Contextual Info: 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory

PC133 registered reference design

Contextual Info: ADVANCE 64 MEG x 72 REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472 For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html PIN ASSIGNMENT Front View 168-Pin DIMM FEATURES • JEDEC-standard, 168-pin, dual in-line memory

Contextual Info: PRELIMINARY‡ 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory

MO-205

Contextual Info: Revised June 2001 BGA114A 114-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA114A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

DDR2 DIMM 240 pinout

Abstract: 1G DDR2 667 DDR DIMM SPD JEDEC KVR667D2S8F5
Contextual Info: Memory Module Specifications KVR667D2S8F5/1G 1GB 128M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM’s 1GB 128M x 72-bit FBDIMM Module 240-pin JEDEC Standard R/C A nine 128M x 8-bit 667MHz DDR2 FBGA components. The mod-

MO-205

Abstract: BGA54A
Contextual Info: Revised June 2001 BGA54A 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA54A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

MO-205

Abstract: BGA96A
Contextual Info: Revised June 2001 BGA96A 96-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA96A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

Contextual Info: Memory Module Specification T E C H N O L O G Y KHX13000D3LL/1G 1GB 128M x 64-Bit PC3-13000 CL7 240-Pin DIMM DESCRIPTION: This document describes Kingston's 128M x 64-bit 1GB 1024MB DDR3-1625 CL7 SDRAM (Synchronous DRAM) memory module, based on eight 128M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR31625MHz at a low latency timing of 7-7-7 at 1.9V. The SPD is programmed to JEDEC standard latency DDR3-1066Mhz

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

JEDEC TRAY DIMENSIONS FBGA

Abstract: 529-Pin
Contextual Info: TRAY CONTAINER A' 14.65 7 135°C MAX 18.35 A FBGA14x14ESP 12.90 NEC 110.1 135.9 PPE 7×18=126 UNIT : mm 14.65 17.10 290.7 12.15 315.0 322.6 SECTION A – A' 14.65 (5.85) (5.62) 7.62 14.00 Applied Package Quantity (pcs) FBGA 14×14 ESP Tray 157-pin Plastic FBGA (14×14)

JEDEC FBGA

Abstract: 196-PIN 181-pin
Contextual Info: TRAY CONTAINER UNIT : mm 11x29=319 NEC 7 8.20 296.8 315.0 322.6 8.20 Section A – A' 8.00 (5.62) 7.62 11.65 135°C MAX. 8.20 10.60 9.10 (6.04) 116.5 A' FBGA8×8ESP 9.70 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA8×8ESP Material Carbon PPE 121-pin PLASTIC FBGA (8×8)

JEDEC tray standard 13

Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)

SSD-A-H7391-2

Abstract: FBGA 152 JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC 135°C MAX. A' 16.15 13.40 16.00 FBGA13×13ESP 13.40 12.15 290.7 315.0 322.6 Section A – A' 13.40 (5.62) (5.82) 12.70 7.62 11.95 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 13×13 ESP 381-pin Plastic FBGA (12.7×12.7)

FBGA

Abstract: 361 pin FLGA JEDEC FBGA 11 FBGA11
Contextual Info: TRAY CONTAINER NEC 114.0 7 A' 11.74 14.25 10.95 FBGA11x11 ESP A 135°C MAX 135.9 PPE 9×22=198 UNIT : mm 11.74 294.0 14.00 10.50 315.0 322.6 (5.91) 11.74 11.00 (5.62) 7.62 SECTION A – A' Applied Package Quantity (pcs) FBGA 11×11 ESP Tray 108-pin Plastic FBGA (11×11)

FBGA 63

Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
Contextual Info: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard fBGA package tray 129-pin JEDEC TRAY DIMENSIONS FBGA FBGA FBGA tray JEDEC FBGA fBGA 80 package
Contextual Info: TRAY CONTAINER UNIT : mm 10x26=260 9.30 12.80 9.30 11.80 295.0 10.00 315.0 322.6 SECTION A – A' 9.30 Applied Package (5.89) (5.62) 9.00 7.62 10.35 135°CMAX. 7 NEC 115.2 FBGA9×9ESP 135.9 PPE A' A Quantity (pcs) 73-pin Plastic FBGA (9×9) 80-pin Plastic FBGA (9×9)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
Contextual Info: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)

JEDEC tray standard 490

Abstract: FBGA
Contextual Info: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 49-pin Plastic FBGA (4×4) 64-pin Plastic FBGA (4×4) Quantity (pcs)