JEDEC 78 Search Results

1N623

Abstract: 1N6377 1N6281A 1N6284 1N6269A MPTE-15 1N6267 1N6267A 1N6273 1N6383
Contextual Info: MDE Semiconductor, Inc. 78-150 Calle Tampico, Unit 210, La Quinta, CA. U.S.A. 92253 Tel: 760-564-8656 Fax: 760-564-2414 1-800-831-4881 Email: sales@mdesemiconductor.com Web: www.mdesemiconductor.com JEDEC AND INDUSTRY STANDARD DEVICES MANUFACTURED JEDEC JEDEC

SMD Packages

Contextual Info: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of

Contextual Info: JEDEC JESD204A data converter interface Technical analysis Rev. 2.1 — 14 October 2011 White paper Document information Info Content Keywords JEDEC JESD204A, High-speed data converters Abstract This report describes the technical details of JEDEC JESD204A interface

JESD204

Abstract: GSM transmitter receiver spartan hdmi JESD204A 4bit serializer abstract
Contextual Info: R_10002 Technical analysis of the JEDEC JESD204A data converter interface Rev. 01 — 12 April 2010 Document information Info Content Keywords JEDEC JESD204A, High-speed data converters Abstract Report R_10002 NXP Semiconductors Technical analysis of the JEDEC JESD204A data converter interface

1N4536

Abstract: 1N3604 1N4606 1N3605 RLS4152 1n4533
Contextual Info: ¥•4 1N 1N Series K /D iodes Series *-r-y * - K Switching Diodes • JEDEC JSfêpp/JEDEC Standards • W f i "yfälSl/Dimensions Unit : mm JEDEC M ftä J H T , t& u sk<T) 1N v U - X ' f e S i i L t t « ? '< r m î < 1N Series conforming to JEDEC Standards are also available so that

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: DIMM 100 Pin Socket DIMM-100 Series OUTLINE DMM series is DIMM socket which is conforming to JEDEC. It is applied to memory modules for laser printer, facsimile and other peripherals. Conforming S ta n d a r d FEATURES JEDEC ● Applicable memory modules are 100pins of 1.27mm pitch which conforms to JEDEC.

K4B2G1646B-HCH9

Abstract: "2Gb DDR3 SDRAM" k4B2G1646 k4b2g1646b 128mx16 ddr3 K4B2G0846B-HCH9 samsung DDR3 SDRAM 2GB K4B2G16 DDR3 DRAM 2GB 128Mx16 96BALL FBGA K4B2G0846B-HCF7
Contextual Info: 2Gb DDR3 SDRAM K4B2G04 08/16 46B 2Gb B-die DDR3 SDRAM Specification 78 / 96 FBGA with Lead-Free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

IC 290 8pin

Abstract: C17200
Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

18012

Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

IPC 4101A

Abstract: IS410 4101A
Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

A110 E

Abstract: TSW11
Contextual Info: Preliminary 512Mb DDR3 SDRAM K4B510846E 512Mb E-die DDR3 SDRAM Specification Revision 0.5 December 2006 CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

AN7254

Abstract: AN7260 AN9321 AN9322 HUF75925D3ST HUF75925P3 TB334
Contextual Info: HUF75925P3, HUF75925D3ST Data Sheet December 2000 File Number 5007 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST

Contextual Info: $ 4 # — K /D iodes IN S e rie s • JEDEC 1N Series 1 -K Switching Diodes JEDEC Standards • [2/Dimensions Unit : mm JED EC « fè&LLZ, £<7>1N v ' J - X f c t l i t l , T Î S ^ Î - Î '< 7 ) T '^ W < tc è^ \ 1N Series conforming to JEDEC Standards are also available so that

Contextual Info: HUF75925P3, HUF75925D3ST Data Sheet December 2000 File Number 5007 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST

Contextual Info: HUF75925P3, HUF75925D3ST TM Data Sheet December 2000 File Number 5007 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST

76419S

Abstract: HUFA76419P3 HUFA76419S3S HUFA76419S3ST TB334 76419P 76419
Contextual Info: HUFA76419P3, HUFA76419S3S Data Sheet November 2000 File Number 4978 27A, 60V, 0.040 Ohm, N-Channel, Logic Level UltraFET Power MOSFETs Packaging JEDEC TO-220AB JEDEC TO-263AB DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUFA76419P3 HUFA76419S3S

76419S

Abstract: AN7254 AN9321 AN9322 HUF76419P3 HUF76419S3S HUF76419S3ST TB334
Contextual Info: HUF76419P3, HUF76419S3S Data Sheet August 1999 File Number 4669.1 27A, 60V, 0.040 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging Features JEDEC TO-220AB JEDEC TO-263AB DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUF76419P3 HUF76419S3S

K4W1G1646D-EC15

Abstract: K4W1G1646D-EJ11 K4W1G1646D-EC gDDR3-1800 DDR3 DIMM 240 pinout GDDR3 SDRAM 256Mb JESD51-2 VIH150 SAMSUNG GDDR3 K4W1G1646D
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646D 1Gb gDDR3 SGRAM D-die 100 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

Contextual Info: HUF75925P3, HUF75925D3ST Data Sheet December 2003 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST • Ultra Low On-Resistance

AN7254

Abstract: AN7260 AN9321 AN9322 HUF75925D3ST HUF75925P3 TB334
Contextual Info: HUF75925P3, HUF75925D3ST Data Sheet December 2001 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST • Ultra Low On-Resistance