J64 PACKAGE Search Results
J64 PACKAGE Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TPH1R306PL |
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N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
TPH9R00CQ5 |
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N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet | ||
TPHR8504PL |
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N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
XPH2R106NC |
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N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) | Datasheet |
J64 PACKAGE Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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J64 Package |
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Plastic Leaded Chip Carriers | Original | 279.46KB | 4 |
J64 PACKAGE Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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85003
Abstract: J64 Package
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20-Lead 1-85000-A 28-Lead 1-85001-A 32-Lead 51-85002-B 44-Lead 1-85003-A 52-Lead 1-85004-A 85003 J64 Package | |
52-Lead
Abstract: 20 002 32-Lead carrier chip led J69 Package led circuit diagram led datasheets J64 Package
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20-Lead 28-Lead 32-Lead 44-Lead 52-Lead 68-Lead 84-Lead 20 002 carrier chip led J69 Package led circuit diagram led datasheets J64 Package | |
Contextual Info: fax id: 6010 PyfP PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 1 0 ,1 5 , and 25 ns com ’I version • Active pull-up on data input pins • Low power version 20V8L — 15, and 25 ns military/industrial versions |
OCR Scan |
PALCE20V8 20V8L) PALCE20V8 | |
20V88
Abstract: cerdip 16 lead 20V8-5 cg00
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PALCE20V8 20V8L) PALCE20V8 20V88 cerdip 16 lead 20V8-5 cg00 | |
20V8
Abstract: PALCE20V8 20L8
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PALCE20V8 20V8L) PALCE20V8 20V8 20L8 | |
64 CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: 20V8-5 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 PALCE20V8 28-PIN
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PALCE20V8 20V8L) PALCE20V8 64 CERAMIC LEADLESS CHIP CARRIER LCC 20V8-5 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 28-PIN | |
20V88
Abstract: 20L8 20V8 PALCE20V8
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PALCE20V8 20V8L) PALCE20V8 20V88 20L8 20V8 | |
Contextual Info: CYPRESS PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10,15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns) — 15, and 25 ns military/industrial versions |
OCR Scan |
20V8L) PALCE20V8 300-Mil) 28-Pin PALCE20V8L-15JI PALCE20V8L-15PI PALCE20V8L-15QI PALCE20V8L-15DMB PALCE20V8L-15LMB | |
CERAMIC LEADLESS CHIP CARRIER
Abstract: 20L8 20V8 PALCE20V8 ULTRA37000TM
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ULTRA37000TM PALCE20V8 20V8L) PALCE20V8 Ultra37000 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 | |
20V8
Abstract: 20L8 PALCE20V8
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PALCE20V8 20V8L) PALCE20V8 20V8 20L8 | |
20V8-25
Abstract: 20L8 20V8 PALCE20V8 ULTRA37000TM CG-02
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ULTRA37000TM PALCE20V8 20V8L) PALCE20V8 Ultra37000 20V8-25 20L8 20V8 CG-02 | |
C2613
Abstract: C2614 c2615 C2611 C2617 7C261 7C264 CY7C261 CY7C263 CY7C264
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CY7C261 CY7C263/CY7C264 CY7C261, CY7C263, CY7C264 8192-word 7C261 300-mil-wide 7C263 7C264 C2613 C2614 c2615 C2611 C2617 CY7C261 CY7C263 | |
VX 1818
Abstract: 22V10G-7 TS13-1 PAL22
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OCR Scan |
PAL22V10G PAL22VP10G PAL22VP10G) 300-Mil) 28-Pin PAL22VP10G- 28-Lead 24-Lead VX 1818 22V10G-7 TS13-1 PAL22 | |
22V10G-7Contextual Info: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under shoot • PLCC and LCC packages w ith addi tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous |
OCR Scan |
PAL22V10G PAL22VP10G PAL22VP10G 10LMB 22V10G-7 | |
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semiconductor c243
Abstract: transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G CY7C243
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CY7C243 CY7C244 CY7C243 CY7C244 300-mil-wide 600-mil-wide semiconductor c243 transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G | |
cy7c245a-35dmb
Abstract: 7C245A CERAMIC LEADLESS CHIP CARRIER CY7C245A CY7C245A35DMB CY7C245A-35PC C245A-1 CY7C245A-25DMB
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CY7C245A CY7C245A 300-mil 15-ns 10-ns cy7c245a-35dmb 7C245A CERAMIC LEADLESS CHIP CARRIER CY7C245A35DMB CY7C245A-35PC C245A-1 CY7C245A-25DMB | |
b0615
Abstract: BUS-65515 5962-8869201XC Phar Lap common mode rejection ratio test 1553B BUS-27765 BUS-65517II BUS-65520 bu-63147 microchannel
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OCR Scan |
MIL-STD-1553 BUS-27765 5962-86049-02ZC. MIL-STD-1553A/B. BUS-25679 BUS-29854 -1US-69029 b0615 BUS-65515 5962-8869201XC Phar Lap common mode rejection ratio test 1553B BUS-65517II BUS-65520 bu-63147 microchannel | |
js28f256p
Abstract: s162d RGMII phy Xilinx MT4JSF6464HY-1G1
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ML605 UG534 2002/96/EC 2002/95/EC 2006/95/EC, 2004/108/EC, js28f256p s162d RGMII phy Xilinx MT4JSF6464HY-1G1 | |
semiconductor c243
Abstract: C2432
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OCR Scan |
CY7C243 CY7C244 CY7C244 300-m 600-mil-wide semiconductor c243 C2432 | |
Contextual Info: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest |
OCR Scan |
PAL22VP10G) 300-M PAL22 10DMB L22VP10G 10LMB 28-Pin | |
Contextual Info: PAL22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi |
OCR Scan |
PAL22V10G PAL22VP10G PAL22VP10G) L22V10G PAL22VP10G h00-M 28-Pin 300-M 24-Lead | |
22V10C
Abstract: PAL22V10C-7DC
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OCR Scan |
PAL22V10C PAL22VP10C PAL22V10C PAL22VP10C PAL22VP10C--12DC PAL22VP10C-12JC 22V10C PAL22V10C-7DC | |
CY7C245A-25WMB
Abstract: 7C245A CY7C245A a9242 C245A-5
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CY7C245A CY7C245A 300mil CY7C245A-25WMB 7C245A a9242 C245A-5 | |
7C245A-35
Abstract: CY7C245A-25WMB CY7C245A-25QMB LM340-XX CY7C245A
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CY7C245A 15-ns CY7C245A 300-mil 10-ns 7C245A-35 CY7C245A-25WMB CY7C245A-25QMB LM340-XX |