ITZEHOE Search Results

smd w2h

Abstract: SLF0905 KOA RK73H KOA RK73 RK73 RK73G tdb 158 KOA RK73B smd code W2H HV73
Contextual Info: PACKAGING SMD TAPE AND REEL Standard packagings are shown in ”bold” letters. RN73-series is available on 7“ ø 178 mm and 10“ (ø 255 mm) reels. EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de

c4212

Abstract: transistor c4212 transistor c2307 c4314 c4204 c4212 h c2307 c4304 C4302 C4202
Contextual Info: TRIMMER POTENTIOMETER METAL GLAZE • CARBON FILM C2xxx, C3xxx, C4xxx • KVSF807LG TYPE DESIGNATION HOW TO ORDER C 4222 A TE 103 PRODUCT CODE STYLE TERMINATION SURFACE MATERIAL TAPING* NOMINAL RESISTANCE *Please see “PACKAGING” Products with Pb-free terminations

airbag

Contextual Info: Tem ic S e m i c o n d u c t o r s About TEMIC TEM IC is the m icroelectronics enterprise of Daim ler-Benz. Organized into four divisions — Semiconductors, M icrosystem s, Automotive Electronics, and Airbag Inflators — TEM IC offers products for the computer, com munications, auto­

TCR50

Abstract: 100-511K Resistance color bands RN41 size 0204
Contextual Info: RESISTORS MELF TYPE 1 2 3 4 5 6 RESISTORS STRUCTURE RN41 METAL FILM • JUMPER RN41 • CC Protective coating Trimming cut Ceramic rod Cap iron solder plated Metal film Marking STRUCTURE CC IDENTIFICATION TYPE Contact our sales representatives before you use our products for applications including

Contextual Info: FLAT CHIP HIGH FREQUENCY THIN FILM RESISTOR SHDR STRUCTURE 1 Protective coating 2 Electrode 3 Rear metalization TYPE DESIGNATION HOW TO ORDER SHDR 001 G K PRODUCT CODE REFERENCE NUMBER TERMINATION SURFACE MATERIAL K: chip tray 001: 0202 004: 0402 G: Au 391

RC-2133A

Abstract: RN73h 820 marking E192 RN73H1E RN73H2A
Contextual Info: RESISTORS METAL THIN FILM, PRECISION HIGH HEAT RESISTANT RN73H STRUCTURE IDENTIFICATION COATING COLOR RN73H 1E RN73H 1J Black RN73H 2A . 2E * Red marking for T.C.R ± 5 and ±10 ppm/K TYPE 2A STYLE None Yellow, 3 digits E24 * None (E96) Yellow, 4 digits*

CND1J

Abstract: CND1J10K CND1J10Y CND2B10 CND2B10V MARKING CND
Contextual Info: NETWORKS bussed r-networks CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR a b CND1J10VK , CND2B10 a CND1J10K Black CND2B10Vb CND1J10Y, CND2A10Y

kq0603

Abstract: flat ferrit core 12N35
Contextual Info: INDUCTORS AIR CORE 4 5 W WIREWOUND CHIP INDUCTOR KQ 0603 STRUCTURE 2 H 1 2 3 4 5 Ht 1 Wt P L 3 Ceramic core Ferrit content at L ≥ 330nH Winding wire Electrode Inner coat Flat top film IDENTIFICATION PRODUCT CODE BODY COLOR MARKING KQ 0603 Black 1 digit

4N0404

Abstract: CN1J4 CN1E MARKING 1F R610 CN1J2K CN-k CN1E4K RESISTOR ARRAY 4 0402
Contextual Info: NETWORKS THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 CN1H2N CN1H4N P CN1E2K, CN1J2K Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating CN1J4A, CN2B4A CN1E4K, CN1F N 8K, CN1J4K

Contextual Info: LOW OHM L METAL PLATE L W W CURRENT SENSING POWER SHUNT CHIP PSI • PSE 2 3 2 3 t t d 4 1 d 4 1 PSI / PSE: 1 mΩ & 2mΩ STRUCTURE 1 2 3 4 L L W LOW OHM W PSI: 3 mΩ & 4 mΩ 2 3 2 t t IDENTIFICATION d 1 d 1 PRODUCT CODE 3 COATING COLOR MARKING No coating

linear ptc thermistors 0805

Abstract: LA73
Contextual Info: THERMAL SENSORS THERMAL SENSORS LINEAR PTC THICK FILM LA 73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Bottom termination Thick film resistor element Protective layer End termination Diffusion barrier Ni Solder plating IDENTIFICATION PRODUCT CODE

KL32

Abstract: LFC32
Contextual Info: INDUCTORS FERRITE CORE W L WIREWOUND MOLDED CHIP INDUCTOR LFC32 KL32 1 4 1 STRUCTURE H tH t� W 1 2 3 4 Ferrite core Winding wire Terminal copper base) Molded resin d 2 3 IDENTIFICATION PRODUCT CODE COATING COLOR MARKING Silver LFC32 / KL32 Black 3 digit Inductance

SR73

Abstract: SR73-2B SR732E SR731J SR732A SR731E RC-2134B
Contextual Info: LOW OHM Thick Film CURRENT Sensing Chip SR73 STRUCTURE IDENTIFICATION COATING MARKING COLOR SR73 1H Black SR73 1E None SR73 1J 1% SR73 1J (2%, 5%) Indigo White, 3 digits SR73 2A…W3A (2%, 5%) SR73 2A…W3A (0.5%, 1%) White, 4 digits PRODUCT CODE Ceramic substrate

CN1J4

Contextual Info: NETWORKS THICK FILM R-NETWORK NETWORKS PASSIVE COMPONENTS CONcave TERMINATIONS Anti sulfuration CN RT • CNZ RT W NE STRUCTURE 1 2 3 4 5 6 Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating IDENTIFICATION

LTCC

Abstract: ltcc chip
Contextual Info: LTCC SUBSTRATES LTCC LTCC MULTILAYER SUBSTRATES KLC STRUCTURE ⑩ ① 1 2 3 4 5 6 7 8 9 10 ② ⑨ ③ ⑧ ④ ⑦ ⑥ Cavity IC-chip Conductor pattern Via Capacitor Thermal via Inductor Transmission line Buried resistor Surface resistor All these products meet

Contextual Info: NETWORKS THICK FILM R-NETWORKS STRUCTURE LOw profile sip rkl 1 2 3 4 5 6 7 8 Ceramic substrate Pin connection Printed conductor Ag, Pd Resistive layer Glass layer Solder plated copper term. Epoxy powder overcoating Marking coating color marking RKL Black

RK26

Contextual Info: RESISTORS metal FILM metal glaze radial Type LF • LFF radial Type rK 26 STRUCTURE 1 2 3 4 5 6 7 Epoxy resin overcoating Marking Trimming line Ceramic core Steel cap Cu, Sn plated Termination Trimmed resistive layer Identification produCt code coating color

LOW RESISTANCE RESISTOR TLR

Abstract: TLR3AW
Contextual Info: LOW Ohm Metal plate Current Sensing Milliohm Chip TLR ⑤ STRUCTURE L 1 2 3 4 5 W ② ④ t Low Ohm d ① d ③ Protective bottom coating Electrode Resistive Element Solder Protective top coating 3A, 3AW (1mΩ only IDENTIFICATION PRODUCT CODE COATING TLR3AD,

RESISTOR AXIAL 0617

Abstract: M100K
Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW METAL GLAZE STRUCTURE AXIAL TYPE RK 1 2 3 4 5 6 7 Ceramic core Trimmed metal glaze layer Steel cap Cu, Sn plated Solder plated copper wire Welding joint Epoxy resin overcoating Marking IDENTIFICATION PRODUCT CODE COATING COLOR

Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS THIN FILM CURRENT FUSE TF10AN • TF16SN STRUCTURE 1 2 3 4 5 6 7 8 W NE Ceramic substrate Top termination Bottom termination Fuse element Cu based Protective coating End termination (Ni Cr)

106 25v

Contextual Info: CAPACITORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC CHIP Y5V 1 2 3 4 5 C Sn plating Ni plating Inner electrode Pd/Ag Internal electrode Dielectric ceramic layer t L W IDENTIFICATION DIELECTRIC COATING COLOR MARKING Y5V Black None TYPE DESIGNATION (HOW TO ORDER)

NPR1

Abstract: NPR1 0.1
Contextual Info: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW METAL PLATE POWER CHIP NPR STRUCTURE 1 Resistive element* 2 Mold resin LCP UL: 94 V-O 3 Termination, solder plating on copper plate 4 Joining / Welding POWER TYPE RESISTORS * For values smaller 68 mΩ * a metal plate is used

470 uH inductors

Abstract: 18 uh 8.2 uH phone 6r8 COIL 220 uh inductors 56 UH COIL
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW FERRITE CORE POWER CHOKE COIL SDR IDENTIFICATION MARKING Products with Pb-free terminations meet RoHS requirements Black, 3 digits and marking dot Large permissible DC current and low DC resistance Small surface area allows high mounting density

2134A

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW ZERO OHM JUMPER RK73Z RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination