IPC4101 Search Results

JESD22-B102-D

Contextual Info: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

IPC-4101

Contextual Info: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

60WX2

Abstract: ultravolt AA
Contextual Info: TABLE OF CONTENTS SINGLE OUTPUT HIGH VOLTAGE POWER SUPPLIES STANDARD AA Series Reduced-size product line with enhanced features . . . . . . . . . . . . . . . . . . . . . . . . . .4 High-voltage bias from 0 to 62V through 0 to 6kV @ 0 to 4W, 20W & 30W A Series

FCLGA1366

Abstract: L5518 computer processor spec 45NM60 at80602002
Contextual Info: Intel Xeon® Processor L5518 8M Cache, 2.13 GHz, 5.86 GT/s Intel® QPI with SPEC Code(s) SLBFW Compare Queue (0) Send Feedback Home Intel® Processors Intel® Xeon® Processor Intel® Xeon® Processor 5500 Series ● Products ● Technology ● Communities●

CS82TPCF

Abstract: PBGA376 EG20T SLJ42 CS82TPCF SLH7G
Contextual Info: Intel EG20T PCH Menu Language: Communities Find Content What Search English English Product Specs Intel® EG20T PCH Compare Queue 0 Intel® EG20T PCH Add to Compare Additional Information Quick Links Embedded Products formerly Topcliff Download Datasheet

SAC266

Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Contextual Info: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.

FWE6300ESB

Abstract: NHE6300ESB Model 8812 TAG 8837 PMB 8815 E7210 300641-004US ich428 audio power sb 18751 FWE6300
Contextual Info: Intel 6300ESB I/O Controller Hub  November 2007 Notice: The Intel® 6300ESB I/O Controller Hub may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on

BGA1288

Abstract: rPGA-988 circuit diagram laptop motherboard CN80617005745AB arrandale cn80617 i3 laptop MOTHERBOARD pcb CIRCUIT diagram i7-600 Mobile INTEL nehalem CPU arrandale MSR
Contextual Info: Intel Core i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series Datasheet — Volume One This is volume 1 of 2. Refer to document 322813 for Volume 2 January 2010 Document Number: 322812-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

W950

Abstract: W9513 W9502 W9522 W9521 W9506
Contextual Info: WINSLOW ADAPTICs Data Sheet – SOP to DIP Generic Adapters These adapters allow the prototyping of SOIC, SOJ, SSOP, TSOP and TSSOP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

Contextual Info: Series 350000-11-RC RoHS/WEEE-Compliant SOIC-to-DIP Adapter FEATURES • A cost-effective means of upgrading to SOIC without changing your PCB layout • Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16] or 0.600 [15.24] centers

IPC-ET-652

Abstract: IPC-6012 AMP-174218-2 dnp 011 IPC-SM-840 IPC-D-356 AMP174218-2 IPC 6012 H1188 EVB8700
Contextual Info: EVB8700 User Manual Copyright 2007 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed

Contextual Info: CP02M581.01 Rev D – Page 1 of 3 Product Family: Chip Power Resistor Part Number Series: CPA2512*####FS Construction: • High Purity Alumina ceramic  Nickel alloy thin-film resistive element  Epoxy-resin overcoat  Pre-tinned Sn100, matte terminations over

SAE AMS-QQ-N-290

Abstract: AMS-QQ-N-290 FR406 IPC4101A/26 ASTM b16 ASTM B194 C17200 IS410 ASTM-B16-00 C36000
Contextual Info: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.

Pentium E5400

Abstract: E5400 motherboard diagram circuit diagram motherboard ms 6323 Intel Pentium E5400 6321ESB X5492 E5400 intel LGA 1150 PIN diagram TMDG LGA 1155 Chipset 216
Contextual Info: Quad-Core Intel Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

945G MOTHERBOARD CIRCUIT diagram

Abstract: Asus PC MOTHERBOARD CIRCUIT MANUAL ASUS P5 MOTHERBOARD CIRCUIT diagram asus f3 intel pentium d 805 Asus P5 Asus MOTHERBOARD CIRCUIT Asus PC MOTHERBOARD CIRCUIT MANUAL a4 82801GB circuit asus MOTHERBOARD pcb CIRCUIT diagram
Contextual Info: Intel Pentium® D Processor 800Δ Sequence Datasheet – On 90 nm Process in the 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ February 2006 Document Number: 307506-003 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

82801IUX

Abstract: i524 intel Penryn micro-FCPGA BFR 965 pinout 82801i
Contextual Info: Intel Celeron® Processor 500Δ Series Datasheet For Platforms Based on Mobile Intel® 965 Express Chipset Family January 2008 Revision 003 Document Number: 317665-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELÆ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

LE80536VC001512

Abstract: MPGA479 ITP700
Contextual Info: Intel Celeron® M Processor Datasheet June 2004 Order Number: 300302-003 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

X5492

Abstract: E5400 motherboard diagram Pentium E5400 Platform Environment Control Interface Specification intel LGA 1150 PIN diagram LGA 1150 intel X5482 pinless p4 processor E5400 Intel Pentium E5400
Contextual Info: Quad-Core Intel Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: Intel Core 2 Extreme Processor QX9775Δ Specification Update — on 45 nm Process in the 771-land LGA Package June 2008 Notice: The Intel® Core™2 Extreme processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current

LE80536

Abstract: RJ80536 SL8MM 249410 INTEL-CELERON le80538 ich7 82801FBM if k16 160v 170 RH80536
Contextual Info: R Mobile Intel Celeron® Processor 0.18µ in BGA2 and Micro-PGA2 Packages at 900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz, Low-voltage 600 MHz, Low-voltage 500 MHz, Low-voltage 400A MHz, and Ultra Low-voltage 600 MHz, Ultra Low-voltage 500 MHz

IPC-4101

Abstract: 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101
Contextual Info: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

ISO STANDARDS SHEET METAL THINNING

Abstract: MIL-STD-883H Ultrasonic Cleaning Transducer IPC-4101-92 MIL-T-27730 SEM 2006 IPC-4101-95 AL wire bond spool color code ultrasonic transducer 150 khz ultrasonic proximity detector report file
Contextual Info: MIL-STD-883H * METHOD 2018.5 SCANNING ELECTRON MICROSCOPE SEM INSPECTIONS 1. PURPOSE. This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice. SEM inspection is not required on planar oxide interconnect

POWER33

Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
Contextual Info: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related

Contextual Info: Part No. 1109283 Universal PLCC ZIF Test Socket to .100 x .100 PGA Adapter Features: • 84 pin adapter for mounting Aries’ Series 537 Universal PLCC ZIF zero insertion force Sockets with interstitial footprint to .100 x .100 [2.54 x 2.54] PCB layout. Consult Data Sheet Nos. 10008