IDTMP4008S Search Results

MA15

Abstract: FAST MOTOROLA
Contextual Info: SECTION 4 EXTERNAL MEMORY INTERFACE MOTOROLA PRELIMINARY 4-1 SECTION CONTENTS Paragraph Number Section Page Number 4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.2 EMI PROGRAMMING MODEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4

MCM60256

Abstract: MDM6 DSP56009 MA10 MA15 MCM514400
Contextual Info: Freescale Semiconductor, Inc. SECTION 4 Freescale Semiconductor, Inc. EXTERNAL MEMORY INTERFACE MOTOROLA DSP56009 User’s Manual For More Information On This Product, Go to: www.freescale.com 4-1 Freescale Semiconductor, Inc. External Memory Interface INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

philips brc 410

Abstract: DSP56000 DSP56002 DSP56004 DSP56005 DSP56007 DSP56009 audio reverb
Contextual Info: DSP56009 24-Bit Digital Signal Processor User’s Manual Motorola, Incorporated Semiconductor Products Sector DSP Division 6501 William Cannon Drive West Austin, TX 78735-8598 This document and other documents can be viewed on the World Wide Web at http://www.motorola-dsp.com.

s46 hall

Abstract: AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206
Contextual Info: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA Where: NOTE: Table 8 (page 17) contains the package thermal

A798

Abstract: transistor A798 philips brc 410 LOG TX2 1326 transistor A798 FREE DATA SHEET AL242 AL260 AL260 B11D3 Edd 44 SD 4278
Contextual Info: OVERVIEW 1 SIGNAL DESCRIPTIONS 2 MEMORY, OPERATING MODES, AND INTERRUPTS 3 EXTERNAL MEMORY INTERFACE 4 SERIAL HOST INTERFACE 5 SERIAL AUDIO INTERFACE 6 GENERAL PURPOSE I/O 7 BOOTSTRAP CODE CONTENTS A PROGRAMMING REFERENCE B APPLICATION EXAMPLES C INDEX I 1

Contextual Info: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation and setup. User-derived values for therm al resis­ tance m ay differ. The average chip junction tem perature, Tj, in C, can be obtained from: NOTE: Table 8 page 17 contains the package thermal

delay reverb

Abstract: philips brc 410 echo delay reverb DSP56007
Contextual Info: DSP56007 24-Bit Digital Signal Processor User’s Manual Motorola, Incorporated Semiconductor Products Sector Wireless Division 6501 William Cannon Drive West Austin, TX 78735-8598 TABLE OF CONTENTS SECTION 1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

MA10

Abstract: MA15 MCM514400 eam1
Contextual Info: SECTION 3 EXTERNAL MEMORY INTERFACE MOTOROLA EXTERNAL MEMORY INTERFACE 3-1 SECTION CONTENTS 3.1 3.2 3.2.1 3.2.2 3.2.3 3.2.4 3.2.5 3.3 3.3.1 3.3.2 3.3.3 3.4 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.6 3.7 3.8 3.8.1 3.8.2 3.8.3 3-2 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MCM54400A-60

Abstract: reverb Processor IC DSP56007 mcm54400
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. DSP56007 24-Bit Digital Signal Processor User’s Manual Motorola, Incorporated Semiconductor Products Sector Wireless Division 6501 William Cannon Drive West Austin, TX 78735-8598 For More Information On This Product,

I2S* sony

Abstract: MCM60256 00FF DSP56009 mcm60256a
Contextual Info: SECTION 4 DESIGN CONSIDERATIONS HEAT DISSIPATION An estimate of the chip junction temperature, TJ, in °C can be obtained from: TJ = TA + PD x RΘJA (1) in which: TA = ambient temperature, °C RΘJA=package thermal resistance, junction-to-ambient, °C/W

MCM6206-35

Abstract: delay reverb MA16 operations service manual 5.1 home theatre circuit diagram dsp based DSP56001 users manual free home theater circuit diagram IC SP home theater circuit diagram 7.2 Channels, 100 W simple subwoofer circuit diagram DSP56000 DSP56002
Contextual Info: OVERVIEW 1 SIGNAL DESCRIPTIONS 2 MEMORY, OPERATING MODES, AND INTERRUPTS 3 EXTERNAL MEMORY INTERFACE 4 SERIAL HOST INTERFACE 5 SERIAL AUDIO INTERFACE 6 GENERAL PURPOSE I/O 7 BOOTSTRAP CODE CONTENTS A PROGRAMMING REFERENCE B APPLICATION EXAMPLES C INDEX I 1

a798

Abstract: 65F6 a92b B11D3 Edd 44 reverb Processor IC DSP56004 DSP56004ROM DSP56011
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. OVERVIEW 1 SIGNAL DESCRIPTIONS 2 MEMORY, OPERATING MODES, AND INTERRUPTS 3 EXTERNAL MEMORY INTERFACE 4 SERIAL HOST INTERFACE 5 SERIAL AUDIO INTERFACE 6 GENERAL PURPOSE I/O 7 BOOTSTRAP CODE CONTENTS

MCM60256

Abstract: DSP56004 MA10 MA15 MCM514400
Contextual Info: Freescale Semiconductor, Inc. SECTION 4 Freescale Semiconductor, Inc. EXTERNAL MEMORY INTERFACE MOTOROLA DSP56004 User’s Manual For More Information On This Product, Go to: www.freescale.com 4-1 Freescale Semiconductor, Inc. External Memory Interface INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

BTS 7246

Contextual Info: Order this document by DSP56004/D Rev. 2 MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56004 DSP56007 Symphony Audio DSP Family 24-Bit Digital Signal Processors The Symphony™ family of high-performance, programmable Digital Signal Processors DSPs is suitable for a variety of digital audio functions, including Dolby Pro Logic, ATRAC, and Lucasfilm