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LA SMD

Abstract: SMD-K17 CHARGEUR thermique
Contextual Info: SMD-Kühlkörper SMD heatsinks Dissipateurs CMS 8 25,6 ICK SMD K 10 … 10 23,4 ICK SMD K 13 … 13 21,5 ICK SMD K 17 … 17 19,4 ICK SMD K 19 … 19 18 ICK SMD K 21 … 21 16,5 ICK SMD M 8 … 8 72 ICK SMD M 10 … 10 66 ICK SMD M 17 … 17 40 ICK SMD M 19 …

Heatsinks

Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Contextual Info: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK

Heatsinks

Contextual Info: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 35 x 35 WLF . 35 x 35 art. no. C D ICK BGA 35 x 35 x 10 WLF . 35 x 35 art. no. E F ICK BGA 40 x 40 WLF . 40 x 40 art. no. G ICK BGA 40 x 40 x 10 WLF . 40 x 40 art. no. H I ICK BGA 42,5 x 45

Sepa MFB 40 D 12

Abstract: intel 80486 ic 4570 Sepa MFB 40 D 05 SEPA MFB LA 4570 SEPA Sepa MFB 50 FAN 3792 pentium 200 mmx
Contextual Info: Hola1 H A H Active heatsinks for processors B C art. no. LA LA LA LA D ICK ICK ICK ICK 15 17 18 21 x x x x 15 17 18 21 please indicate: E Rth [K/W] suitable for processor type 2.3 1.6 1.5 1.4 universal universal universal universal . . . . A 37.92

Sepa MFB 40 D 12

Abstract: SEPA MFB Sepa MFB 40 D 05 Sepa MFB 40 C 12 Sepa MFB 50 mfb 50 A-12 SEPA Pentium MMX intel pentium pro MMX intel
Contextual Info: Dissipateurs ventilés pour Fan Heatsinks for Intel ® Pentium PRO and MMX Intel® Pentium® PRO et MMX B Lüfterkühler für Intel® Pentium® PRO und MMX LA ICK PEN 50 LA ICK PEN 45 LA ICK PRO 25 C D B LA ICK PEN 38 A – einfache Montage auf ZIF Sockel durch

Heatsinks

Abstract: ICK 40 1416L
Contextual Info: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 14 16 L ICK 20 L ICK 6 8 L D Rth [K/W] for housings 46 34 83 14/16 contacts 20 contacts 6/8 contacts Rth [K/W] for housings 50.0 13.0 11.5 9.5 8.5 – 14/16 contacts 24 contacts

Heatsinks

Abstract: BGA16
Contextual Info: Dissipateurs pour BGA 6 RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W] 35 35 1,8 ICK BGA 35 x 35

WLFT 404

Contextual Info: Hola1 H A H Heatsinks for BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10

Contextual Info: Dissipateurs pour BGA RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 6 Kühlkörper für BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W]

6205 tube

Abstract: 6205 subminiature sylvania 6205 tube 6205 BALLANTINE pentode 6205 Sylvan 5840 Sylvania 5840 400C 5840 TUBE
Contextual Info: SYLVANIAfirap engineering data service QU ICK R E F E R E N C E DATA MECHANICAL DATA B u l b . • T-3 B a s e . E8-10, Subminiature Button Flexible Leads

Contextual Info: ER2A THRU ER2J SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 - 600 Volts CURRENT - 2 .0 Amperes _ FEATURES_ • For surface m ounted applications SMB/DO-214AA • Low profile package • Built-in strain relief • Easy p ick and place

FMMD6050

Abstract: E2 marking diode Diode Marking z3 SOT-23 BAR99 diode marking x6 Z6 DIODE BAL99 BAS16 SOT diode marking Z3 BAV74
Contextual Info: FERRANTI semiconductors BAL99 High Speed S w itching Diode DESCRIPTION These devices are intended fo r high speed switching applications. Encapsulated in th e popular SOT-23 package these devices are designed specifically fo r use in thin and th ick film

Heatsinks

Contextual Info: Kühlkörper für BGA’s Dissipateurs pour BGA – convient particulièrement pour les Ball Grid Arrays – dimensions du dissipateur correspondent au type de BGA respectif – à coller directement sur le composant BGA RW 35 [K/W] 30 10 10 25 1,8 ICK BGA 10 x 10

Diode Marking z3 SOT-23

Abstract: BAR99 FMMD6050 diode marking x6 Z6 DIODE BAL99 BAS16 BAV70 BAV74 BAV99
Contextual Info: * FERRANTI semiconductors BAR99 High Speed Sw itching Diode DESCRIPTION These devices are intended fo r high speed switching applications. Encapsulated in th e popular SOT-23 package these devices are designed specifically fo r use in thin and th ick film

BSR40

Abstract: BSR41 BSR42 BSR43 SOT89 MARKING CODE 43
Contextual Info: m ^ 53*131 00255^5 77b *APX N AMER PHILIPS/DISCRETE b?E T> BSR40 to 43 _ V _ SILICON PLANAR EPITAXIAL TRANSISTORS N-P-N transistors in m iniature plastic envelopes intended fo r application in th ick and th in -film circuits.

Crystal oscillator 12 MHz

Abstract: CY2037 CY2037WAF
Contextual Info: fax id: 3554 Kr PRELIMINARY CY2037 Ei1i3 i3 High Accuracy EPROM Programmable PLL Die for Crystal Oscillators Features B enefits E P R O M -program m able die for in-package program m ing of crystal oscillators Enables qu ick tu rn a ro u n d o f custom oscillators

Contextual Info: PLASTIC FILM CAPACITORS n ick ico n D ielectric O u tlin e Rated O perating Voltage and Tem perature Capacitance R ange Range Metallized XJ Polyester Standard Type Film Metallized XN Polyester Film For High Frequency & Large current Applications Dip Type Standard Type

Contextual Info: ADVANCED INTERCONNECTIONS Molded Standoff for LIF PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401 -823-5200 • FAX 401-823-8723 Molded Standoff for LIF PGA Sockets Standard Sockets SOS or SIS - Standard Molded Standoff Sockets

amplificateur BF

Abstract: BTL6
Contextual Info: W assergekühlte Sendetriode W ater-Cooled Transm itting Triode Triode à refroidissem ent par eau Hauptdaten Q u ick Reference D ata Caractéristiques principales Pa max V a max la max *Po max f max 10 11 4,5 35 100 kW kV A kW MHz "K lasse C, HF, unm oduliert

AL6063T5

Contextual Info: _R REV in ALTERATION DATE 12.05.2006 M.19.2007 36.13.2007 NEWRELEASE CHANGED HEAT SINK DIMENSION Changed the mork on clip CHECKED Nicole Nicole Kenoi B B Chip S e t T h ick n e ss / UUUUUUUUUUUUUUUUUUUUUÜUUUUUUUUUUUU -BGA CHIP SET SEE NOTES 1 NOTES: 1:

STK 3 channel amp

Abstract: TRANSISTOR a32 STK 050 amplifier stk ic 5.1 channel amplifier STK hybrid amplifier stk 415 120 STK 100W AUDIO AMPLIFIER
Contextual Info: Ordering number : EN4344A Th ick Film Hybrid 1C STK401 -090 AF Power Amplifier Split Power Supply (50W + 50W min, THD = 0.4%) Overview Package Dimensions Now, thick-film audio power amplifier ICs are available with pin-com patibility to p erm it a single PCB to be

AL6063T5

Contextual Info: in _R REV ALTERATION NEWRELEASE Changed the mark on clip DATE CHECKED 12.05.2006 Nicole 36.13.2007 Kenoi B B Chip S e t T h ick n e ss / UUUUUUUUUUUUUUUUUUUUUÜUUUUUUUUUUUU -BGA CHIP SET SEE NOTES 1 16672222 NOTES: 1: A D CCUpSatlUckM) Clip-Color 2.1mm~2.fimm

BCW29R

Abstract: BCW30R SOT213 BCV72 BCW29 BCW30 BFQ31 BFQ31A ferranti SOT MARKING 213
Contextual Info: FERRANTI semiconductors BCW29 BCW30 PNP S ilicon Planar Small Signal Transistors DESCRIPTION These devices are intended fo r use in low level, general purpose applications. Encapsulated in the popular SOT-23 package these devices are designed sp e cifica lly fo r use in thin and th ick film

Contextual Info: ADVANCED INTERCONNECTIONS Tape Sealed PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401-8 2 3 -5 20 0 • FAX 401-823-8723 Tape Sealed PGA Sockets Features: Terminal Information • Removable tape seal protects plated contact in harsh environments.