IC U11 Search Results

ic u11

Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work

U20 diode sm

Abstract: C181-C187 C69 diode sm RMC 0805 1.2M C159C Motorola R97 P13B3125Q PTC111 IC 93c46 bcr beckman resistor
Contextual Info: 0700F _BoM Location QTY Part Descripition U21 IC/SM 74LVC04AD SOIC14 3.3V 1 U4 IC/SM 74LVC08 3.3V TSSOP-14 2 U22 IC/SM 74LVC14 3.3V TSSOP-14 1 U7,U8 IC/SM 74LVTH273 TSSOP-20 3.3V 2 U14,U15 IC/SM 74LVC573 SOIC20 No Bus H 2 U3 IC/SM 74C32 TSSOP-14 1 U27 IC/SM 3.3V Quad Switch(QSOP16)

D03316P-103

Abstract: 4.7kohm resistor 88638-61102 DRFC16H st lm385 bcr beckman resistor R36-R38 74C32 Framatome 74c32 datasheet
Contextual Info: 0700D _BoM Location Part Descripition QTY U21 IC/SM 74LVC04AD SOIC14 3.3V 1 U4,U26 IC/SM 74LVC08 3.3V TSSOP-14 2 U22 IC/SM 74LVC14 3.3V TSSOP-14 1 U7,U8 IC/SM 74LVTH273 TSSOP-20 3.3V 2 U14,U15 IC/SM 74LVC573 SOIC20 No Bus H 2 U3 IC/SM 74C32 TSSOP-14 1 Q3,Q6,Q7

Lithium-Ion Battery Charger 23-6

Abstract: BATTERY PROTECTION IC 12v battery overcharge protection circuit diagram Lithium-Ion Battery Charger sot 23-6 2 cell one cell battery protection ic diagram DORMANCY Lithium-Ion Battery Charger sot 23 jd sot23 C2001 marking r2 SOT23-6 MOSFET
Contextual Info: ૹ߅࢟വ! IC One Cell Lithium-ion/Polymer Battery Protection IC ࡝ஂᶲಭᔇ0௡੝ᇕᶲ࢟ߔۣઐ JD DESCRIPTION & FEATURES FHI01 概述及特點 The FHI01 series battery protection IC is designed to protect lithium-ion/polymer battery from damage or

l5109

Abstract: IR3500 IR3500MPBF IR3500MTRPBF IR3505 VR11 VRD11 rectifier circuit board ESR 48 td301
Contextual Info: IR3500 DATA SHEET XPHASE3TM VR11.0 & AMD PVID CONTROL IC DESCRIPTION TM The IR3500 Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system

Contextual Info: IR3500A DATA SHEET XPHASE3TM VR11.0 & AMD PVID CONTROL IC DESCRIPTION TM The IR3500A Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system

11n800

Abstract: thyrister speed control of 3 ph I M equivalent transistor bc 649 2d npn smd thermistor ntc 50k
Contextual Info: IR3500A DATA SHEET XPHASE3TM VR11.0 & AMD PVID CONTROL IC DESCRIPTION TM The IR3500A Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system

EL 14v 4c

Abstract: IR3500 IR3505 VR11 VRD11 thyrister SCR PIN Bf b9 L5109
Contextual Info: IR3500A DATA SHEET XPHASE3TM VR11.0 & AMD PVID CONTROL IC DESCRIPTION TM The IR3500A Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system

TD5 THERMISTOR

Abstract: l5109 IR3500 IR3500MPBF IR3500MTRPBF IR3505 VR11 VRD11 thyrister SCR PIN 12v 5a dc dc boost converter
Contextual Info: IR3500 DATA SHEET XPHASE3TM VR11.0 & AMD PVID CONTROL IC DESCRIPTION TM The IR3500 Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system

SW-DIP-8

Abstract: SW-DIP-2 IC 7407 mach210-20jc SW-DIP2 MCU17 U15C 13la6 LM317T HDR103
Contextual Info: NOTES, M68EML05P6A EMULATION MODULE UNLESS OTHERWISE SPECIFIED 1. VCC PIN LOCATIONS : VCC IS APPLIED TO PIN 8 OF ALL 8-PIN IC’s, PIN 14 OF ALL 14-PIN IC’s, PIN 16 OF ALL 16-PIN IC’s, PIN 20 OF ALL 20-PIN IC’s, ETC. 2. GROUND PIN LOCATIONS : GROUND IS APPLIED TO PIN 4 OF ALL 8-PIN IC’s,

ibis format

Abstract: IBIS wafer map format ic u11 MF-0
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Bumped Wafer Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors March 2003 Philips Semiconductors Product Specification Rev. 3.0 March 2003

ic u11

Abstract: uv-tape HP4258 ibis format IBIS wafer map format MIFARE Card IC Coil Design Guide philips 22c la 4620 ic
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004

ESK107MA-AE-10

Abstract: TK14583V op amp FM 120 MHZ
Contextual Info: POWER&RF ࢟Ꮞ਌ಯ&࿴ຫ Wide band bipolar FM IF IC for RKE/TPMS RKE/TPMS፿౑ຫࡒၷ૵ቯFM IF IC TK14583V (TSSOP-24) DESCRIPTION / ႁී TK14583V型ဵጙ౒FM IF ICLjᆐဣሚ঱ႥᄰቧऎఎखLj۞౪ ጙৈ૘ຫ໭DŽᔢ঱500MHzDžਜ਼IFDŽᔢ঱12MHzDžă

IR502

Contextual Info: IR3502 DATA SHEET XPHASE3TM CONTROL IC DESCRIPTION TM The IR3502 control IC combined with an XPHASE3 Phase IC provides a full featured and flexible way to implement a complete VR11.0 and VR11.1 power solution. The IR3502 provides overall system control TM

Contextual Info: IR3504 DATA SHEET XPHASE3TM AMD SVID CONTROL IC DESCRIPTION TM The IR3504 Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete AMD SVID power solution. It provides outputs for both the VDD core and VDDNB

CCP21

Abstract: ir3504
Contextual Info: IR3504 DATA SHEET XPHASE3TM AMD SVID CONTROL IC DESCRIPTION TM The IR3504 Control IC combined with an xPHASE3 Phase IC provides a full featured and flexible way to implement a complete AMD SVID power solution. It provides outputs for both the VDD core and VDDNB

M9-1-103J

Abstract: TLR124 tlg124a CXA3504 tlg124 Diode TLG124 tl7705C TL7705CP SONY 171 TLY124
Contextual Info: CXD4017R Reception Digital Signal Processor IC for Infrared Spatial Digital Audio Communication Description The CXD4017R is an IC that processes the received digital signals used for infrared spatial digital audio communication based on the IEC61603-8-1 standard in consumer products. This IC contains the

IC 651

Abstract: contactless Functional Specification EN753-2 nxp proximity antenna design 7816-6 AMD1 NXP antenna design guide
Contextual Info: MF0 IC U1 Functional specification contactless single-trip ticket IC Rev. 3.2 — 3 April 2007 Product data sheet 028632 PUBLIC 1. General description NXP has developed the mifare MF0 IC U1 to be used with Proximity Coupling Devices PCD according to ISO/IEC14443A. The communication layer (mifare RF Interface)

IR502

Contextual Info: IR3502 DATA SHEET XPHASE3TM CONTROL IC DESCRIPTION The IR3502 control IC combined with an XPHASE3TM Phase IC provides a full featured and flexible way to implement a complete VR11.0 and VR11.1 power solution. The IR3502 provides overall system control and interfaces with any number of Phase ICs, each driving and monitoring a single phase. The XPhase3TM

microprocessor 8051

Abstract: SAA7158 eco3 PLCC68 SAA4951 SAA7158WP TMS4C2970 PHASE SEQUENCE DETECTION WITH THREE PHASE CONTROLLED POWER SUPPLY
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA7158 Back END IC Preliminary specification File under Integrated Circuits, IC02 July 1994 Philips Semiconductors Preliminary specification Back END IC SAA7158 FEATURES • Line Flicker Reduction LFR by means of MEDIAN filtering

SONY APS 172 power supply

Abstract: D25VB SONY APS 186 power supply
Contextual Info: Transmission Digital Signal Processor IC for Infrared Spatial Digital Audio Communication CXD4016R Description The CXD4016R is an IC that processes the transmitted digital signals used for infrared spatial digital audio communication based on the IEC61603-8-1 standard in consumer products. This IC contains the digital-toanalog converter (DAC) and a PLL circuit for RF signal. RF signal is processed by digital signal processing, so

M9-1-103J

Abstract: TLR124 IL-2P-S3EN2 SONY APS 240 power supply tlg124 SONY APS 172 power supply APS 240 Sony 1s1588 tlg124a Kyocera Kinseki CRYSTAL CX
Contextual Info: Transmission Digital Signal Processor IC for Infrared Spatial Digital Audio Communication CXD4016R Description The CXD4016R is an IC that processes the transmitted digital signals used for infrared spatial digital audio communication based on the IEC61603-8-1 standard in consumer products. This IC contains the digital-toanalog converter (DAC) and a PLL circuit for RF signal. RF signal is processed by digital signal processing, so

MB87F

Abstract: MetaWare ARC SOP50 PIN MB87L2250 MB87F2250 MB87L2250 MB377 nokia c9 SFH-506 SAA7121
Contextual Info: Multimedia IC’s MB87L2250 SingleChip MPEG-Decoder Evaluation Board Final SCART Version Hardware and Software Installation  Fujitsu Mikroelektronik GmbH Edition 0.3, Last Modified on 09.12.1999, by Edmund Bendels MB87L2250-E/B 1 December 1999 Multimedia IC’s

sx3704

Abstract: AP239 Transistor 80139 8C547 6C131C IN2222A 2N50B 2N2064 radio AC176 AC126 sft353
Contextual Info: INTERNATIONAL TRANSISTOR EQUIVALENTS GUIDE A LSO BY THE S A M E AUTHOR BP108 International Diode Equivalents Guide BP140 Digital IC Equivalents and Pin Connections BP141 Linear IC Equivalents and Pin Connections ALSO OF INTEREST BP234 Transistor Selector Guide