IC MATERIAL Search Results

16V8H-15

Abstract: 20-2136J res 10k sip 16V8H-15 pc IC 4020 pulse TRANSFORMER valor res 0402 MSL-260-G-H ic 0808 data sheet 16v8h
Contextual Info: PLX Technology PCI9060 DEMO List of Materials 06/16/96 Description Qty Vendor Vendor Part Reference Designator PCB,PCI9060 DEMO,Rev A IC,PCI9060,PQFP IC,80960CA,33 MHz,PQFP IC,82596CA,33 MHz,PFQP IC,82C503,PLCC IC,16550A,PLCC IC,Static Ram, 32Kx8, 15 nsec, 28 Pin 300 Mil SOJ

OBGA

Contextual Info: iC-LSB, iC-LSC oBGA LS2C PHOTOSENSOR PACKAGE SPECIFICATION Rev B1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-LSB oBGA LS2C glass lid iC-LSB oBGA LS2C iC-LSB oBGA LS2C reticle iC-LSB oBGA LS2C-LSxR iC-LSC oBGA LS2C glass lid iC-LSC oBGA LS2C

Power IC

Abstract: PB-102
Contextual Info: 6.7 Unit : mm 23.6 Length : 550±2.0 Thickness : 0.5 +2.0 −2.0 Tolerance : ±0.4 Material : Plastic with antistatic finish PB-102 Applied Package Quantity(pcs) 7 pin SIP (power IC) 25 8 pin SIP (power IC) 25 9 pin SIP (power IC) 20 10 pin SIP (S) (power IC)

transistor current booster circuit

Abstract: pin configuration transistor BD139 SCHEMATIC mda monitor power booster circuit diagram WK4D RLD-65NE iC-WKN current booster schematic BD139 PIN DIAGRAM SCHEMATIC mda
Contextual Info: iC-WK DEMO WK4D DEMO BOARD DESCRIPTION Rev A1, Page 1/3 ORDERING INFORMATION Type Order Designation Description/Options iC-WK Demo iC-WKL Demo iC-WKN Demo WK4D DEMO WKL4D DEMO WKN4D DEMO Evaluation boards for iC-WK, iC-WKL and iC-WKN; easy to set up for the booster circuit

ic type diagram

Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
Contextual Info: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION

optical rotary encoder

Abstract: Linear Rotary Encoder IHI magnetic linear ENCODER IC Magnetic Rotary Encoder iC-Haus Rotary Encoder switch A1 hall sensor iC-SM2L Optical encoder Sensor
Contextual Info: iC-MN AN5 APPLICATION CIRCUIT EXAMPLES Rev A2, Page 1/6 OPTICAL ROTARY ENCODER Disc iC-PNxxxx iC-MN Figure 1: Application circuit of iC-MN with iC-PNxxxx for optical rotary encoder featuring 3-channel nonius interpolation. Copyright 2010 iC-Haus http://www.ichaus.com

DIAGRAM OF RJ45 to female usb

Abstract: iC-MB3 Power Distribution Board with line diagram RJ45-OUT iC-NQ DIAGRAM OF RJ45 to male usb
Contextual Info: iC-NQ EVAL NQ5D EVALUATION BOARD DESCRIPTION Rev A1, Page 1/3 ORDERING INFORMATION Type Order Designation Description iC-NQ, iC-MA EVAL NQ5D Evaluation Board ready-to-operate, equipped with iC-NQ and iC-MA angle sensor iC-NQ GUI Software Evaluation Board Software

OF2RZ

Contextual Info: iC-OF BLCC OF3C PACKAGE SPECIFICATION Rev C2, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF BLCC OF3C none iC-OF BLCC OF3C iC-OF BLCC OF3C reticle iC-OF BLCC OF3C OF2RZ iC-OF BLCC OF3C-ET iC-OF BLCC OF3C-ET reticle Code Disc 1024 PPR, 18 mm

"PNP Transistor"

Abstract: NPN PNP sot-563 npn-pnp-transistors transistor equivalent table ic marking z7 sot-563 Z7 TRANSISTOR sot-563 marking Z1 sot Marking z7 smd transistor 560
Contextual Info: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS IC MATERIAL USED CARRIES UL 94V-0 TYPE Marking Collector to Emitter Voltage Collector DC Current Gain Current VCEO IC V mA Saturation Voltage Collector to Emitter HFE @ VCE / IC VCE SAT @ IC / IB Typical

TSOP 32 thermal resistance

Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance
Contextual Info: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION

iC-MB4

Abstract: smd diode IF usb lpt IC-MB4 ICSY MB4U 478M05 iC-MB3 ic-nqc IC-NQCEVALNQ6D IC 7805 description SMD 78m05
Contextual Info: iC-NQ, iC-NQC EVAL NQ6D EVALUATION BOARD DESCRIPTION Rev A3, Page 1/10 ORDERING INFORMATION Type Order Designation Description Options Evaluation Board iC-NQ EVAL NQ6D iC-NQC EVAL NQ6D iC-NQ Evaluation Board iC-NQC Evaluation Board ready to operate, accessible through GUI via PC adapter

7805 smd

Abstract: Datasheet of ic 7805 SMD 78m05 IC 7805 pin diagram SMD Transistor A data sheet working principle of IC 7805 IC U4 7805 pin diagram labview 65LBC179 IC 7805 description
Contextual Info: iC-NQ, iC-NQC EVAL NQ6D EVALUATION BOARD DESCRIPTION Rev A2, Page 1/9 ORDERING INFORMATION Type Order Designation Description Options Evaluation Board iC-NQ EVAL NQ6D iC-NQC EVAL NQ6D iC-NQ Evaluation Board iC-NQC Evaluation Board ready to operate, accessible through GUI via PC adapter

Contextual Info: Amphenol IC Socket Interconnects G820 DIP IC Socket PCB Mount Screw Machine Type Low profile 2.54mm Pitch DIP IC Socket with screw-machine contacts. Materials Durability Housing Contacts – 94V-0 thermoplastic – P/B with 50µ” Ni Electrical Current Voltage

SM 933

Contextual Info: M U LTILA Y E R CERAM IC CHIP CAPACITORS • INTRODUCTION The Multilayer Ceram ic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceram ic ic materials and firing into a concrete monolithic body, then com pleted by

788712-1

Abstract: tyco usb
Contextual Info: 16.00 FRONT EDGE OF CONNECTOR 9.58 9.00 NOTE: 1. MATERIAL: HOUSING: THERMOPLASTIC HIGH TEMPERATURE, UL 9 4 V —0, COLOR: BLACK. CONTACT: PHOSPHOR BRONZE, TH IC KN ESS=0.25m m . SHELL: PHOSPHOR BRONZE, TH IC KN ESS=0.30m m . REAR SHELL: STAINLESS, TH IC KN ESS=0.30m m .

X118

Abstract: S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC bumped sawn wafer on UV-tape addendum Rev. 3.1 — 4 April 2007 Product data sheet 101831 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 IC S 70 MIFARE s70 chip X118 AN MIFARE Card Coil Design Guide 101730 S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader

OBGA

Abstract: iC-Haus OF4C analog devices bottom mark
Contextual Info: iC-OF oBGA OF4C PACKAGE SPECIFICATION Rev C1, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF optoBGATM OF4C none leaded balls built-in reticle iC-OF oBGA OF4C iC-OF oBGA OF4C-1 iC-OF oBGA OF4C-OF2RY optoBGATM OF4C 5.4 mm x 4.2 mm

Contextual Info: Linear Charger for 1Cell Li-ion Battery with System-path IC MM3538AL Linear Charger for 1Cell Li-ion Battery with System-path IC Monolithic IC MM3538AL Outline This IC is a linear charging control IC with built-in system paths, and includes a chip with system path function

diode wg

Abstract: 9958 MMA6
Contextual Info: iC-WG BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION Rev E1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-WG BLCC WGC Glass Lid iC-WG BLCC WGC-WG1L iC-WG BLCC WGC iC-WG BLCC WGC-WG1R Code Disc 13bit-Gray +2048 PPR A/B, d 44mm - reticle

ic u11

Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work

29150

Abstract: Kombi
Contextual Info: austerlitz electronic Kühlkörper für IC und Plastik-Transistoren Heat sinks for IC and plastic-transistors. Dissipateurs pour des IC et transistors plastiques. KS 12.1 Material: ALMg Si 05 Oberfläche: schwarz eloxiert Gewicht g : 1 Gehäuse: TO 220 Bestell-Nr.: KS 12.1-(Länge) E 1 x M 3

MIFARE Card IC Coil Design Guide

Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01

sanyo tv circuit diagram

Abstract: LA7846N
Contextual Info: Ordering number : ENN*5149C LA7846N Monolithic Linear IC Vertical Output IC Overview The LA7846N is a vertical deflection output IC for high-definition TV and CRT displays in systems that use a bus control system signal-processing IC. This IC can directly drive including the DC component the deflection yoke from the