I0118 Search Results
I0118 Price and Stock
Zakłady Kablowe BITNER TI0118Wire; BiTLAN; F/FTP; Cat 6a; 4x2x23AWG; Cu; wire; LSZH; orange; 100m |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TI0118 | 300 | 100 |
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Zakłady Kablowe BITNER SI0118Wire; IB-BIT 500 (St); 16x2x1mm2; shielded,Al-PET foil; PVC; blue |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SI0118 | 1 |
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I0118 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Bulletin I0118J rev. A 05/01 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C b d D A Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.01 |
Original |
i0118jsc275s1025 | |
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Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
i0118jsc275s1025sc275r015x5x+2 | |
S1025
Abstract: sc275s045 s045x5x
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Original |
i0118jsc275s1025sc275r015x5x+5 | |
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Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
i0118jsc275s1025sc275r015x5x+6 | |
sc275s045
Abstract: IRF 830 equivalent S1025
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Original |
i0118jsc275s1025sc275s045+1 | |
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Contextual Info: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
Original |
i0118jsc275s1025sc275r015x5x+1 | |
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Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
i0118jsc275s1025sc275r015x5x+6 | |
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Contextual Info: /^ T SGS-1H0MS0N ^/# lifilDWilLieTOiDtgi M48Z59 CMOS 8K x 8 ZEROPOWER SRAM • INTEGRATED ULTRA LOW POWER SRAM, POWER-FAIL CONTROL CIRCUIT and BATTERY ■ MICROPROCESSOR POWER-ON RESET V&lid all the way to V cc = Vss ■ AUTOMATIC PO\AER-FAIL CHIP DESELECTand |
OCR Scan |
m48z59m48z59y | |
ISPVM embedded
Abstract: post card schematic with ispgal Supercool TQFP-100 footprint matrix converting circuit VHDL or CPLD code low pass Filter VHDL code microcontroller using vhdl ISPVM ieee 1532 ispPAC80
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Original |
240va750khzi0117ispvm embedded+9 | |
EX-75
Abstract: trompeter TAI-123 bj249 6M225
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OCR Scan |
pl220cj220pl240cj240+9 |