HITCE Search Results

Contextual Info: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and

WED3C7410E16MC-XBHX

Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
Contextual Info: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited

7410E

Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
Contextual Info: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited

Contextual Info: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

7410

Abstract: 7410E WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola
Contextual Info: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache

Contextual Info: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache

Contextual Info: WED3C755E8MC-XBHX 755E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and

WED3C755E8MF

Abstract: 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX
Contextual Info: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

TEA 2025 equivalent

Abstract: atmel 528 24 c01 abb main switch ABB 14 11 09 Tag 225 600 replacement TMS 320 C 6X processor datasheet JESD51-2 TSPC603R atmel part marking c08
Contextual Info: Features • • • • • • • Superscalar 3 Instructions per Clock Peak Dual 16 KB Caches Selectable Bus Clock 32-bit Compatibility PowerPC Implementation On-chip Debug Support Nap, Doze and Sleep Power Saving Modes Device Offered in Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255

Contextual Info: White Electronic Designs WED3C7410E16M-400BHXX RISC Microprocessor HiTCE™ Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BHXX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is

Contextual Info: White Electronic Designs WED3C755E8M-XBHX ADVANCED* 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:

BGA PROFILING

Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

7410E

Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
Contextual Info: White Electronic Designs WED3C7410E16M-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited

HITCE

Contextual Info: HITCE Package Electrical Parameters Application Bulletin 101 Purpose This document provides Resistance, Inductance and Capacitance RLC estimates for High Thermal Coefficient of Expansion (HITCE) packages. Printed circuit board designers may use these numbers to

radix-8 FFT

Abstract: DBGA KD 472 M mov CMAC A15B2 sc sf 12A H4 17ER CI23 honeywell hx3000 HX3000
Contextual Info: DSP Architectures RHDSP24 Radiation Hardened Scalable DSP Chip Transform Your WorldTM Data Sheet Real 24 PORT A Imag 24 RHDSP24 Imag 24 24 24 X INPU TB US Y INPUT BU S O U TP U TB US 24 48 Imag 24 Scheduler/ Controller X Y Memory A 24 Memory B 24 System Controls

hirel

Abstract: tkf 912
Contextual Info: PC7410 PowerPC 7410 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • • • 22.8 SPECint95 estimated , 17SPECfp95 at 500 MHz (estimated) 917MIPS at 500 MHz Selectable Bus Clock (14 CPU Bus Dividers Up To 9x)

PC7448

Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
Contextual Info: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)

microprocessor

Abstract: G172
Contextual Info: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

PC8640

Abstract: openpic
Contextual Info: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)

pc2ad

Abstract: powerpc dhrystone
Contextual Info: PC8548E PowerQUICC III Integrated Processor Datasheet - Preliminary Specification Features • Embedded e500 Core, Initial Offerings up to 1.2 GHz • • • • • • • • • • • • • • • • • – Dual Dispatch Superscalar, 7-stage Pipeline Design with out-of-order Issue and

PC8540

Abstract: microprocessor
Contextual Info: PC8540 Integrated Processor Datasheet - Preliminary Specification Features • Embedded e500 Book E-compatible Core Available up to 833 MHz • • • • • • • • • – 32-bit, Dual-issue, Superscalar, Seven-stage Pipeline – 1850 MIPS at 800 MHz Est. Dhrystone 2.1

0828H

Contextual Info: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

pci slot pinout

Abstract: e2v GTX 120 PC8640
Contextual Info: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)