HI-3593
Abstract: HI-3717 arinc 825 QR114 QR-1140 HI-3113 HI-8593 HI-6131
Contextual Info: Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly Product Change Notice PCN1101 v1.0 December 01, 2011 Overview The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP,
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MIL-STD-1553
Abstract: HI-1575PQI
Contextual Info: HI-1575 MIL-STD-1553 3.3V Dual Transceivers with Integrated Encoder / Decoders August 2005 DESCRIPTION 30 29 D5 28 D6 27 D7 26 GND 25 D8 24 D9 23 D10 22 D11 21 - 11 12 13 14 15 16 17 18 19 20 1575PCI 1575PCT AR Y A single write cycle is used to transfer a word to the
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MIL-STD-1553
Abstract: HI-1575PQI HI-1575 HI-1575PQT 1575 STD-1553 1553 bus MIL-STD-1553 voltage Holt Applications Note AN-500 MIL-STD-1533
Contextual Info: HI-1575 MIL-STD-1553 3.3V Dual Transceivers with Integrated Encoder / Decoders DESCRIPTION 11 12 13 14 15 16 17 18 19 20 1575PCI 1575PCT 26 - D3 25 - D4 28 - D1 27 - D2 30 - CLK 40 Pin Plastic 6mm x 6mm Chip-scale package 29 - D0 Activity on both MIL-STD-1553 data buses is continuously
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hi-1575mil-std-15531575pci1575pct+1040-pin40pcshi-1575pqihi-1575pqt1575std-15531553 busmil-std-1553 voltageholt applications note an-500mil-std-1533
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arinc 825
Abstract: HI-3113 HI-1573 HI-3583A
Contextual Info: Addition of SPEL Semiconductor, India for QFN, TSSOP & SOIC Package Assembly Product Change Notice PCN1202 v1.0 January 20, 2012 Overview The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP
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PM-DB2725EX
Abstract: PM-DB2745S PM-DB2762 PM-DB2745L PM-DB2727 PM-DB2725 PM-DB2745D PM-DB2791 HI-6121 SMD code sa
Contextual Info: Miltary Selector Guide 2012_R2:Layout 1 1/12/12 5:46 PM Page 1 IC PACKAGES 6 Package Material SMD QFN-44 Plastic Y I, T, M 0.276 x 0.276 x 0.039 7.0 x 7.0 x 1.0 ESOIC-20 Plastic Y I, T, M 0.504 x 0.407 x 0.0975 (12.79 x 10.325 x 2.481) 2 3 Dimensions in inches7
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pm-db2791spm-db2795spm-db2798spm-db2762+15pm-db2766pm-db27101pm-db2702pm-db2742pm-db2742lpm-db2742spm-db2725expm-db2745spm-db2745lpm-db2727pm-db2725pm-db2745dpm-db2791hi-6121smd code sa
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nitto GE
Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
Contextual Info: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,
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40pcs44pcs64pcsge-7470l-a+13pcn0806jesd46-cqr-8033qfn-64nitto geg770hge-74sumitomo g770hge mold compoundnittohi-3582pci-10mold compound7470-la
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MIL-STD-1553
Abstract: MIL-STD-1533 HI-1575 HI-1575PQI HI-1575PQT HI-1575PCI
Contextual Info: HI-1575 MIL-STD-1553 3.3V Dual Transceivers with Integrated Encoder / Decoders DESCRIPTION 11 12 13 14 15 16 17 18 19 20 1575PCI 1575PCT 26 - D3 25 - D4 28 - D1 27 - D2 30 - CLK 40 Pin Plastic 6mm x 6mm Chip-scale package 29 - D0 Activity on both MIL-STD-1553 data buses is continuously
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HI-1575
Abstract: MIL-STD-1553 hi1575 Biphase HI-1575PQI
Contextual Info: HI-1575 MIL-STD-1553 3.3V Dual Transceivers with Integrated Encoder / Decoders DESCRIPTION 11 12 13 14 15 16 17 18 19 20 1575PCI 1575PCT 26 - D3 25 - D4 28 - D1 27 - D2 30 - CLK 40 Pin Plastic 6mm x 6mm Chip-scale package 29 - D0 Activity on both MIL-STD-1553 data buses is continuously
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