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Catalog Datasheet	Type	Document Tags	PDF
nitto GE Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA Contextual Info: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,	Original	40PCS, 44PCS, 64PCS) GE-7470L-A PCN0806 JESD46-C, QR-8033 QFN-64 nitto GE G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA	PDF

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nitto GE

Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
Contextual Info: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,

Original

40PCS, 44PCS, 64PCS) GE-7470L-A PCN0806 JESD46-C, QR-8033 QFN-64 nitto GE G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA

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