HDM01 Search Results

hirelco

Abstract: QQ-W-343 MIL-W-22759 MIL-W-22759/11-24
Contextual Info: MICROMINIATURE – COTS MICRO-D CONNECTORS HDM01 THRU 04 – PRE-WIRED AND SOLDER CUP TERRMINATIONS HIRELCO PART NUMBER CODE HDM 0* - * * * * * * HIRELCO CONNECTOR SERIES FLANGE HARDWARE SIZES 9-51 USES #2-56, 100 USES #4-40 COMMERCIAL PERMANENT OPTIONS: A - .125 DIA. MTG. HOLES, FOR SIZE 9-51

Contextual Info: MICROMINIATURE – COTS MICRO-D CONNECTORS HDM01 THRU 04 – PRE-WIRED AND SOLDER CUP TERRMINATIONS HIRELCO PART NUMBER CODE HDM 0* - * * * * * * HIRELCO CONNECTOR SERIES FLANGE HARDWARE SIZES 9-51 USES #2-56, 100 USES #4-40 COMMERCIAL PERMANENT OPTIONS: A - .125 DIA. MTG. HOLES, FOR SIZE 9-51

Contextual Info: 1 I 2 I 3 | 4 | 5 | p I RevNo A 7 I Z J R evision n o t e D a te NEW RELEASE 03-0 1 -1 2 S ig n a tu r e C h e cke d A NOTES: 1 . MATERIAL: HOUSING: THERMOPLASTIC TERMINAL: PHOSPHOR BRONZE - SHELL: STAINLESS STEEL 2 . CONTACT PLATING: NICKEL UNDERPLATING OVER A LL

HA2164

Abstract: DSP56720 txauto WM9 datasheet samsung i2s AC97 DSP56300 DSP56300FM DSP56721 IEC958
Contextual Info: Symphony DSP56720/DSP56721 Multi-Core Audio Processors Reference Manual Document Number: DSP56720RM Rev. 1.1 2/2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370

Contextual Info: 1 2 1 3 5 U 1 6 _ 7_ _ 1 R evN o A R e v is io n 8 D a te n o te N E V R ELEASE S ig n a tu re C hecked 0 3 - 0 1 -1 2 NOTES: 1 . MATERIAL: HOUSING: THERMOPLASTIC TERMINAL: COPPER ALLOY, T = 0 . 2 0 m m SHELL: S K 7 , T = 0 .5 0 m m 013101314431060001

Contextual Info: RevNo A Revision no-te Date NEV RELEASE 03-01-12 Signature Checked NOTES: 1 . MATERIAL: HOUSING: THERMOPLASTIC TERMINAL: PHOSPHOR BRONZE, T = 0 . 2 0 m m No.19PIN- SHELL: BRASS, T = 0 . 5 0 m m 2 . CONTACT PLATING: 0 .5 ± 0 .1 0 PITCH NICKEL UNDERPLATING OVER ALL