HBGA420 Search Results

MS-034

Abstract: SOT603-1
Contextual Info: PDF: 2003 Mar 25 Philips Semiconductors Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink A B D SOT603-1 ball A1 index area A A2 A1 E A4 detail X C e1 e AF AD AB Y V T P M K H F D B f1 1/2 e

sot603

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline HBGA420: plastic, heatsink ball grid array package; 420 balls; body 35 x 35 x 0.9 mm B D SOT603-1 A ball A1 index area A2 E A1 A A3 detail X e1 b e C v M B ∅w M ZD1 y y1 C v M A AF AE AD AC AA W U R

Contextual Info: Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink A B D SOT603-1 ball A1 index area A A2 A1 E A4 detail X C e1 e AF AD AB Y V T P M K H F D B f1 1/2 e y1 C ∅v M C A B b y ∅w M C AE e AC

SOT701-1

Abstract: sot701 MS-034 HBGA420
Contextual Info: PDF: 2001 Nov 15 Philips Semiconductors Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 1.6 mm; heatsink A B D SOT701-1 ball A1 index area A A2 A1 E A4 detail X C e1 e f1 1/2 e ∅v M C A B b y y1 C ∅w M C