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    SOT603 Search Results

    SOT603 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT603-1
    NXP Semiconductors Plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink Original PDF 281.46KB 1

    SOT603 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MS-034

    Abstract: SOT603-1
    Contextual Info: PDF: 2003 Mar 25 Philips Semiconductors Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink A B D SOT603-1 ball A1 index area A A2 A1 E A4 detail X C e1 e AF AD AB Y V T P M K H F D B f1 1/2 e


    Original
    HBGA420: OT603-1 MS-034 MS-034 SOT603-1 PDF

    sot603

    Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline HBGA420: plastic, heatsink ball grid array package; 420 balls; body 35 x 35 x 0.9 mm B D SOT603-1 A ball A1 index area A2 E A1 A A3 detail X e1 b e C v M B ∅w M ZD1 y y1 C v M A AF AE AD AC AA W U R


    Original
    HBGA420: OT603-1 sot603 PDF

    Contextual Info: Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink A B D SOT603-1 ball A1 index area A A2 A1 E A4 detail X C e1 e AF AD AB Y V T P M K H F D B f1 1/2 e y1 C ∅v M C A B b y ∅w M C AE e AC


    Original
    HBGA420: OT603-1 MS-034 PDF